JPS4935025B1 - - Google Patents

Info

Publication number
JPS4935025B1
JPS4935025B1 JP46039949A JP3994971A JPS4935025B1 JP S4935025 B1 JPS4935025 B1 JP S4935025B1 JP 46039949 A JP46039949 A JP 46039949A JP 3994971 A JP3994971 A JP 3994971A JP S4935025 B1 JPS4935025 B1 JP S4935025B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP46039949A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4935025B1 publication Critical patent/JPS4935025B1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/83125Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET] the IGFETs characterised by having shared source or drain regions

Landscapes

  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Non-Volatile Memory (AREA)
JP46039949A 1970-06-15 1971-06-08 Pending JPS4935025B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US4638170A 1970-06-15 1970-06-15

Publications (1)

Publication Number Publication Date
JPS4935025B1 true JPS4935025B1 (enExample) 1974-09-19

Family

ID=21943139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46039949A Pending JPS4935025B1 (enExample) 1970-06-15 1971-06-08

Country Status (3)

Country Link
US (1) US3657614A (enExample)
JP (1) JPS4935025B1 (enExample)
CA (1) CA921173A (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4032948A (en) * 1970-10-28 1977-06-28 General Electric Company Surface charge launching apparatus
US3766448A (en) * 1972-02-04 1973-10-16 Gen Instrument Corp Integrated igfet circuits with increased inversion voltage under metallization runs
BE792939A (enExample) * 1972-04-10 1973-04-16 Rca Corp
US3845327A (en) * 1972-08-16 1974-10-29 Westinghouse Electric Corp Counter with memory utilizing mnos memory elements
US3877058A (en) * 1973-12-13 1975-04-08 Westinghouse Electric Corp Radiation charge transfer memory device
NL7406728A (nl) * 1974-05-20 1975-11-24 Philips Nv Halfgeleiderinrichting voor het digitaliseren van een elektrisch analoog signaal.
JPS5513433B2 (enExample) * 1974-08-29 1980-04-09
US4041519A (en) * 1975-02-10 1977-08-09 Melen Roger D Low transient effect switching device and method
US4090213A (en) * 1976-06-15 1978-05-16 California Institute Of Technology Induced junction solar cell and method of fabrication
DE2729657A1 (de) * 1977-06-30 1979-01-11 Siemens Ag Feldeffekttransistor mit extrem kurzer kanallaenge
US4328563A (en) * 1979-01-12 1982-05-04 Mostek Corporation High density read only memory
US4735914A (en) * 1979-03-28 1988-04-05 Honeywell Inc. FET for high reverse bias voltage and geometrical design for low on resistance
EP0033159B1 (en) * 1980-01-29 1984-05-02 Nec Corporation Semiconductor device
US4468574A (en) * 1982-05-03 1984-08-28 General Electric Company Dual gate CMOS transistor circuits having reduced electrode capacitance
US4672423A (en) * 1982-09-30 1987-06-09 International Business Machines Corporation Voltage controlled resonant transmission semiconductor device
US5108940A (en) * 1987-12-22 1992-04-28 Siliconix, Inc. MOS transistor with a charge induced drain extension
US5243212A (en) * 1987-12-22 1993-09-07 Siliconix Incorporated Transistor with a charge induced drain extension
CA1309781C (en) * 1988-06-21 1992-11-03 Colin Harris Compact cmos analog crosspoint switch matrix
GB2224160A (en) * 1988-10-24 1990-04-25 Marconi Instruments Ltd Integrated semiconductor circuits
US5047361A (en) * 1989-06-30 1991-09-10 Texas Instruments Incorporated NMOS transistor having inversion layer source/drain contacts
US5264380A (en) * 1989-12-18 1993-11-23 Motorola, Inc. Method of making an MOS transistor having improved transconductance and short channel characteristics
JPH04241466A (ja) * 1991-01-16 1992-08-28 Casio Comput Co Ltd 電界効果型トランジスタ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3564355A (en) * 1968-02-08 1971-02-16 Sprague Electric Co Semiconductor device employing a p-n junction between induced p- and n- regions

Also Published As

Publication number Publication date
CA921173A (en) 1973-02-13
US3657614A (en) 1972-04-18

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