JPS4941242B1 - - Google Patents

Info

Publication number
JPS4941242B1
JPS4941242B1 JP45093904A JP9390470A JPS4941242B1 JP S4941242 B1 JPS4941242 B1 JP S4941242B1 JP 45093904 A JP45093904 A JP 45093904A JP 9390470 A JP9390470 A JP 9390470A JP S4941242 B1 JPS4941242 B1 JP S4941242B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45093904A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4941242B1 publication Critical patent/JPS4941242B1/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C7/00Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
    • C25C7/06Operating or servicing
    • C25C7/08Separating of deposited metals from the cathode

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Manufacture And Refinement Of Metals (AREA)
JP45093904A 1969-10-25 1970-10-24 Pending JPS4941242B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES372891A ES372891A1 (es) 1969-10-25 1969-10-25 Procedimiento hidraulico y dispositivo para arrancar el cinc depositado sore los catodos en la obtencion electroli- tica del mismo.

Publications (1)

Publication Number Publication Date
JPS4941242B1 true JPS4941242B1 (fr) 1974-11-08

Family

ID=8454169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45093904A Pending JPS4941242B1 (fr) 1969-10-25 1970-10-24

Country Status (20)

Country Link
US (1) US3724471A (fr)
JP (1) JPS4941242B1 (fr)
AT (1) AT302674B (fr)
BE (1) BE757899A (fr)
BG (1) BG20619A3 (fr)
CS (1) CS161890B2 (fr)
ES (1) ES372891A1 (fr)
FI (1) FI51213C (fr)
FR (1) FR2065522B1 (fr)
GB (1) GB1330690A (fr)
HU (1) HU169017B (fr)
IE (1) IE34622B1 (fr)
NL (1) NL7015575A (fr)
NO (1) NO126033B (fr)
PL (1) PL81163B1 (fr)
RO (1) RO59629A (fr)
SE (1) SE362266B (fr)
SU (1) SU473367A3 (fr)
TR (1) TR16707A (fr)
ZA (1) ZA707252B (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3953312A (en) * 1972-04-19 1976-04-27 Mitsui Mining & Smelting Co., Ltd. Apparatus for peeling electrodeposited metal off cathode base plate
US9221081B1 (en) 2011-08-01 2015-12-29 Novellus Systems, Inc. Automated cleaning of wafer plating assembly
US9228270B2 (en) 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
US10066311B2 (en) 2011-08-15 2018-09-04 Lam Research Corporation Multi-contact lipseals and associated electroplating methods
US9988734B2 (en) 2011-08-15 2018-06-05 Lam Research Corporation Lipseals and contact elements for semiconductor electroplating apparatuses
SG11201406133WA (en) * 2012-03-28 2014-10-30 Novellus Systems Inc Methods and apparatuses for cleaning electroplating substrate holders
TWI609100B (zh) 2012-03-30 2017-12-21 諾發系統有限公司 使用反向電流除鍍以清洗電鍍基板夾持具
CN102660758B (zh) * 2012-06-07 2014-07-30 北矿机电科技有限责任公司 阴极板锌片冲击式预开口装置
US10416092B2 (en) 2013-02-15 2019-09-17 Lam Research Corporation Remote detection of plating on wafer holding apparatus
US9746427B2 (en) 2013-02-15 2017-08-29 Novellus Systems, Inc. Detection of plating on wafer holding apparatus
US10053793B2 (en) 2015-07-09 2018-08-21 Lam Research Corporation Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
CN111101154B (zh) * 2020-01-10 2021-09-07 郑益丽 一种电解锌板脱离锌装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU128616A1 (ru) * 1959-08-17 1959-11-30 А.П. Поликарпов Способ сн ти катодного цинка и других металлов с основных катодов
US3501385A (en) * 1967-05-08 1970-03-17 Bunker Hill Co Process for stripping metal from a cathode
US3472249A (en) * 1968-02-21 1969-10-14 Bunker Hill Co Hydraulic cathode stripper for metals electrolytically deposited

Also Published As

Publication number Publication date
AT302674B (de) 1972-10-25
PL81163B1 (fr) 1975-08-30
SE362266B (fr) 1973-12-03
FI51213B (fr) 1976-08-02
ES372891A1 (es) 1971-11-16
NL7015575A (fr) 1971-04-27
US3724471A (en) 1973-04-03
SU473367A3 (ru) 1975-06-05
NO126033B (fr) 1972-12-11
ZA707252B (en) 1971-10-27
GB1330690A (en) 1973-09-19
TR16707A (tr) 1973-03-01
IE34622B1 (en) 1975-06-25
FI51213C (fi) 1976-11-10
HU169017B (fr) 1976-09-28
FR2065522B1 (fr) 1973-11-23
DE2051912A1 (de) 1971-05-06
FR2065522A1 (fr) 1971-07-30
BG20619A3 (fr) 1975-12-05
IE34622L (en) 1971-04-25
CS161890B2 (fr) 1975-06-10
RO59629A (fr) 1976-06-15
BE757899A (fr) 1971-04-01
DE2051912B2 (de) 1972-07-13

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