JPS4910463U - - Google Patents
Info
- Publication number
- JPS4910463U JPS4910463U JP5093972U JP5093972U JPS4910463U JP S4910463 U JPS4910463 U JP S4910463U JP 5093972 U JP5093972 U JP 5093972U JP 5093972 U JP5093972 U JP 5093972U JP S4910463 U JPS4910463 U JP S4910463U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5093972U JPS4910463U (hu) | 1972-04-28 | 1972-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5093972U JPS4910463U (hu) | 1972-04-28 | 1972-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4910463U true JPS4910463U (hu) | 1974-01-29 |
Family
ID=27931287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5093972U Pending JPS4910463U (hu) | 1972-04-28 | 1972-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4910463U (hu) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51155070U (hu) * | 1975-06-05 | 1976-12-10 | ||
| JPS5829846U (ja) * | 1981-08-20 | 1983-02-26 | 松下電器産業株式会社 | チツプ型トランジスタ |
| JPS60226154A (ja) * | 1984-04-25 | 1985-11-11 | Matsushita Electronics Corp | 樹脂封止型半導体装置 |
-
1972
- 1972-04-28 JP JP5093972U patent/JPS4910463U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51155070U (hu) * | 1975-06-05 | 1976-12-10 | ||
| JPS5829846U (ja) * | 1981-08-20 | 1983-02-26 | 松下電器産業株式会社 | チツプ型トランジスタ |
| JPS60226154A (ja) * | 1984-04-25 | 1985-11-11 | Matsushita Electronics Corp | 樹脂封止型半導体装置 |