JPS4957371A - - Google Patents
Info
- Publication number
- JPS4957371A JPS4957371A JP9906472A JP9906472A JPS4957371A JP S4957371 A JPS4957371 A JP S4957371A JP 9906472 A JP9906472 A JP 9906472A JP 9906472 A JP9906472 A JP 9906472A JP S4957371 A JPS4957371 A JP S4957371A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9906472A JPS4957371A (es) | 1972-10-04 | 1972-10-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9906472A JPS4957371A (es) | 1972-10-04 | 1972-10-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4957371A true JPS4957371A (es) | 1974-06-04 |
Family
ID=14237337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9906472A Pending JPS4957371A (es) | 1972-10-04 | 1972-10-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4957371A (es) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5219076A (en) * | 1975-08-05 | 1977-01-14 | Fujitsu Ltd | Production method of semiconductor package |
| JPS63200593A (ja) * | 1987-02-17 | 1988-08-18 | 株式会社日立製作所 | プリント回路板の製造方法 |
| JPH01224288A (ja) * | 1988-03-03 | 1989-09-07 | Toshiba Corp | めっきを施したセラミックス部品 |
| JPH02240271A (ja) * | 1989-03-14 | 1990-09-25 | C Uyemura & Co Ltd | パラジウム活性化剤及び無電解めっき方法 |
| JPH0610146A (ja) * | 1992-04-06 | 1994-01-18 | Internatl Business Mach Corp <Ibm> | 触媒活性の非常に高いプラチナ金属層を得る方法 |
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1972
- 1972-10-04 JP JP9906472A patent/JPS4957371A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5219076A (en) * | 1975-08-05 | 1977-01-14 | Fujitsu Ltd | Production method of semiconductor package |
| JPS5731296B2 (es) * | 1975-08-05 | 1982-07-03 | ||
| JPS63200593A (ja) * | 1987-02-17 | 1988-08-18 | 株式会社日立製作所 | プリント回路板の製造方法 |
| JPH01224288A (ja) * | 1988-03-03 | 1989-09-07 | Toshiba Corp | めっきを施したセラミックス部品 |
| JPH02240271A (ja) * | 1989-03-14 | 1990-09-25 | C Uyemura & Co Ltd | パラジウム活性化剤及び無電解めっき方法 |
| JPH0610146A (ja) * | 1992-04-06 | 1994-01-18 | Internatl Business Mach Corp <Ibm> | 触媒活性の非常に高いプラチナ金属層を得る方法 |