JPS4979684A - - Google Patents

Info

Publication number
JPS4979684A
JPS4979684A JP12270272A JP12270272A JPS4979684A JP S4979684 A JPS4979684 A JP S4979684A JP 12270272 A JP12270272 A JP 12270272A JP 12270272 A JP12270272 A JP 12270272A JP S4979684 A JPS4979684 A JP S4979684A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12270272A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12270272A priority Critical patent/JPS4979684A/ja
Publication of JPS4979684A publication Critical patent/JPS4979684A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors

Landscapes

  • Die Bonding (AREA)
  • Dicing (AREA)
JP12270272A 1972-12-07 1972-12-07 Pending JPS4979684A (mo)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12270272A JPS4979684A (mo) 1972-12-07 1972-12-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12270272A JPS4979684A (mo) 1972-12-07 1972-12-07

Publications (1)

Publication Number Publication Date
JPS4979684A true JPS4979684A (mo) 1974-08-01

Family

ID=14842485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12270272A Pending JPS4979684A (mo) 1972-12-07 1972-12-07

Country Status (1)

Country Link
JP (1) JPS4979684A (mo)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49105445A (mo) * 1973-02-07 1974-10-05
JPS53101982A (en) * 1977-02-18 1978-09-05 Fujitsu Ltd Picking-up method of semiconductor chips
JPS53133568U (mo) * 1977-03-30 1978-10-23
JPS5481066A (en) * 1977-11-03 1979-06-28 Gen Electric Method of dividing wafer into pellets
JPS5543853A (en) * 1978-09-25 1980-03-27 Hitachi Ltd Dicing
JPS5613744A (en) * 1979-07-13 1981-02-10 Fujitsu Ltd Cutting method for wafer
JPS57136341A (en) * 1982-01-13 1982-08-23 Hitachi Ltd Removing method for part from sheet
JPS5988844A (ja) * 1982-11-12 1984-05-22 Hitachi Tokyo Electronics Co Ltd ピツクアツプ装置
JPS6063940A (ja) * 1984-07-26 1985-04-12 Sanken Electric Co Ltd 半導体ペレツトのダイボンデイング方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4858771A (mo) * 1971-11-22 1973-08-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4858771A (mo) * 1971-11-22 1973-08-17

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49105445A (mo) * 1973-02-07 1974-10-05
JPS53101982A (en) * 1977-02-18 1978-09-05 Fujitsu Ltd Picking-up method of semiconductor chips
JPS53133568U (mo) * 1977-03-30 1978-10-23
JPS5481066A (en) * 1977-11-03 1979-06-28 Gen Electric Method of dividing wafer into pellets
JPS5543853A (en) * 1978-09-25 1980-03-27 Hitachi Ltd Dicing
JPS5613744A (en) * 1979-07-13 1981-02-10 Fujitsu Ltd Cutting method for wafer
JPS57136341A (en) * 1982-01-13 1982-08-23 Hitachi Ltd Removing method for part from sheet
JPS5988844A (ja) * 1982-11-12 1984-05-22 Hitachi Tokyo Electronics Co Ltd ピツクアツプ装置
JPS6063940A (ja) * 1984-07-26 1985-04-12 Sanken Electric Co Ltd 半導体ペレツトのダイボンデイング方法

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