JPS49113552U - - Google Patents
Info
- Publication number
- JPS49113552U JPS49113552U JP1131573U JP1131573U JPS49113552U JP S49113552 U JPS49113552 U JP S49113552U JP 1131573 U JP1131573 U JP 1131573U JP 1131573 U JP1131573 U JP 1131573U JP S49113552 U JPS49113552 U JP S49113552U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
Landscapes
- Die Bonding (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1131573U JPS5318266Y2 (enExample) | 1973-01-25 | 1973-01-25 | |
| US43411774 US3890637A (en) | 1973-01-25 | 1974-01-17 | Semiconductor element envelope |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1131573U JPS5318266Y2 (enExample) | 1973-01-25 | 1973-01-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS49113552U true JPS49113552U (enExample) | 1974-09-27 |
| JPS5318266Y2 JPS5318266Y2 (enExample) | 1978-05-16 |
Family
ID=11774567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1131573U Expired JPS5318266Y2 (enExample) | 1973-01-25 | 1973-01-25 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US3890637A (enExample) |
| JP (1) | JPS5318266Y2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2630320A1 (de) * | 1976-07-06 | 1978-01-12 | Licentia Gmbh | Scheibenfoermige halbleiterzelle mit einem ringfoermigen gehaeuse |
| JPS5871633A (ja) * | 1981-10-23 | 1983-04-28 | Toshiba Corp | 圧接型半導体装置 |
| US4646131A (en) * | 1983-01-28 | 1987-02-24 | Mitsubishi Denki Kabushiki Kaisha | Rectifier device |
| JPH065686B2 (ja) * | 1985-09-04 | 1994-01-19 | 株式会社日立製作所 | 圧接型半導体装置 |
| FR2598031B1 (fr) * | 1986-04-29 | 1988-12-02 | Alsthom | Boitier pour semi-conducteur de puissance |
| US5248902A (en) * | 1991-08-30 | 1993-09-28 | General Instrument Corporation | Surface mounting diode |
| US5825090A (en) * | 1994-07-27 | 1998-10-20 | Silicon Power Corporation | High power semiconductor device and method of making same |
| HRP990234A2 (en) * | 1999-07-23 | 2001-04-30 | Končar - Elektronika I Informatika D.D. Zagreb | Arrangement of bilaterally cooled energetic semiconductor valves protected from negative environmental effects |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3265805A (en) * | 1964-02-03 | 1966-08-09 | Power Components Inc | Semiconductor power device |
| US3437887A (en) * | 1966-06-03 | 1969-04-08 | Westinghouse Electric Corp | Flat package encapsulation of electrical devices |
| DE2014289A1 (de) * | 1970-03-25 | 1971-10-14 | Semikron Gleichrichterbau | Scheibenförmiges Halbleiterbauele ment und Verfahren zu seiner Herstellung |
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1973
- 1973-01-25 JP JP1131573U patent/JPS5318266Y2/ja not_active Expired
-
1974
- 1974-01-17 US US43411774 patent/US3890637A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US3890637A (en) | 1975-06-17 |
| JPS5318266Y2 (enExample) | 1978-05-16 |