JPS492789A - - Google Patents
Info
- Publication number
- JPS492789A JPS492789A JP4276472A JP4276472A JPS492789A JP S492789 A JPS492789 A JP S492789A JP 4276472 A JP4276472 A JP 4276472A JP 4276472 A JP4276472 A JP 4276472A JP S492789 A JPS492789 A JP S492789A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- Liquid Crystal (AREA)
- Liquid Crystal Substances (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4276472A JPS564595B2 (en) | 1972-04-28 | 1972-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4276472A JPS564595B2 (en) | 1972-04-28 | 1972-04-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS492789A true JPS492789A (en) | 1974-01-11 |
| JPS564595B2 JPS564595B2 (en) | 1981-01-30 |
Family
ID=12645036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4276472A Expired JPS564595B2 (en) | 1972-04-28 | 1972-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS564595B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57112057A (en) * | 1980-12-29 | 1982-07-12 | Fujitsu Ltd | Semiconductor device |
| JPS58142941U (en) * | 1982-03-18 | 1983-09-27 | 富士通株式会社 | IC package |
| JPS6286848A (en) * | 1985-10-14 | 1987-04-21 | Matsushita Electric Works Ltd | Chip carrier |
| JPS63192262A (en) * | 1986-12-19 | 1988-08-09 | フェアチャイルド セミコンダクタ コーポレーション | Ceramic package for radio frequency device |
| JPH01143242A (en) * | 1987-11-27 | 1989-06-05 | Ibiden Co Ltd | Semiconductor mounting heat dissipation substrate |
| KR20170098916A (en) | 2015-01-24 | 2017-08-30 | 교라꾸 가부시끼가이샤 | Molding method and molding device of resin molded article |
-
1972
- 1972-04-28 JP JP4276472A patent/JPS564595B2/ja not_active Expired
Non-Patent Citations (3)
| Title |
|---|
| J. APPL. PHYS.=1971 * |
| MOL. CRYST. LIGUID CRYST.=1971 * |
| PROC. IEEE=1971 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57112057A (en) * | 1980-12-29 | 1982-07-12 | Fujitsu Ltd | Semiconductor device |
| JPS58142941U (en) * | 1982-03-18 | 1983-09-27 | 富士通株式会社 | IC package |
| JPS6348128Y2 (en) * | 1982-03-18 | 1988-12-12 | ||
| JPS6286848A (en) * | 1985-10-14 | 1987-04-21 | Matsushita Electric Works Ltd | Chip carrier |
| JPS63192262A (en) * | 1986-12-19 | 1988-08-09 | フェアチャイルド セミコンダクタ コーポレーション | Ceramic package for radio frequency device |
| JPH0322060B2 (en) * | 1986-12-19 | 1991-03-26 | Fueachairudo Semikondakuta Corp | |
| JPH01143242A (en) * | 1987-11-27 | 1989-06-05 | Ibiden Co Ltd | Semiconductor mounting heat dissipation substrate |
| KR20170098916A (en) | 2015-01-24 | 2017-08-30 | 교라꾸 가부시끼가이샤 | Molding method and molding device of resin molded article |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS564595B2 (en) | 1981-01-30 |