JPS4852374A - - Google Patents

Info

Publication number
JPS4852374A
JPS4852374A JP8734371A JP8734371A JPS4852374A JP S4852374 A JPS4852374 A JP S4852374A JP 8734371 A JP8734371 A JP 8734371A JP 8734371 A JP8734371 A JP 8734371A JP S4852374 A JPS4852374 A JP S4852374A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8734371A
Other languages
Japanese (ja)
Other versions
JPS5635025B2 (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8734371A priority Critical patent/JPS5635025B2/ja
Publication of JPS4852374A publication Critical patent/JPS4852374A/ja
Publication of JPS5635025B2 publication Critical patent/JPS5635025B2/ja
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
JP8734371A 1971-11-02 1971-11-02 Expired JPS5635025B2 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8734371A JPS5635025B2 (zh) 1971-11-02 1971-11-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8734371A JPS5635025B2 (zh) 1971-11-02 1971-11-02

Publications (2)

Publication Number Publication Date
JPS4852374A true JPS4852374A (zh) 1973-07-23
JPS5635025B2 JPS5635025B2 (zh) 1981-08-14

Family

ID=13912208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8734371A Expired JPS5635025B2 (zh) 1971-11-02 1971-11-02

Country Status (1)

Country Link
JP (1) JPS5635025B2 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53123657A (en) * 1977-04-04 1978-10-28 Nec Corp Production of semiconductor unit
JP2005313188A (ja) * 2004-04-28 2005-11-10 Disco Abrasive Syst Ltd レーザー加工方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8048774B2 (en) * 2001-10-01 2011-11-01 Electro Scientific Industries, Inc. Methods and systems for laser machining a substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53123657A (en) * 1977-04-04 1978-10-28 Nec Corp Production of semiconductor unit
JPS6156617B2 (zh) * 1977-04-04 1986-12-03 Nippon Electric Co
JP2005313188A (ja) * 2004-04-28 2005-11-10 Disco Abrasive Syst Ltd レーザー加工方法

Also Published As

Publication number Publication date
JPS5635025B2 (zh) 1981-08-14

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