JPS4939873B1 - - Google Patents
Info
- Publication number
- JPS4939873B1 JPS4939873B1 JP44081843A JP8184369A JPS4939873B1 JP S4939873 B1 JPS4939873 B1 JP S4939873B1 JP 44081843 A JP44081843 A JP 44081843A JP 8184369 A JP8184369 A JP 8184369A JP S4939873 B1 JPS4939873 B1 JP S4939873B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/043—Dual dielectric
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/051—Etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/053—Field effect transistors fets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/106—Masks, special
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/944—Shadow
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Weting (AREA)
- Formation Of Insulating Films (AREA)
- Local Oxidation Of Silicon (AREA)
- ing And Chemical Polishing (AREA)
- Electrodes Of Semiconductors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Bipolar Transistors (AREA)
- Electron Beam Exposure (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP44081843A JPS4939873B1 (ja) | 1969-10-15 | 1969-10-15 | |
US24168A US3690966A (en) | 1969-10-15 | 1970-03-31 | Method of manufacturing microstructures |
GB1979170A GB1311684A (en) | 1969-10-15 | 1970-04-24 | Method of manufacturing micro-circuit structures |
DE2024822A DE2024822C3 (de) | 1969-10-15 | 1970-05-21 | Verfahren zur Erzeugung von Masken für die Herstellung von Mikrobauelementen |
NL707007474A NL140365B (nl) | 1969-10-15 | 1970-05-22 | Werkwijze voor het vervaardigen van een elektronische microstructuur. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP44081843A JPS4939873B1 (ja) | 1969-10-15 | 1969-10-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4939873B1 true JPS4939873B1 (ja) | 1974-10-29 |
Family
ID=13757738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP44081843A Pending JPS4939873B1 (ja) | 1969-10-15 | 1969-10-15 |
Country Status (5)
Country | Link |
---|---|
US (1) | US3690966A (ja) |
JP (1) | JPS4939873B1 (ja) |
DE (1) | DE2024822C3 (ja) |
GB (1) | GB1311684A (ja) |
NL (1) | NL140365B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3747202A (en) * | 1971-11-22 | 1973-07-24 | Honeywell Inf Systems | Method of making beam leads on substrates |
US3775262A (en) * | 1972-02-09 | 1973-11-27 | Ncr | Method of making insulated gate field effect transistor |
US3926694A (en) * | 1972-07-24 | 1975-12-16 | Signetics Corp | Double diffused metal oxide semiconductor structure with isolated source and drain and method |
JPS5024084A (ja) * | 1973-07-05 | 1975-03-14 | ||
DE3015356A1 (de) * | 1980-04-22 | 1981-10-29 | Robert Bosch Gmbh, 7000 Stuttgart | Freitragende schichten sowie verfahren zur herstellung freitragender schichten, insbesondere fuer sensoren fuer brennkraftmaschinen |
NL188432C (nl) * | 1980-12-26 | 1992-06-16 | Nippon Telegraph & Telephone | Werkwijze voor het vervaardigen van een mosfet. |
JPS5831336A (ja) * | 1981-08-19 | 1983-02-24 | Konishiroku Photo Ind Co Ltd | ホトマスク素材 |
CN113053736B (zh) * | 2021-03-11 | 2024-05-03 | 捷捷半导体有限公司 | 一种半导体器件制作方法 |
-
1969
- 1969-10-15 JP JP44081843A patent/JPS4939873B1/ja active Pending
-
1970
- 1970-03-31 US US24168A patent/US3690966A/en not_active Expired - Lifetime
- 1970-04-24 GB GB1979170A patent/GB1311684A/en not_active Expired
- 1970-05-21 DE DE2024822A patent/DE2024822C3/de not_active Expired
- 1970-05-22 NL NL707007474A patent/NL140365B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
NL7007474A (ja) | 1971-04-19 |
NL140365B (nl) | 1973-11-15 |
US3690966A (en) | 1972-09-12 |
DE2024822B2 (de) | 1977-09-15 |
DE2024822A1 (de) | 1971-04-22 |
GB1311684A (en) | 1973-03-28 |
DE2024822C3 (de) | 1978-05-24 |