JPS4873762A - - Google Patents

Info

Publication number
JPS4873762A
JPS4873762A JP47089643A JP8964372A JPS4873762A JP S4873762 A JPS4873762 A JP S4873762A JP 47089643 A JP47089643 A JP 47089643A JP 8964372 A JP8964372 A JP 8964372A JP S4873762 A JPS4873762 A JP S4873762A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47089643A
Other languages
Japanese (ja)
Other versions
JPS573234B2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4873762A publication Critical patent/JPS4873762A/ja
Publication of JPS573234B2 publication Critical patent/JPS573234B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Non-Adjustable Resistors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
JP8964372A 1972-01-04 1972-09-08 Expired JPS573234B2 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21539572A 1972-01-04 1972-01-04

Publications (2)

Publication Number Publication Date
JPS4873762A true JPS4873762A (enrdf_load_stackoverflow) 1973-10-04
JPS573234B2 JPS573234B2 (enrdf_load_stackoverflow) 1982-01-20

Family

ID=22802825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8964372A Expired JPS573234B2 (enrdf_load_stackoverflow) 1972-01-04 1972-09-08

Country Status (2)

Country Link
JP (1) JPS573234B2 (enrdf_load_stackoverflow)
FR (1) FR2166347A1 (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472468A (en) * 1977-11-21 1979-06-09 Nitto Electric Ind Co Printing circuit substrate with resistance
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
JPS6413790A (en) * 1987-07-08 1989-01-18 Koa Corp Copper electrode paste
EP1608209A1 (en) * 2004-06-17 2005-12-21 Furukawa Circuit Foil Co., Ltd. Conductive base material with resistance layer and circuit board material with resistance layer
US7215235B2 (en) 2003-04-11 2007-05-08 Furukawa Circuit Foil Co., Ltd Conductive substrate with resistance layer, resistance board, and resistance circuit board
US7794578B2 (en) 2002-11-26 2010-09-14 The Furukawa Electric Co., Ltd. Method for preparing a circuit board material having a conductive base and a resistance layer
CN107675176A (zh) * 2017-08-21 2018-02-09 陕西天元智能再制造股份有限公司 一种微弧氧化与真空熔覆相结合的工件表面强化处理方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2554046B1 (fr) * 1983-10-28 1986-05-09 Gen Electric Stratifie recouvert de metal et procede de fabrication
SG10201504661VA (en) 2010-08-06 2015-07-30 Hitachi Chemical Co Ltd Liquid composition, and resistor film, resistor element and circuit board using same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2662957A (en) * 1949-10-29 1953-12-15 Eisler Paul Electrical resistor or semiconductor
FR1366903A (fr) * 1963-06-04 1964-07-17 Ass Ouvriers Instr Precision Résistances imprimées et leur procédé de fabrication
GB1157618A (en) * 1965-09-13 1969-07-09 Engelhard Ind Ltd Laminate for Use in the Production of Printed Electrical Circuit Elements.
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472468A (en) * 1977-11-21 1979-06-09 Nitto Electric Ind Co Printing circuit substrate with resistance
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
US4935310A (en) * 1980-04-03 1990-06-19 Furukawa Circuit Foil Co., Ltd. Copper foil for a printed circuit and a method for the production thereof
JPS6413790A (en) * 1987-07-08 1989-01-18 Koa Corp Copper electrode paste
US7794578B2 (en) 2002-11-26 2010-09-14 The Furukawa Electric Co., Ltd. Method for preparing a circuit board material having a conductive base and a resistance layer
US7215235B2 (en) 2003-04-11 2007-05-08 Furukawa Circuit Foil Co., Ltd Conductive substrate with resistance layer, resistance board, and resistance circuit board
EP1608209A1 (en) * 2004-06-17 2005-12-21 Furukawa Circuit Foil Co., Ltd. Conductive base material with resistance layer and circuit board material with resistance layer
CN107675176A (zh) * 2017-08-21 2018-02-09 陕西天元智能再制造股份有限公司 一种微弧氧化与真空熔覆相结合的工件表面强化处理方法
CN107675176B (zh) * 2017-08-21 2019-05-17 陕西天元智能再制造股份有限公司 一种微弧氧化与真空熔覆相结合的工件表面强化处理方法

Also Published As

Publication number Publication date
FR2166347B1 (enrdf_load_stackoverflow) 1977-12-30
JPS573234B2 (enrdf_load_stackoverflow) 1982-01-20
FR2166347A1 (en) 1973-08-17

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