JPS49113581A - - Google Patents
Info
- Publication number
- JPS49113581A JPS49113581A JP2209073A JP2209073A JPS49113581A JP S49113581 A JPS49113581 A JP S49113581A JP 2209073 A JP2209073 A JP 2209073A JP 2209073 A JP2209073 A JP 2209073A JP S49113581 A JPS49113581 A JP S49113581A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3201—Structure
- H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
- H01L2224/32013—Structure relative to the bonding area, e.g. bond pad the layer connector being larger than the bonding area, e.g. bond pad
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2209073A JPS49113581A (enrdf_load_stackoverflow) | 1973-02-26 | 1973-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2209073A JPS49113581A (enrdf_load_stackoverflow) | 1973-02-26 | 1973-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS49113581A true JPS49113581A (enrdf_load_stackoverflow) | 1974-10-30 |
Family
ID=12073166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2209073A Pending JPS49113581A (enrdf_load_stackoverflow) | 1973-02-26 | 1973-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS49113581A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5857732A (ja) * | 1981-10-01 | 1983-04-06 | Sanyo Electric Co Ltd | 半導体素子の位置検出方法 |
| JPS5890728A (ja) * | 1981-11-25 | 1983-05-30 | Nippon Telegr & Teleph Corp <Ntt> | 半導体ウエファ上の位置合せ用マ−クの製法 |
| JPS5891653A (ja) * | 1981-11-27 | 1983-05-31 | Copal Co Ltd | 低反射率導電性接着ペ−ストを用いた半導体装置の自動ワイヤボンデイング法 |
| JPS6181640A (ja) * | 1985-02-27 | 1986-04-25 | Hitachi Ltd | 半導体装置の製造方法 |
| JPS6379342A (ja) * | 1986-09-22 | 1988-04-09 | Nikon Corp | アライメント装置 |
-
1973
- 1973-02-26 JP JP2209073A patent/JPS49113581A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5857732A (ja) * | 1981-10-01 | 1983-04-06 | Sanyo Electric Co Ltd | 半導体素子の位置検出方法 |
| JPS5890728A (ja) * | 1981-11-25 | 1983-05-30 | Nippon Telegr & Teleph Corp <Ntt> | 半導体ウエファ上の位置合せ用マ−クの製法 |
| JPS5891653A (ja) * | 1981-11-27 | 1983-05-31 | Copal Co Ltd | 低反射率導電性接着ペ−ストを用いた半導体装置の自動ワイヤボンデイング法 |
| JPS6181640A (ja) * | 1985-02-27 | 1986-04-25 | Hitachi Ltd | 半導体装置の製造方法 |
| JPS6379342A (ja) * | 1986-09-22 | 1988-04-09 | Nikon Corp | アライメント装置 |