JPS498171A - - Google Patents

Info

Publication number
JPS498171A
JPS498171A JP47046155A JP4615572A JPS498171A JP S498171 A JPS498171 A JP S498171A JP 47046155 A JP47046155 A JP 47046155A JP 4615572 A JP4615572 A JP 4615572A JP S498171 A JPS498171 A JP S498171A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47046155A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47046155A priority Critical patent/JPS498171A/ja
Publication of JPS498171A publication Critical patent/JPS498171A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07552—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/527—Multiple bond wires having different sizes

Landscapes

  • Wire Bonding (AREA)
JP47046155A 1972-05-10 1972-05-10 Pending JPS498171A (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47046155A JPS498171A (en:Method) 1972-05-10 1972-05-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47046155A JPS498171A (en:Method) 1972-05-10 1972-05-10

Publications (1)

Publication Number Publication Date
JPS498171A true JPS498171A (en:Method) 1974-01-24

Family

ID=12739085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47046155A Pending JPS498171A (en:Method) 1972-05-10 1972-05-10

Country Status (1)

Country Link
JP (1) JPS498171A (en:Method)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5542698U (en:Method) * 1978-09-14 1980-03-19
JPS55114765U (en:Method) * 1979-02-09 1980-08-13
JPS58115842A (ja) * 1981-12-28 1983-07-09 Fujitsu Ltd 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5542698U (en:Method) * 1978-09-14 1980-03-19
JPS55114765U (en:Method) * 1979-02-09 1980-08-13
JPS58115842A (ja) * 1981-12-28 1983-07-09 Fujitsu Ltd 半導体装置

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