JPS4893698A - - Google Patents
Info
- Publication number
- JPS4893698A JPS4893698A JP2577072A JP2577072A JPS4893698A JP S4893698 A JPS4893698 A JP S4893698A JP 2577072 A JP2577072 A JP 2577072A JP 2577072 A JP2577072 A JP 2577072A JP S4893698 A JPS4893698 A JP S4893698A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Epoxy Resins (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Reinforced Plastic Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2577072A JPS4948680B2 (ja) | 1972-03-15 | 1972-03-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2577072A JPS4948680B2 (ja) | 1972-03-15 | 1972-03-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4893698A true JPS4893698A (ja) | 1973-12-04 |
| JPS4948680B2 JPS4948680B2 (ja) | 1974-12-23 |
Family
ID=12175065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2577072A Expired JPS4948680B2 (ja) | 1972-03-15 | 1972-03-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4948680B2 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994003517A1 (en) * | 1992-08-03 | 1994-02-17 | Showa Highpolymer Co., Ltd. | Thermosetting resin composition and production of copper-clad laminated board therefrom |
| WO2019112066A1 (ja) * | 2017-12-08 | 2019-06-13 | 日立化成株式会社 | プリプレグ、積層板、及びそれらの製造方法、並びにプリント配線板及び半導体パッケージ |
-
1972
- 1972-03-15 JP JP2577072A patent/JPS4948680B2/ja not_active Expired
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994003517A1 (en) * | 1992-08-03 | 1994-02-17 | Showa Highpolymer Co., Ltd. | Thermosetting resin composition and production of copper-clad laminated board therefrom |
| US5439986A (en) * | 1992-08-03 | 1995-08-08 | Showa Highpolymer Co., Ltd. | Thermo-curable resin composition, and a method for producing a copper-clad laminate using same |
| WO2019112066A1 (ja) * | 2017-12-08 | 2019-06-13 | 日立化成株式会社 | プリプレグ、積層板、及びそれらの製造方法、並びにプリント配線板及び半導体パッケージ |
| WO2019112067A1 (ja) * | 2017-12-08 | 2019-06-13 | 日立化成株式会社 | プリプレグ、積層板、プリント配線板及び半導体パッケージ |
| WO2019112065A1 (ja) * | 2017-12-08 | 2019-06-13 | 日立化成株式会社 | プリプレグ、積層板、及びそれらの製造方法、並びにプリント配線板及び半導体パッケージ |
| CN111448043A (zh) * | 2017-12-08 | 2020-07-24 | 日立化成株式会社 | 预浸渍体、层叠板和它们的制造方法、以及印刷线路板和半导体封装体 |
| CN111448044A (zh) * | 2017-12-08 | 2020-07-24 | 日立化成株式会社 | 预浸渍体、层叠板、印刷线路板和半导体封装体 |
| JPWO2019112065A1 (ja) * | 2017-12-08 | 2020-12-03 | 昭和電工マテリアルズ株式会社 | プリプレグ、積層板、及びそれらの製造方法、並びにプリント配線板及び半導体パッケージ |
| JPWO2019112067A1 (ja) * | 2017-12-08 | 2020-12-10 | 昭和電工マテリアルズ株式会社 | プリプレグ、積層板、プリント配線板及び半導体パッケージ |
| JPWO2019112066A1 (ja) * | 2017-12-08 | 2020-12-10 | 昭和電工マテリアルズ株式会社 | プリプレグ、積層板、及びそれらの製造方法、並びにプリント配線板及び半導体パッケージ |
| TWI798309B (zh) * | 2017-12-08 | 2023-04-11 | 日商日立化成股份有限公司 | 預浸體、積層板、印刷配線板及半導體封裝體 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4948680B2 (ja) | 1974-12-23 |