JPS4916397B1 - - Google Patents
Info
- Publication number
- JPS4916397B1 JPS4916397B1 JP44034740A JP3474069A JPS4916397B1 JP S4916397 B1 JPS4916397 B1 JP S4916397B1 JP 44034740 A JP44034740 A JP 44034740A JP 3474069 A JP3474069 A JP 3474069A JP S4916397 B1 JPS4916397 B1 JP S4916397B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Manipulator (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US82281669A | 1969-04-07 | 1969-04-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4916397B1 true JPS4916397B1 (ja) | 1974-04-22 |
Family
ID=25237061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP44034740A Pending JPS4916397B1 (ja) | 1969-04-07 | 1969-05-06 |
Country Status (5)
Country | Link |
---|---|
US (1) | US3577861A (ja) |
JP (1) | JPS4916397B1 (ja) |
DE (1) | DE1923043B2 (ja) |
FR (1) | FR2038291A1 (ja) |
GB (1) | GB1225323A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111890209A (zh) * | 2020-09-29 | 2020-11-06 | 佛山市后浪科技有限公司 | 一种抛光机 |
CN116900402A (zh) * | 2023-07-31 | 2023-10-20 | 安徽亚新科密封技术有限公司 | 带骨架产品的切片设备 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3662733A (en) * | 1969-10-12 | 1972-05-16 | Yoji Hattori | Annular cutting apparatus with work removal means |
DE2204491C3 (de) * | 1972-01-31 | 1981-02-26 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Meßsteuerung einer Siliciumsäge über eine Hilfsspindel |
US4287256A (en) * | 1978-12-26 | 1981-09-01 | Rca Corporation | Wafer and boule protection during the blade return stroke of a wafer saw |
US4227348A (en) * | 1978-12-26 | 1980-10-14 | Rca Corporation | Method of slicing a wafer |
US4326494A (en) * | 1978-12-26 | 1982-04-27 | Rca Corporation | Wafer and boule protection during the blade return stroke of a wafer saw |
DE3036829A1 (de) * | 1980-09-30 | 1982-05-13 | Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen | Verfahren zum aufnehmen von kristallscheiben |
US4420909B2 (en) * | 1981-11-10 | 1997-06-10 | Silicon Technology | Wafering system |
EP0242489B1 (de) * | 1986-04-17 | 1991-07-10 | Maschinenfabrik Meyer & Burger AG | Verfahren zum Trennen eines Stabes in Teilstücke, Trennschleifmaschine zur Durchführung dieses Verfahrens und Verwendung dieser Trennschleifmaschine |
US4899719A (en) * | 1987-07-31 | 1990-02-13 | Mitsubishi Kinsoku Kabushiki Kaisha | Apparatus for collecting wafers |
US4852304A (en) * | 1987-10-29 | 1989-08-01 | Tokyo Seimtsu Co., Ltd. | Apparatus and method for slicing a wafer |
EP0329087B1 (en) * | 1988-02-15 | 1994-11-17 | Tokyo Seimitsu Co.,Ltd. | Method and device for dressing an inner peripheral blade in a slicing machine |
JP5415184B2 (ja) * | 2009-08-21 | 2014-02-12 | 株式会社ディスコ | 切削装置 |
CN111976042A (zh) * | 2020-08-12 | 2020-11-24 | 长兴立峰电子股份有限公司 | 一种高效率的薄膜电感制造设备及制造工艺 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3039235A (en) * | 1961-01-31 | 1962-06-19 | Hamco Mach & Elect Co | Cutting apparatus |
-
1969
- 1969-04-07 US US822816A patent/US3577861A/en not_active Expired - Lifetime
- 1969-05-05 FR FR6914198A patent/FR2038291A1/fr not_active Withdrawn
- 1969-05-06 DE DE19691923043 patent/DE1923043B2/de active Granted
- 1969-05-06 JP JP44034740A patent/JPS4916397B1/ja active Pending
- 1969-05-06 GB GB1225323D patent/GB1225323A/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111890209A (zh) * | 2020-09-29 | 2020-11-06 | 佛山市后浪科技有限公司 | 一种抛光机 |
CN116900402A (zh) * | 2023-07-31 | 2023-10-20 | 安徽亚新科密封技术有限公司 | 带骨架产品的切片设备 |
CN116900402B (zh) * | 2023-07-31 | 2024-04-12 | 安徽亚新科密封技术有限公司 | 带骨架产品的切片设备 |
Also Published As
Publication number | Publication date |
---|---|
GB1225323A (ja) | 1971-03-17 |
FR2038291A1 (ja) | 1971-01-08 |
US3577861A (en) | 1971-05-11 |
DE1923043A1 (de) | 1970-11-19 |
DE1923043C3 (ja) | 1973-11-29 |
DE1923043B2 (de) | 1973-05-17 |