JPS49110292A - - Google Patents
Info
- Publication number
- JPS49110292A JPS49110292A JP2014873A JP2014873A JPS49110292A JP S49110292 A JPS49110292 A JP S49110292A JP 2014873 A JP2014873 A JP 2014873A JP 2014873 A JP2014873 A JP 2014873A JP S49110292 A JPS49110292 A JP S49110292A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014873A JPS5634865B2 (US07714131-20100511-C00024.png) | 1973-02-21 | 1973-02-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014873A JPS5634865B2 (US07714131-20100511-C00024.png) | 1973-02-21 | 1973-02-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS49110292A true JPS49110292A (US07714131-20100511-C00024.png) | 1974-10-21 |
| JPS5634865B2 JPS5634865B2 (US07714131-20100511-C00024.png) | 1981-08-13 |
Family
ID=12019054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014873A Expired JPS5634865B2 (US07714131-20100511-C00024.png) | 1973-02-21 | 1973-02-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5634865B2 (US07714131-20100511-C00024.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6370589U (US07714131-20100511-C00024.png) * | 1986-10-27 | 1988-05-12 | ||
| JP2005191445A (ja) * | 2003-12-26 | 2005-07-14 | Sanyo Electric Co Ltd | 発光素子用パッケージ及びその製造方法 |
| JP2005191446A (ja) * | 2003-12-26 | 2005-07-14 | Sanyo Electric Co Ltd | 発光素子用パッケージ及びこれを具えた発光デバイス |
| WO2010067701A1 (ja) * | 2008-12-12 | 2010-06-17 | 三洋電機株式会社 | 発光装置、発光装置モジュールおよび発光装置の製造方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114450259A (zh) | 2019-09-26 | 2022-05-06 | 富士色素株式会社 | 复合氧化物粉末、复合氧化物粉末的制造方法、固体电解质体的制造方法以及锂离子二次电池的制造方法 |
| JP7478414B2 (ja) | 2020-03-02 | 2024-05-07 | 国立研究開発法人産業技術総合研究所 | 非晶質複合金属酸化物、ガーネット型リチウム複合金属酸化物、焼結体、固体電解質層、電気化学デバイス用電極、電気化学デバイス |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4826867U (US07714131-20100511-C00024.png) * | 1971-08-04 | 1973-03-31 | ||
| JPS4827767U (US07714131-20100511-C00024.png) * | 1971-08-05 | 1973-04-04 |
-
1973
- 1973-02-21 JP JP2014873A patent/JPS5634865B2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4826867U (US07714131-20100511-C00024.png) * | 1971-08-04 | 1973-03-31 | ||
| JPS4827767U (US07714131-20100511-C00024.png) * | 1971-08-05 | 1973-04-04 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6370589U (US07714131-20100511-C00024.png) * | 1986-10-27 | 1988-05-12 | ||
| JP2005191445A (ja) * | 2003-12-26 | 2005-07-14 | Sanyo Electric Co Ltd | 発光素子用パッケージ及びその製造方法 |
| JP2005191446A (ja) * | 2003-12-26 | 2005-07-14 | Sanyo Electric Co Ltd | 発光素子用パッケージ及びこれを具えた発光デバイス |
| WO2010067701A1 (ja) * | 2008-12-12 | 2010-06-17 | 三洋電機株式会社 | 発光装置、発光装置モジュールおよび発光装置の製造方法 |
| JPWO2010067701A1 (ja) * | 2008-12-12 | 2012-05-17 | 三洋電機株式会社 | 発光装置、発光装置モジュールおよび発光装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5634865B2 (US07714131-20100511-C00024.png) | 1981-08-13 |
