JPS4947567U - - Google Patents

Info

Publication number
JPS4947567U
JPS4947567U JP9146972U JP9146972U JPS4947567U JP S4947567 U JPS4947567 U JP S4947567U JP 9146972 U JP9146972 U JP 9146972U JP 9146972 U JP9146972 U JP 9146972U JP S4947567 U JPS4947567 U JP S4947567U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9146972U
Other languages
Japanese (ja)
Other versions
JPS5238915Y2 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9146972U priority Critical patent/JPS5238915Y2/ja
Publication of JPS4947567U publication Critical patent/JPS4947567U/ja
Application granted granted Critical
Publication of JPS5238915Y2 publication Critical patent/JPS5238915Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP9146972U 1972-08-02 1972-08-02 Expired JPS5238915Y2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9146972U JPS5238915Y2 (ko) 1972-08-02 1972-08-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9146972U JPS5238915Y2 (ko) 1972-08-02 1972-08-02

Publications (2)

Publication Number Publication Date
JPS4947567U true JPS4947567U (ko) 1974-04-25
JPS5238915Y2 JPS5238915Y2 (ko) 1977-09-03

Family

ID=28280512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9146972U Expired JPS5238915Y2 (ko) 1972-08-02 1972-08-02

Country Status (1)

Country Link
JP (1) JPS5238915Y2 (ko)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5277376U (ko) * 1975-12-09 1977-06-09
JPS57140747U (ko) * 1981-02-27 1982-09-03
JPS5956751A (ja) * 1983-08-26 1984-04-02 Hitachi Ltd 半導体装置
JPS6173355A (ja) * 1984-09-19 1986-04-15 Hitachi Ltd 半導体装置
ITMI20111216A1 (it) * 2011-06-30 2012-12-31 St Microelectronics Srl Dispositivo elettronico di potenza ad elevata dissipazione di calore e stabilita?
US8723311B2 (en) 2011-06-30 2014-05-13 Stmicroelectronics S.R.L. Half-bridge electronic device with common heat sink on mounting surface
US8755188B2 (en) 2011-06-30 2014-06-17 Stmicroelectronics S.R.L. Half-bridge electronic device with common auxiliary heat sink
US8817475B2 (en) 2011-06-30 2014-08-26 Stmicroelectronics S.R.L. System with shared heatsink
US8837154B2 (en) 2011-06-30 2014-09-16 Stmicroelectronics S.R.L. System with stabilized heatsink
US9105598B2 (en) 2011-06-30 2015-08-11 Stmicroelectronics S.R.L. Package/heatsink system for electronic device
US9275943B2 (en) 2011-06-30 2016-03-01 Stmicroelectronics S.R.L. Power device having reduced thickness

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5277376U (ko) * 1975-12-09 1977-06-09
JPS57140747U (ko) * 1981-02-27 1982-09-03
JPS5956751A (ja) * 1983-08-26 1984-04-02 Hitachi Ltd 半導体装置
JPS6173355A (ja) * 1984-09-19 1986-04-15 Hitachi Ltd 半導体装置
ITMI20111216A1 (it) * 2011-06-30 2012-12-31 St Microelectronics Srl Dispositivo elettronico di potenza ad elevata dissipazione di calore e stabilita?
US8723311B2 (en) 2011-06-30 2014-05-13 Stmicroelectronics S.R.L. Half-bridge electronic device with common heat sink on mounting surface
US8755188B2 (en) 2011-06-30 2014-06-17 Stmicroelectronics S.R.L. Half-bridge electronic device with common auxiliary heat sink
US8817475B2 (en) 2011-06-30 2014-08-26 Stmicroelectronics S.R.L. System with shared heatsink
US8837153B2 (en) 2011-06-30 2014-09-16 Stmicroelectronics S.R.L. Power electronic device having high heat dissipation and stability
US8837154B2 (en) 2011-06-30 2014-09-16 Stmicroelectronics S.R.L. System with stabilized heatsink
US9105598B2 (en) 2011-06-30 2015-08-11 Stmicroelectronics S.R.L. Package/heatsink system for electronic device
US9275943B2 (en) 2011-06-30 2016-03-01 Stmicroelectronics S.R.L. Power device having reduced thickness
US9786516B2 (en) 2011-06-30 2017-10-10 Stmicroelectronics S.R.L. Power device having reduced thickness

Also Published As

Publication number Publication date
JPS5238915Y2 (ko) 1977-09-03

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