JPS4854866A - - Google Patents
Info
- Publication number
- JPS4854866A JPS4854866A JP8951771A JP8951771A JPS4854866A JP S4854866 A JPS4854866 A JP S4854866A JP 8951771 A JP8951771 A JP 8951771A JP 8951771 A JP8951771 A JP 8951771A JP S4854866 A JPS4854866 A JP S4854866A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8951771A JPS5128493B2 (ja) | 1971-11-09 | 1971-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8951771A JPS5128493B2 (ja) | 1971-11-09 | 1971-11-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4854866A true JPS4854866A (ja) | 1973-08-01 |
| JPS5128493B2 JPS5128493B2 (ja) | 1976-08-19 |
Family
ID=13972975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8951771A Expired JPS5128493B2 (ja) | 1971-11-09 | 1971-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5128493B2 (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50126567A (ja) * | 1974-03-26 | 1975-10-04 | ||
| JPS50137470A (ja) * | 1974-04-18 | 1975-10-31 | ||
| JPH0722357A (ja) * | 1990-05-25 | 1995-01-24 | Internatl Business Mach Corp <Ibm> | 半導体ウェーハ一括切断及び切断切子面被覆方法 |
| JP2011046045A (ja) * | 2009-08-26 | 2011-03-10 | Mitsubishi Materials Corp | 分割体製造装置及び製造方法 |
-
1971
- 1971-11-09 JP JP8951771A patent/JPS5128493B2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50126567A (ja) * | 1974-03-26 | 1975-10-04 | ||
| JPS50137470A (ja) * | 1974-04-18 | 1975-10-31 | ||
| JPH0722357A (ja) * | 1990-05-25 | 1995-01-24 | Internatl Business Mach Corp <Ibm> | 半導体ウェーハ一括切断及び切断切子面被覆方法 |
| JP2011046045A (ja) * | 2009-08-26 | 2011-03-10 | Mitsubishi Materials Corp | 分割体製造装置及び製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5128493B2 (ja) | 1976-08-19 |