JPS4873077A - - Google Patents

Info

Publication number
JPS4873077A
JPS4873077A JP9072A JP9072A JPS4873077A JP S4873077 A JPS4873077 A JP S4873077A JP 9072 A JP9072 A JP 9072A JP 9072 A JP9072 A JP 9072A JP S4873077 A JPS4873077 A JP S4873077A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9072A
Other languages
Japanese (ja)
Other versions
JPS5128497B2 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47000090A priority Critical patent/JPS5128497B2/ja
Publication of JPS4873077A publication Critical patent/JPS4873077A/ja
Publication of JPS5128497B2 publication Critical patent/JPS5128497B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Dicing (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP47000090A 1971-12-29 1971-12-29 Expired JPS5128497B2 (cg-RX-API-DMAC7.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47000090A JPS5128497B2 (cg-RX-API-DMAC7.html) 1971-12-29 1971-12-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47000090A JPS5128497B2 (cg-RX-API-DMAC7.html) 1971-12-29 1971-12-29

Publications (2)

Publication Number Publication Date
JPS4873077A true JPS4873077A (cg-RX-API-DMAC7.html) 1973-10-02
JPS5128497B2 JPS5128497B2 (cg-RX-API-DMAC7.html) 1976-08-19

Family

ID=11464408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47000090A Expired JPS5128497B2 (cg-RX-API-DMAC7.html) 1971-12-29 1971-12-29

Country Status (1)

Country Link
JP (1) JPS5128497B2 (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53106672U (cg-RX-API-DMAC7.html) * 1977-02-01 1978-08-26
JPH02100340A (ja) * 1988-10-06 1990-04-12 Nec Corp 半導体装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53106672U (cg-RX-API-DMAC7.html) * 1977-02-01 1978-08-26
JPH02100340A (ja) * 1988-10-06 1990-04-12 Nec Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS5128497B2 (cg-RX-API-DMAC7.html) 1976-08-19

Similar Documents

Publication Publication Date Title
DK133411C (cg-RX-API-DMAC7.html)
DK136056C (cg-RX-API-DMAC7.html)
FR2123369A1 (cg-RX-API-DMAC7.html)
DK136784B (cg-RX-API-DMAC7.html)
FR2122456A1 (cg-RX-API-DMAC7.html)
FR2121798B1 (cg-RX-API-DMAC7.html)
FI47451B (cg-RX-API-DMAC7.html)
DE2153389A1 (cg-RX-API-DMAC7.html)
FR2121804A1 (cg-RX-API-DMAC7.html)
FR2123262A3 (cg-RX-API-DMAC7.html)
CS154865B1 (cg-RX-API-DMAC7.html)
DE2162760A1 (cg-RX-API-DMAC7.html)
FR2137533A1 (cg-RX-API-DMAC7.html)
FR2101523A5 (cg-RX-API-DMAC7.html)
FR2122594B3 (cg-RX-API-DMAC7.html)
DE2105124C3 (cg-RX-API-DMAC7.html)
DK130254C (cg-RX-API-DMAC7.html)
DK130505C (cg-RX-API-DMAC7.html)
FR2123608A5 (cg-RX-API-DMAC7.html)
CS148653B1 (cg-RX-API-DMAC7.html)
CS151117B1 (cg-RX-API-DMAC7.html)
CS161671B2 (cg-RX-API-DMAC7.html)
CS153579B2 (cg-RX-API-DMAC7.html)
CS156740B1 (cg-RX-API-DMAC7.html)
FR2124067A3 (cg-RX-API-DMAC7.html)