JPS4966073A - - Google Patents

Info

Publication number
JPS4966073A
JPS4966073A JP10722872A JP10722872A JPS4966073A JP S4966073 A JPS4966073 A JP S4966073A JP 10722872 A JP10722872 A JP 10722872A JP 10722872 A JP10722872 A JP 10722872A JP S4966073 A JPS4966073 A JP S4966073A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10722872A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10722872A priority Critical patent/JPS4966073A/ja
Publication of JPS4966073A publication Critical patent/JPS4966073A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP10722872A 1972-10-27 1972-10-27 Pending JPS4966073A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10722872A JPS4966073A (ja) 1972-10-27 1972-10-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10722872A JPS4966073A (ja) 1972-10-27 1972-10-27

Publications (1)

Publication Number Publication Date
JPS4966073A true JPS4966073A (ja) 1974-06-26

Family

ID=14453723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10722872A Pending JPS4966073A (ja) 1972-10-27 1972-10-27

Country Status (1)

Country Link
JP (1) JPS4966073A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53106672U (ja) * 1977-02-01 1978-08-26
JPS568858A (en) * 1980-06-23 1981-01-29 Hitachi Ltd Resin sealing type semiconductor device
JPS568857A (en) * 1980-06-23 1981-01-29 Hitachi Ltd Resin sealing type semiconductor device
JPS5637775A (en) * 1979-09-04 1981-04-11 Matsushita Electric Ind Co Ltd Solid state image pickup device
JPH04219964A (ja) * 1990-12-20 1992-08-11 Kawasaki Steel Corp 集積回路

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53106672U (ja) * 1977-02-01 1978-08-26
JPS5637775A (en) * 1979-09-04 1981-04-11 Matsushita Electric Ind Co Ltd Solid state image pickup device
JPS568858A (en) * 1980-06-23 1981-01-29 Hitachi Ltd Resin sealing type semiconductor device
JPS568857A (en) * 1980-06-23 1981-01-29 Hitachi Ltd Resin sealing type semiconductor device
JPS5751265B2 (ja) * 1980-06-23 1982-11-01
JPH04219964A (ja) * 1990-12-20 1992-08-11 Kawasaki Steel Corp 集積回路

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