JPS4852374A - - Google Patents

Info

Publication number
JPS4852374A
JPS4852374A JP8734371A JP8734371A JPS4852374A JP S4852374 A JPS4852374 A JP S4852374A JP 8734371 A JP8734371 A JP 8734371A JP 8734371 A JP8734371 A JP 8734371A JP S4852374 A JPS4852374 A JP S4852374A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8734371A
Other languages
Japanese (ja)
Other versions
JPS5635025B2 (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8734371A priority Critical patent/JPS5635025B2/ja
Publication of JPS4852374A publication Critical patent/JPS4852374A/ja
Publication of JPS5635025B2 publication Critical patent/JPS5635025B2/ja
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
JP8734371A 1971-11-02 1971-11-02 Expired JPS5635025B2 (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8734371A JPS5635025B2 (cg-RX-API-DMAC10.html) 1971-11-02 1971-11-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8734371A JPS5635025B2 (cg-RX-API-DMAC10.html) 1971-11-02 1971-11-02

Publications (2)

Publication Number Publication Date
JPS4852374A true JPS4852374A (cg-RX-API-DMAC10.html) 1973-07-23
JPS5635025B2 JPS5635025B2 (cg-RX-API-DMAC10.html) 1981-08-14

Family

ID=13912208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8734371A Expired JPS5635025B2 (cg-RX-API-DMAC10.html) 1971-11-02 1971-11-02

Country Status (1)

Country Link
JP (1) JPS5635025B2 (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53123657A (en) * 1977-04-04 1978-10-28 Nec Corp Production of semiconductor unit
JP2005313188A (ja) * 2004-04-28 2005-11-10 Disco Abrasive Syst Ltd レーザー加工方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1677346B1 (en) * 2001-10-01 2011-12-14 Electro Scientific Industries, Inc. Machining substrates, particularly semiconductor wafers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53123657A (en) * 1977-04-04 1978-10-28 Nec Corp Production of semiconductor unit
JP2005313188A (ja) * 2004-04-28 2005-11-10 Disco Abrasive Syst Ltd レーザー加工方法

Also Published As

Publication number Publication date
JPS5635025B2 (cg-RX-API-DMAC10.html) 1981-08-14

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