JPS4849630A - - Google Patents
Info
- Publication number
- JPS4849630A JPS4849630A JP8438271A JP8438271A JPS4849630A JP S4849630 A JPS4849630 A JP S4849630A JP 8438271 A JP8438271 A JP 8438271A JP 8438271 A JP8438271 A JP 8438271A JP S4849630 A JPS4849630 A JP S4849630A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrochemical Coating By Surface Reaction (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8438271A JPS4849630A (ja) | 1971-10-26 | 1971-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8438271A JPS4849630A (ja) | 1971-10-26 | 1971-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4849630A true JPS4849630A (ja) | 1973-07-13 |
Family
ID=13828986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8438271A Pending JPS4849630A (ja) | 1971-10-26 | 1971-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4849630A (ja) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52131721U (ja) * | 1976-03-31 | 1977-10-06 | ||
| JPS53138621U (ja) * | 1977-04-08 | 1978-11-02 | ||
| JPS572899A (en) * | 1980-05-07 | 1982-01-08 | Perkin Elmer Corp | Method and device for electroplating electroconductive substrate |
| JPH0480400A (ja) * | 1990-07-19 | 1992-03-13 | Kaken:Kk | 電気化学的金属表面処理装置 |
| JP2002129400A (ja) * | 2000-10-19 | 2002-05-09 | Fujitsu Ltd | 電解研磨装置及びプレスバリを有する金属被加工物のバリ取り方法 |
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1971
- 1971-10-26 JP JP8438271A patent/JPS4849630A/ja active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52131721U (ja) * | 1976-03-31 | 1977-10-06 | ||
| JPS5636933Y2 (ja) * | 1976-03-31 | 1981-08-31 | ||
| JPS53138621U (ja) * | 1977-04-08 | 1978-11-02 | ||
| JPS5648775Y2 (ja) * | 1977-04-08 | 1981-11-13 | ||
| JPS572899A (en) * | 1980-05-07 | 1982-01-08 | Perkin Elmer Corp | Method and device for electroplating electroconductive substrate |
| JPH0246680B2 (ja) * | 1980-05-07 | 1990-10-16 | Perkin Elmer Corp | |
| JPH0480400A (ja) * | 1990-07-19 | 1992-03-13 | Kaken:Kk | 電気化学的金属表面処理装置 |
| JP2002129400A (ja) * | 2000-10-19 | 2002-05-09 | Fujitsu Ltd | 電解研磨装置及びプレスバリを有する金属被加工物のバリ取り方法 |