JPS494057A - - Google Patents
Info
- Publication number
- JPS494057A JPS494057A JP4503272A JP4503272A JPS494057A JP S494057 A JPS494057 A JP S494057A JP 4503272 A JP4503272 A JP 4503272A JP 4503272 A JP4503272 A JP 4503272A JP S494057 A JPS494057 A JP S494057A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4503272A JPS494057A (ro) | 1972-05-09 | 1972-05-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4503272A JPS494057A (ro) | 1972-05-09 | 1972-05-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS494057A true JPS494057A (ro) | 1974-01-14 |
Family
ID=12707984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4503272A Pending JPS494057A (ro) | 1972-05-09 | 1972-05-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS494057A (ro) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS501040A (ro) * | 1973-03-14 | 1975-01-08 | ||
US4278702A (en) * | 1979-09-25 | 1981-07-14 | Anthony J. Casella | Method of making printed circuit board by induction heating of the conductive metal particles on a plastic substrate |
JPS57115894A (en) * | 1981-01-08 | 1982-07-19 | Matsushita Electric Ind Co Ltd | Printed circuit board |
JPS57208002A (en) * | 1981-06-18 | 1982-12-21 | Shinetsu Polymer Co | Thermal pressure conductive composition |
US4388346A (en) * | 1981-11-25 | 1983-06-14 | Beggs James M Administrator Of | Electrodes for solid state devices |
JPS58121504A (ja) * | 1982-01-12 | 1983-07-19 | 東芝ケミカル株式会社 | 導電性ペ−スト |
US4959008A (en) * | 1984-04-30 | 1990-09-25 | National Starch And Chemical Investment Holding Corporation | Pre-patterned circuit board device-attach adhesive transfer system |
US5340617A (en) * | 1992-08-18 | 1994-08-23 | International Business Machines Corporation | Electrostatic patterning of multi-layer module lamina |
JPH0727178U (ja) * | 1993-10-15 | 1995-05-19 | 株式会社三協精機製作所 | 回路基板 |
JP2011510242A (ja) | 2008-01-24 | 2011-03-31 | アキュメント ゲーエムベーハー ウント コー オーハーゲー | ねじ込みインサートおよび車両用部品 |
-
1972
- 1972-05-09 JP JP4503272A patent/JPS494057A/ja active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS501040A (ro) * | 1973-03-14 | 1975-01-08 | ||
JPS5721085B2 (ro) * | 1973-03-14 | 1982-05-04 | ||
US4278702A (en) * | 1979-09-25 | 1981-07-14 | Anthony J. Casella | Method of making printed circuit board by induction heating of the conductive metal particles on a plastic substrate |
JPS57115894A (en) * | 1981-01-08 | 1982-07-19 | Matsushita Electric Ind Co Ltd | Printed circuit board |
JPS57208002A (en) * | 1981-06-18 | 1982-12-21 | Shinetsu Polymer Co | Thermal pressure conductive composition |
US4388346A (en) * | 1981-11-25 | 1983-06-14 | Beggs James M Administrator Of | Electrodes for solid state devices |
JPS58121504A (ja) * | 1982-01-12 | 1983-07-19 | 東芝ケミカル株式会社 | 導電性ペ−スト |
US4959008A (en) * | 1984-04-30 | 1990-09-25 | National Starch And Chemical Investment Holding Corporation | Pre-patterned circuit board device-attach adhesive transfer system |
US5340617A (en) * | 1992-08-18 | 1994-08-23 | International Business Machines Corporation | Electrostatic patterning of multi-layer module lamina |
JPH0727178U (ja) * | 1993-10-15 | 1995-05-19 | 株式会社三協精機製作所 | 回路基板 |
JP2011510242A (ja) | 2008-01-24 | 2011-03-31 | アキュメント ゲーエムベーハー ウント コー オーハーゲー | ねじ込みインサートおよび車両用部品 |