JPS4921073A - - Google Patents
Info
- Publication number
- JPS4921073A JPS4921073A JP47059849A JP5984972A JPS4921073A JP S4921073 A JPS4921073 A JP S4921073A JP 47059849 A JP47059849 A JP 47059849A JP 5984972 A JP5984972 A JP 5984972A JP S4921073 A JPS4921073 A JP S4921073A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47059849A JPS4921073A (fi) | 1972-06-16 | 1972-06-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47059849A JPS4921073A (fi) | 1972-06-16 | 1972-06-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4921073A true JPS4921073A (fi) | 1974-02-25 |
Family
ID=13125044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47059849A Pending JPS4921073A (fi) | 1972-06-16 | 1972-06-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4921073A (fi) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5188663A (en) * | 1975-01-28 | 1976-08-03 | Daizuogenryotoshita sannyuinryonoseizoho | |
| JPS51115956A (en) * | 1975-04-02 | 1976-10-13 | Tadahiko Terasaka | Method of producing milkklike drink |
| JPS5399965U (fi) * | 1977-01-13 | 1978-08-12 | ||
| JPS5974652A (ja) * | 1982-10-20 | 1984-04-27 | Matsushita Electric Works Ltd | 樹脂封止型電子部品の製造方法 |
| JPS5996749A (ja) * | 1982-11-25 | 1984-06-04 | Matsushita Electric Works Ltd | 樹脂封止型電子部品の製造方法 |
| JPS61251155A (ja) * | 1985-04-30 | 1986-11-08 | Yamaichi Electric Mfg Co Ltd | Ｉｃパッケージ |
| JPH01157559A (ja) * | 1988-07-29 | 1989-06-20 | Hitachi Ltd | 半導体装置 |
-
1972
- 1972-06-16 JP JP47059849A patent/JPS4921073A/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5188663A (en) * | 1975-01-28 | 1976-08-03 | Daizuogenryotoshita sannyuinryonoseizoho | |
| JPS51115956A (en) * | 1975-04-02 | 1976-10-13 | Tadahiko Terasaka | Method of producing milkklike drink |
| JPS5399965U (fi) * | 1977-01-13 | 1978-08-12 | ||
| JPS5722434Y2 (fi) * | 1977-01-13 | 1982-05-15 | ||
| JPS5974652A (ja) * | 1982-10-20 | 1984-04-27 | Matsushita Electric Works Ltd | 樹脂封止型電子部品の製造方法 |
| JPS5996749A (ja) * | 1982-11-25 | 1984-06-04 | Matsushita Electric Works Ltd | 樹脂封止型電子部品の製造方法 |
| JPS61251155A (ja) * | 1985-04-30 | 1986-11-08 | Yamaichi Electric Mfg Co Ltd | Ｉｃパッケージ |
| JPH0374507B2 (fi) * | 1985-04-30 | 1991-11-27 | ||
| JPH01157559A (ja) * | 1988-07-29 | 1989-06-20 | Hitachi Ltd | 半導体装置 |