JPS4831448A - - Google Patents
Info
- Publication number
- JPS4831448A JPS4831448A JP47081010A JP8101072A JPS4831448A JP S4831448 A JPS4831448 A JP S4831448A JP 47081010 A JP47081010 A JP 47081010A JP 8101072 A JP8101072 A JP 8101072A JP S4831448 A JPS4831448 A JP S4831448A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17114471A | 1971-08-12 | 1971-08-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4831448A true JPS4831448A (fi) | 1973-04-25 |
Family
ID=22622712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47081010A Pending JPS4831448A (fi) | 1971-08-12 | 1972-08-12 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS4831448A (fi) |
| GB (1) | GB1403776A (fi) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS524483B1 (fi) * | 1970-11-13 | 1977-02-04 | ||
| JPS5235114A (en) * | 1970-07-13 | 1977-03-17 | Southwire Co | Aluminium alloy for conductor |
| JPS56164598A (en) * | 1980-05-21 | 1981-12-17 | Fujitsu Ltd | Automatic miniature circuit forming device |
| JPS5825294A (ja) * | 1981-08-07 | 1983-02-15 | 日本電気株式会社 | 印刷配線板の製造方法 |
| JPS59111387A (ja) * | 1982-12-16 | 1984-06-27 | 松下電器産業株式会社 | 厚膜回路パタ−ンの形成方法 |
| JPS59113686A (ja) * | 1982-12-20 | 1984-06-30 | 松下電器産業株式会社 | 厚膜回路の形成方法 |
| JPS6281704A (ja) * | 1985-10-04 | 1987-04-15 | 松下電器産業株式会社 | 厚膜抵抗体の形成方法 |
| JPH01200693A (ja) * | 1988-02-05 | 1989-08-11 | Juki Corp | 厚膜回路形成装置を校正する方法及び装置 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8429754D0 (en) * | 1984-11-24 | 1985-01-03 | Plessey Co Plc | Coating electrical equipment |
| FR2579856B1 (fr) * | 1985-03-28 | 1988-09-16 | Lignes Telegraph Telephon | Dispositif et procede d'ecriture pour la realisation de circuits electriques |
| JPS62154794A (ja) * | 1985-12-27 | 1987-07-09 | ノードソン株式会社 | 実装回路板への防湿絶縁剤の被覆方法 |
-
1972
- 1972-08-12 JP JP47081010A patent/JPS4831448A/ja active Pending
- 1972-08-14 GB GB3776472A patent/GB1403776A/en not_active Expired
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5235114A (en) * | 1970-07-13 | 1977-03-17 | Southwire Co | Aluminium alloy for conductor |
| JPS524483B1 (fi) * | 1970-11-13 | 1977-02-04 | ||
| JPS56164598A (en) * | 1980-05-21 | 1981-12-17 | Fujitsu Ltd | Automatic miniature circuit forming device |
| JPS5825294A (ja) * | 1981-08-07 | 1983-02-15 | 日本電気株式会社 | 印刷配線板の製造方法 |
| JPS59111387A (ja) * | 1982-12-16 | 1984-06-27 | 松下電器産業株式会社 | 厚膜回路パタ−ンの形成方法 |
| JPS6354237B2 (fi) * | 1982-12-16 | 1988-10-27 | Matsushita Electric Ind Co Ltd | |
| JPS59113686A (ja) * | 1982-12-20 | 1984-06-30 | 松下電器産業株式会社 | 厚膜回路の形成方法 |
| JPS6281704A (ja) * | 1985-10-04 | 1987-04-15 | 松下電器産業株式会社 | 厚膜抵抗体の形成方法 |
| JPH0528481B2 (fi) * | 1985-10-04 | 1993-04-26 | Matsushita Electric Ind Co Ltd | |
| JPH01200693A (ja) * | 1988-02-05 | 1989-08-11 | Juki Corp | 厚膜回路形成装置を校正する方法及び装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1403776A (en) | 1975-08-28 |