JPS4873077A - - Google Patents

Info

Publication number
JPS4873077A
JPS4873077A JP9072A JP9072A JPS4873077A JP S4873077 A JPS4873077 A JP S4873077A JP 9072 A JP9072 A JP 9072A JP 9072 A JP9072 A JP 9072A JP S4873077 A JPS4873077 A JP S4873077A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9072A
Other versions
JPS5128497B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9072A priority Critical patent/JPS5128497B2/ja
Publication of JPS4873077A publication Critical patent/JPS4873077A/ja
Publication of JPS5128497B2 publication Critical patent/JPS5128497B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Dicing (AREA)
JP9072A 1971-12-29 1971-12-29 Expired JPS5128497B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9072A JPS5128497B2 (ja) 1971-12-29 1971-12-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9072A JPS5128497B2 (ja) 1971-12-29 1971-12-29

Publications (2)

Publication Number Publication Date
JPS4873077A true JPS4873077A (ja) 1973-10-02
JPS5128497B2 JPS5128497B2 (ja) 1976-08-19

Family

ID=11464408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9072A Expired JPS5128497B2 (ja) 1971-12-29 1971-12-29

Country Status (1)

Country Link
JP (1) JPS5128497B2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53106672U (ja) * 1977-02-01 1978-08-26
JPH02100340A (ja) * 1988-10-06 1990-04-12 Nec Corp 半導体装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53106672U (ja) * 1977-02-01 1978-08-26
JPH02100340A (ja) * 1988-10-06 1990-04-12 Nec Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS5128497B2 (ja) 1976-08-19

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