JPS4966073A - - Google Patents
Info
- Publication number
- JPS4966073A JPS4966073A JP47107228A JP10722872A JPS4966073A JP S4966073 A JPS4966073 A JP S4966073A JP 47107228 A JP47107228 A JP 47107228A JP 10722872 A JP10722872 A JP 10722872A JP S4966073 A JPS4966073 A JP S4966073A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47107228A JPS4966073A (enExample) | 1972-10-27 | 1972-10-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47107228A JPS4966073A (enExample) | 1972-10-27 | 1972-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4966073A true JPS4966073A (enExample) | 1974-06-26 |
Family
ID=14453723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47107228A Pending JPS4966073A (enExample) | 1972-10-27 | 1972-10-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4966073A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53106672U (enExample) * | 1977-02-01 | 1978-08-26 | ||
| JPS568857A (en) * | 1980-06-23 | 1981-01-29 | Hitachi Ltd | Resin sealing type semiconductor device |
| JPS568858A (en) * | 1980-06-23 | 1981-01-29 | Hitachi Ltd | Resin sealing type semiconductor device |
| JPS5637775A (en) * | 1979-09-04 | 1981-04-11 | Matsushita Electric Ind Co Ltd | Solid state image pickup device |
| JPH04219964A (ja) * | 1990-12-20 | 1992-08-11 | Kawasaki Steel Corp | 集積回路 |
| JP2025527352A (ja) * | 2022-08-18 | 2025-08-20 | ヒタチ・エナジー・リミテッド | 半導体パワーモジュールおよび半導体パワーモジュールを製造するための方法 |
-
1972
- 1972-10-27 JP JP47107228A patent/JPS4966073A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53106672U (enExample) * | 1977-02-01 | 1978-08-26 | ||
| JPS5637775A (en) * | 1979-09-04 | 1981-04-11 | Matsushita Electric Ind Co Ltd | Solid state image pickup device |
| JPS568857A (en) * | 1980-06-23 | 1981-01-29 | Hitachi Ltd | Resin sealing type semiconductor device |
| JPS568858A (en) * | 1980-06-23 | 1981-01-29 | Hitachi Ltd | Resin sealing type semiconductor device |
| JPH04219964A (ja) * | 1990-12-20 | 1992-08-11 | Kawasaki Steel Corp | 集積回路 |
| JP2025527352A (ja) * | 2022-08-18 | 2025-08-20 | ヒタチ・エナジー・リミテッド | 半導体パワーモジュールおよび半導体パワーモジュールを製造するための方法 |