JPS4947567U - - Google Patents
Info
- Publication number
- JPS4947567U JPS4947567U JP9146972U JP9146972U JPS4947567U JP S4947567 U JPS4947567 U JP S4947567U JP 9146972 U JP9146972 U JP 9146972U JP 9146972 U JP9146972 U JP 9146972U JP S4947567 U JPS4947567 U JP S4947567U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/5449—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9146972U JPS5238915Y2 (cg-RX-API-DMAC10.html) | 1972-08-02 | 1972-08-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9146972U JPS5238915Y2 (cg-RX-API-DMAC10.html) | 1972-08-02 | 1972-08-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4947567U true JPS4947567U (cg-RX-API-DMAC10.html) | 1974-04-25 |
| JPS5238915Y2 JPS5238915Y2 (cg-RX-API-DMAC10.html) | 1977-09-03 |
Family
ID=28280512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9146972U Expired JPS5238915Y2 (cg-RX-API-DMAC10.html) | 1972-08-02 | 1972-08-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5238915Y2 (cg-RX-API-DMAC10.html) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5277376U (cg-RX-API-DMAC10.html) * | 1975-12-09 | 1977-06-09 | ||
| JPS57140747U (cg-RX-API-DMAC10.html) * | 1981-02-27 | 1982-09-03 | ||
| JPS5956751A (ja) * | 1983-08-26 | 1984-04-02 | Hitachi Ltd | 半導体装置 |
| JPS6173355A (ja) * | 1984-09-19 | 1986-04-15 | Hitachi Ltd | 半導体装置 |
| ITMI20111216A1 (it) * | 2011-06-30 | 2012-12-31 | St Microelectronics Srl | Dispositivo elettronico di potenza ad elevata dissipazione di calore e stabilita? |
| US8723311B2 (en) | 2011-06-30 | 2014-05-13 | Stmicroelectronics S.R.L. | Half-bridge electronic device with common heat sink on mounting surface |
| US8755188B2 (en) | 2011-06-30 | 2014-06-17 | Stmicroelectronics S.R.L. | Half-bridge electronic device with common auxiliary heat sink |
| US8817475B2 (en) | 2011-06-30 | 2014-08-26 | Stmicroelectronics S.R.L. | System with shared heatsink |
| US8837154B2 (en) | 2011-06-30 | 2014-09-16 | Stmicroelectronics S.R.L. | System with stabilized heatsink |
| US9105598B2 (en) | 2011-06-30 | 2015-08-11 | Stmicroelectronics S.R.L. | Package/heatsink system for electronic device |
| US9275943B2 (en) | 2011-06-30 | 2016-03-01 | Stmicroelectronics S.R.L. | Power device having reduced thickness |
-
1972
- 1972-08-02 JP JP9146972U patent/JPS5238915Y2/ja not_active Expired
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5277376U (cg-RX-API-DMAC10.html) * | 1975-12-09 | 1977-06-09 | ||
| JPS57140747U (cg-RX-API-DMAC10.html) * | 1981-02-27 | 1982-09-03 | ||
| JPS5956751A (ja) * | 1983-08-26 | 1984-04-02 | Hitachi Ltd | 半導体装置 |
| JPS6173355A (ja) * | 1984-09-19 | 1986-04-15 | Hitachi Ltd | 半導体装置 |
| ITMI20111216A1 (it) * | 2011-06-30 | 2012-12-31 | St Microelectronics Srl | Dispositivo elettronico di potenza ad elevata dissipazione di calore e stabilita? |
| US8723311B2 (en) | 2011-06-30 | 2014-05-13 | Stmicroelectronics S.R.L. | Half-bridge electronic device with common heat sink on mounting surface |
| US8755188B2 (en) | 2011-06-30 | 2014-06-17 | Stmicroelectronics S.R.L. | Half-bridge electronic device with common auxiliary heat sink |
| US8817475B2 (en) | 2011-06-30 | 2014-08-26 | Stmicroelectronics S.R.L. | System with shared heatsink |
| US8837153B2 (en) | 2011-06-30 | 2014-09-16 | Stmicroelectronics S.R.L. | Power electronic device having high heat dissipation and stability |
| US8837154B2 (en) | 2011-06-30 | 2014-09-16 | Stmicroelectronics S.R.L. | System with stabilized heatsink |
| US9105598B2 (en) | 2011-06-30 | 2015-08-11 | Stmicroelectronics S.R.L. | Package/heatsink system for electronic device |
| US9275943B2 (en) | 2011-06-30 | 2016-03-01 | Stmicroelectronics S.R.L. | Power device having reduced thickness |
| US9786516B2 (en) | 2011-06-30 | 2017-10-10 | Stmicroelectronics S.R.L. | Power device having reduced thickness |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5238915Y2 (cg-RX-API-DMAC10.html) | 1977-09-03 |