JPS4946378A - - Google Patents

Info

Publication number
JPS4946378A
JPS4946378A JP8934072A JP8934072A JPS4946378A JP S4946378 A JPS4946378 A JP S4946378A JP 8934072 A JP8934072 A JP 8934072A JP 8934072 A JP8934072 A JP 8934072A JP S4946378 A JPS4946378 A JP S4946378A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8934072A
Other languages
Japanese (ja)
Other versions
JPS5729849B2 (xx
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8934072A priority Critical patent/JPS5729849B2/ja
Publication of JPS4946378A publication Critical patent/JPS4946378A/ja
Publication of JPS5729849B2 publication Critical patent/JPS5729849B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP8934072A 1972-09-05 1972-09-05 Expired JPS5729849B2 (xx)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8934072A JPS5729849B2 (xx) 1972-09-05 1972-09-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8934072A JPS5729849B2 (xx) 1972-09-05 1972-09-05

Publications (2)

Publication Number Publication Date
JPS4946378A true JPS4946378A (xx) 1974-05-02
JPS5729849B2 JPS5729849B2 (xx) 1982-06-25

Family

ID=13967950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8934072A Expired JPS5729849B2 (xx) 1972-09-05 1972-09-05

Country Status (1)

Country Link
JP (1) JPS5729849B2 (xx)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5173576A (ja) * 1974-12-24 1976-06-25 Mitsubishi Plastics Ind Fushukogaikanojusuru purasuchitsukusekisokinzokuban
JPS5250385A (en) * 1975-10-20 1977-04-22 Yoshihito Tsumura Process for producing coated metal plaes
JPS56110660U (xx) * 1980-12-23 1981-08-27
JPS59193039A (ja) * 1983-04-15 1984-11-01 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPH03173459A (ja) * 1989-12-01 1991-07-26 Fujitsu Ltd 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4854869A (xx) * 1971-11-09 1973-08-01

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4854869A (xx) * 1971-11-09 1973-08-01

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5173576A (ja) * 1974-12-24 1976-06-25 Mitsubishi Plastics Ind Fushukogaikanojusuru purasuchitsukusekisokinzokuban
JPS5950512B2 (ja) * 1974-12-24 1984-12-08 三菱樹脂株式会社 不銹鋼外観を有するプラスチツク積層金属板
JPS5250385A (en) * 1975-10-20 1977-04-22 Yoshihito Tsumura Process for producing coated metal plaes
JPS5628711B2 (xx) * 1975-10-20 1981-07-03
JPS56110660U (xx) * 1980-12-23 1981-08-27
JPS59193039A (ja) * 1983-04-15 1984-11-01 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPH03173459A (ja) * 1989-12-01 1991-07-26 Fujitsu Ltd 半導体装置

Also Published As

Publication number Publication date
JPS5729849B2 (xx) 1982-06-25

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