JPS4933565A - - Google Patents

Info

Publication number
JPS4933565A
JPS4933565A JP47074183A JP7418372A JPS4933565A JP S4933565 A JPS4933565 A JP S4933565A JP 47074183 A JP47074183 A JP 47074183A JP 7418372 A JP7418372 A JP 7418372A JP S4933565 A JPS4933565 A JP S4933565A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47074183A
Other languages
Japanese (ja)
Other versions
JPS5311192B2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7418372A priority Critical patent/JPS5311192B2/ja
Priority to US05/379,972 priority patent/US4119259A/en
Priority to GB3426373A priority patent/GB1433198A/en
Priority to AU58322/73A priority patent/AU5832273A/en
Priority to DE2337303A priority patent/DE2337303B2/de
Publication of JPS4933565A publication Critical patent/JPS4933565A/ja
Priority to HK762/76*UA priority patent/HK76276A/xx
Priority to MY101/77A priority patent/MY7700101A/xx
Publication of JPS5311192B2 publication Critical patent/JPS5311192B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP7418372A 1972-07-26 1972-07-26 Expired JPS5311192B2 (https=)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP7418372A JPS5311192B2 (https=) 1972-07-26 1972-07-26
US05/379,972 US4119259A (en) 1972-07-26 1973-07-17 Automatic bonding apparatus for assembling semiconductor devices
GB3426373A GB1433198A (en) 1972-07-26 1973-07-18 Automatic thermocompression wire bonding apparatus
AU58322/73A AU5832273A (en) 1972-07-26 1973-07-20 Automatic bonding apparatus
DE2337303A DE2337303B2 (de) 1972-07-26 1973-07-23 Automatische Verbindungsvorrichtung insbesondere zum Zusammenbau von Halbleiteranordnungen
HK762/76*UA HK76276A (en) 1972-07-26 1976-12-02 Automatic thermocompression wire bonding apparatus
MY101/77A MY7700101A (en) 1972-07-26 1977-12-30 Automatic thermocompression wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7418372A JPS5311192B2 (https=) 1972-07-26 1972-07-26

Publications (2)

Publication Number Publication Date
JPS4933565A true JPS4933565A (https=) 1974-03-28
JPS5311192B2 JPS5311192B2 (https=) 1978-04-19

Family

ID=13539787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7418372A Expired JPS5311192B2 (https=) 1972-07-26 1972-07-26

Country Status (7)

Country Link
US (1) US4119259A (https=)
JP (1) JPS5311192B2 (https=)
AU (1) AU5832273A (https=)
DE (1) DE2337303B2 (https=)
GB (1) GB1433198A (https=)
HK (1) HK76276A (https=)
MY (1) MY7700101A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52139016A (en) * 1976-05-15 1977-11-19 Toei Chemical Kk Method of manufacturing dimer acid dimethyl ester
JPS5323306A (en) * 1976-08-16 1978-03-03 Toei Chemical Kk Filteration method of dimer acid dimethyl ester
JPS5389659A (en) * 1977-01-19 1978-08-07 Shinkawa Seisakusho Kk Wire bonder
JPS5416981A (en) * 1977-07-08 1979-02-07 Shinkawa Seisakusho Kk Device for bonding wires
JPS5423377A (en) * 1977-07-24 1979-02-21 Shinkawa Seisakusho Kk Device for bonding wires

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2457746C2 (de) * 1974-12-06 1983-06-16 Deutsche Itt Industries Gmbh, 7800 Freiburg Planar-Halbleiterbauelement und Verfahren zu seiner Herstellung
DE2917110A1 (de) * 1979-04-27 1980-10-30 Preh Elektro Feinmechanik Verfahren zur verkleinerung des abstandes von mit einer traegerplatte verbindbaren kontaktfahnen auf das rastermass
US4371105A (en) * 1980-07-23 1983-02-01 Melton Vernon L Cam controlled multi-axis automatic welding machine
GB8415912D0 (en) * 1984-06-21 1984-07-25 Abbalong Ltd Step and repeat apparatus
DE3447587A1 (de) * 1984-12-28 1986-07-10 Foton Production Automation GmbH Präzisionsmaschinenbau, 8000 München Maschine zum befestigen der verbindungsdraehte an den anschlussstellen eines halbleiterbauelements und des das halbleiterbauelement aufnehmenden gehaeuses
DE8714814U1 (de) * 1987-11-06 1989-03-09 J. Mühlbauer GmbH, 8495 Roding Die-Bonder
US5653375A (en) * 1994-10-29 1997-08-05 Samsung Aerospace Industries, Ltd. Wire bonding apparatus
JP6250372B2 (ja) * 2013-11-22 2017-12-20 Ntn株式会社 自動溶接機

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3110425A (en) * 1961-01-10 1963-11-12 Gen Motors Corp Fluid dispensing apparatus
US3342395A (en) * 1966-10-10 1967-09-19 Unitek Corp Precision drive apparatus for a tool mount
US3653268A (en) * 1970-03-10 1972-04-04 John C Diepeveen Tool moving mechanism
US3773240A (en) * 1972-03-06 1973-11-20 Texas Instruments Inc Automatic bonding machine
US3813022A (en) * 1972-06-19 1974-05-28 Automated Equipment Corp Wire bonder apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52139016A (en) * 1976-05-15 1977-11-19 Toei Chemical Kk Method of manufacturing dimer acid dimethyl ester
JPS5323306A (en) * 1976-08-16 1978-03-03 Toei Chemical Kk Filteration method of dimer acid dimethyl ester
JPS5389659A (en) * 1977-01-19 1978-08-07 Shinkawa Seisakusho Kk Wire bonder
JPS5416981A (en) * 1977-07-08 1979-02-07 Shinkawa Seisakusho Kk Device for bonding wires
JPS5423377A (en) * 1977-07-24 1979-02-21 Shinkawa Seisakusho Kk Device for bonding wires

Also Published As

Publication number Publication date
GB1433198A (en) 1976-04-22
DE2337303A1 (de) 1974-02-14
JPS5311192B2 (https=) 1978-04-19
US4119259A (en) 1978-10-10
MY7700101A (en) 1977-12-31
DE2337303B2 (de) 1975-05-15
HK76276A (en) 1976-12-10
AU5832273A (en) 1975-01-23

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