JPS4979684A - - Google Patents
Info
- Publication number
- JPS4979684A JPS4979684A JP12270272A JP12270272A JPS4979684A JP S4979684 A JPS4979684 A JP S4979684A JP 12270272 A JP12270272 A JP 12270272A JP 12270272 A JP12270272 A JP 12270272A JP S4979684 A JPS4979684 A JP S4979684A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3201—Structure
- H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
- H01L2224/32013—Structure relative to the bonding area, e.g. bond pad the layer connector being larger than the bonding area, e.g. bond pad
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Dicing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12270272A JPS4979684A (zh) | 1972-12-07 | 1972-12-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12270272A JPS4979684A (zh) | 1972-12-07 | 1972-12-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4979684A true JPS4979684A (zh) | 1974-08-01 |
Family
ID=14842485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12270272A Pending JPS4979684A (zh) | 1972-12-07 | 1972-12-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4979684A (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49105445A (zh) * | 1973-02-07 | 1974-10-05 | ||
JPS53101982A (en) * | 1977-02-18 | 1978-09-05 | Fujitsu Ltd | Picking-up method of semiconductor chips |
JPS53133568U (zh) * | 1977-03-30 | 1978-10-23 | ||
JPS5481066A (en) * | 1977-11-03 | 1979-06-28 | Gen Electric | Method of dividing wafer into pellets |
JPS5543853A (en) * | 1978-09-25 | 1980-03-27 | Hitachi Ltd | Dicing |
JPS5613744A (en) * | 1979-07-13 | 1981-02-10 | Fujitsu Ltd | Cutting method for wafer |
JPS57136341A (en) * | 1982-01-13 | 1982-08-23 | Hitachi Ltd | Removing method for part from sheet |
JPS5988844A (ja) * | 1982-11-12 | 1984-05-22 | Hitachi Tokyo Electronics Co Ltd | ピツクアツプ装置 |
JPS6063940A (ja) * | 1984-07-26 | 1985-04-12 | Sanken Electric Co Ltd | 半導体ペレツトのダイボンデイング方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4858771A (zh) * | 1971-11-22 | 1973-08-17 |
-
1972
- 1972-12-07 JP JP12270272A patent/JPS4979684A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4858771A (zh) * | 1971-11-22 | 1973-08-17 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49105445A (zh) * | 1973-02-07 | 1974-10-05 | ||
JPS53101982A (en) * | 1977-02-18 | 1978-09-05 | Fujitsu Ltd | Picking-up method of semiconductor chips |
JPS6127905B2 (zh) * | 1977-02-18 | 1986-06-27 | Fujitsu Ltd | |
JPS53133568U (zh) * | 1977-03-30 | 1978-10-23 | ||
JPS5481066A (en) * | 1977-11-03 | 1979-06-28 | Gen Electric | Method of dividing wafer into pellets |
JPS5543853A (en) * | 1978-09-25 | 1980-03-27 | Hitachi Ltd | Dicing |
JPS5613744A (en) * | 1979-07-13 | 1981-02-10 | Fujitsu Ltd | Cutting method for wafer |
JPS57136341A (en) * | 1982-01-13 | 1982-08-23 | Hitachi Ltd | Removing method for part from sheet |
JPS5988844A (ja) * | 1982-11-12 | 1984-05-22 | Hitachi Tokyo Electronics Co Ltd | ピツクアツプ装置 |
JPS6063940A (ja) * | 1984-07-26 | 1985-04-12 | Sanken Electric Co Ltd | 半導体ペレツトのダイボンデイング方法 |
JPH025013B2 (zh) * | 1984-07-26 | 1990-01-31 | Sanken Electric Co Ltd |