JPS49131381A - - Google Patents

Info

Publication number
JPS49131381A
JPS49131381A JP48044552A JP4455273A JPS49131381A JP S49131381 A JPS49131381 A JP S49131381A JP 48044552 A JP48044552 A JP 48044552A JP 4455273 A JP4455273 A JP 4455273A JP S49131381 A JPS49131381 A JP S49131381A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48044552A
Other languages
Japanese (ja)
Other versions
JPS5218096B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48044552A priority Critical patent/JPS5218096B2/ja
Publication of JPS49131381A publication Critical patent/JPS49131381A/ja
Publication of JPS5218096B2 publication Critical patent/JPS5218096B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP48044552A 1973-04-18 1973-04-18 Expired JPS5218096B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48044552A JPS5218096B2 (en) 1973-04-18 1973-04-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48044552A JPS5218096B2 (en) 1973-04-18 1973-04-18

Publications (2)

Publication Number Publication Date
JPS49131381A true JPS49131381A (en) 1974-12-17
JPS5218096B2 JPS5218096B2 (en) 1977-05-19

Family

ID=12694650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48044552A Expired JPS5218096B2 (en) 1973-04-18 1973-04-18

Country Status (1)

Country Link
JP (1) JPS5218096B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155461U (en) * 1980-04-21 1981-11-20
JPS57202785A (en) * 1982-03-02 1982-12-11 Toshiba Corp Semiconductor device
JPS5833864A (en) * 1981-08-25 1983-02-28 Fujitsu Ltd Semiconductor device
JPS59128736U (en) * 1984-01-17 1984-08-30 日本電気株式会社 Semiconductor integrated circuit device
JPS61234555A (en) * 1985-04-11 1986-10-18 Oki Electric Ind Co Ltd Semiconductor device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155461U (en) * 1980-04-21 1981-11-20
JPS5833864A (en) * 1981-08-25 1983-02-28 Fujitsu Ltd Semiconductor device
JPH0221145B2 (en) * 1981-08-25 1990-05-11 Fujitsu Ltd
JPS57202785A (en) * 1982-03-02 1982-12-11 Toshiba Corp Semiconductor device
JPS59128736U (en) * 1984-01-17 1984-08-30 日本電気株式会社 Semiconductor integrated circuit device
JPS6214689Y2 (en) * 1984-01-17 1987-04-15
JPS61234555A (en) * 1985-04-11 1986-10-18 Oki Electric Ind Co Ltd Semiconductor device
JPH0464464B2 (en) * 1985-04-11 1992-10-15 Oki Electric Ind Co Ltd

Also Published As

Publication number Publication date
JPS5218096B2 (en) 1977-05-19

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