JPS4946378A - - Google Patents

Info

Publication number
JPS4946378A
JPS4946378A JP8934072A JP8934072A JPS4946378A JP S4946378 A JPS4946378 A JP S4946378A JP 8934072 A JP8934072 A JP 8934072A JP 8934072 A JP8934072 A JP 8934072A JP S4946378 A JPS4946378 A JP S4946378A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8934072A
Other languages
Japanese (ja)
Other versions
JPS5729849B2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8934072A priority Critical patent/JPS5729849B2/ja
Publication of JPS4946378A publication Critical patent/JPS4946378A/ja
Publication of JPS5729849B2 publication Critical patent/JPS5729849B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP8934072A 1972-09-05 1972-09-05 Expired JPS5729849B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8934072A JPS5729849B2 (enrdf_load_stackoverflow) 1972-09-05 1972-09-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8934072A JPS5729849B2 (enrdf_load_stackoverflow) 1972-09-05 1972-09-05

Publications (2)

Publication Number Publication Date
JPS4946378A true JPS4946378A (enrdf_load_stackoverflow) 1974-05-02
JPS5729849B2 JPS5729849B2 (enrdf_load_stackoverflow) 1982-06-25

Family

ID=13967950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8934072A Expired JPS5729849B2 (enrdf_load_stackoverflow) 1972-09-05 1972-09-05

Country Status (1)

Country Link
JP (1) JPS5729849B2 (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5173576A (ja) * 1974-12-24 1976-06-25 Mitsubishi Plastics Ind Fushukogaikanojusuru purasuchitsukusekisokinzokuban
JPS5250385A (en) * 1975-10-20 1977-04-22 Yoshihito Tsumura Process for producing coated metal plaes
JPS56110660U (enrdf_load_stackoverflow) * 1980-12-23 1981-08-27
JPS59193039A (ja) * 1983-04-15 1984-11-01 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPH03173459A (ja) * 1989-12-01 1991-07-26 Fujitsu Ltd 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4854869A (enrdf_load_stackoverflow) * 1971-11-09 1973-08-01

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4854869A (enrdf_load_stackoverflow) * 1971-11-09 1973-08-01

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5173576A (ja) * 1974-12-24 1976-06-25 Mitsubishi Plastics Ind Fushukogaikanojusuru purasuchitsukusekisokinzokuban
JPS5250385A (en) * 1975-10-20 1977-04-22 Yoshihito Tsumura Process for producing coated metal plaes
JPS56110660U (enrdf_load_stackoverflow) * 1980-12-23 1981-08-27
JPS59193039A (ja) * 1983-04-15 1984-11-01 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPH03173459A (ja) * 1989-12-01 1991-07-26 Fujitsu Ltd 半導体装置

Also Published As

Publication number Publication date
JPS5729849B2 (enrdf_load_stackoverflow) 1982-06-25

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