JPS4943576A - - Google Patents
Info
- Publication number
- JPS4943576A JPS4943576A JP5370873A JP5370873A JPS4943576A JP S4943576 A JPS4943576 A JP S4943576A JP 5370873 A JP5370873 A JP 5370873A JP 5370873 A JP5370873 A JP 5370873A JP S4943576 A JPS4943576 A JP S4943576A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
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- H10P72/7402—
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- H10P95/00—
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- H10W72/013—
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- H10W72/30—
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- H10P72/7416—
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- H10W70/682—
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- H10W70/685—
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- H10W72/073—
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- H10W72/07336—
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- H10W72/07355—
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- H10W72/075—
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- H10W72/07504—
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- H10W72/07532—
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- H10W72/07533—
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- H10W72/3524—
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- H10W72/5363—
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- H10W72/884—
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- H10W90/734—
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- H10W90/754—
Landscapes
- Die Bonding (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US25517072A | 1972-05-19 | 1972-05-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4943576A true JPS4943576A (Direct) | 1974-04-24 |
| JPS5149551B2 JPS5149551B2 (Direct) | 1976-12-27 |
Family
ID=22967151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5370873A Expired JPS5149551B2 (Direct) | 1972-05-19 | 1973-05-16 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US3785892A (Direct) |
| JP (1) | JPS5149551B2 (Direct) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01203484A (ja) * | 1988-02-09 | 1989-08-16 | Hagoromo Bungu Kk | チョーク |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4094677A (en) * | 1973-12-28 | 1978-06-13 | Texas Instruments Incorporated | Chemical fabrication of overhanging ledges and reflection gratings for surface wave devices |
| FR2360993A1 (fr) * | 1976-08-03 | 1978-03-03 | Lignes Telegraph Telephon | Perfectionnement aux procedes de fabrication de diodes schottky a barriere or-silicium |
| JPH0722141B2 (ja) * | 1984-03-07 | 1995-03-08 | 住友電気工業株式会社 | 半導体素子の製造方法 |
| US4765865A (en) * | 1987-05-04 | 1988-08-23 | Ford Motor Company | Silicon etch rate enhancement |
| US5046656A (en) * | 1988-09-12 | 1991-09-10 | Regents Of The University Of California | Vacuum die attach for integrated circuits |
| TW365057B (en) * | 1997-12-31 | 1999-07-21 | Ind Tech Res Inst | Manufacturing method for micro-mirror on the silicon substrate |
| US20070231954A1 (en) * | 2006-03-31 | 2007-10-04 | Kai Liu | Gold/silicon eutectic die bonding method |
| US7659191B2 (en) * | 2006-11-27 | 2010-02-09 | Alpha And Omega Semiconductor Incorporated | Gold/silicon eutectic die bonding method |
| US11387373B2 (en) * | 2019-07-29 | 2022-07-12 | Nxp Usa, Inc. | Low drain-source on resistance semiconductor component and method of fabrication |
| RU2737722C1 (ru) * | 2020-04-03 | 2020-12-02 | Акционерное общество "ГРУППА КРЕМНИЙ ЭЛ" | Способ изготовления полупроводникового прибора |
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1972
- 1972-05-19 US US00255170A patent/US3785892A/en not_active Expired - Lifetime
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1973
- 1973-05-16 JP JP5370873A patent/JPS5149551B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01203484A (ja) * | 1988-02-09 | 1989-08-16 | Hagoromo Bungu Kk | チョーク |
Also Published As
| Publication number | Publication date |
|---|---|
| US3785892A (en) | 1974-01-15 |
| JPS5149551B2 (Direct) | 1976-12-27 |