JPS4822901B1 - - Google Patents

Info

Publication number
JPS4822901B1
JPS4822901B1 JP45038775A JP3877570A JPS4822901B1 JP S4822901 B1 JPS4822901 B1 JP S4822901B1 JP 45038775 A JP45038775 A JP 45038775A JP 3877570 A JP3877570 A JP 3877570A JP S4822901 B1 JPS4822901 B1 JP S4822901B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45038775A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4822901B1 publication Critical patent/JPS4822901B1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
JP45038775A 1969-06-02 1970-05-08 Pending JPS4822901B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82963369A 1969-06-02 1969-06-02

Publications (1)

Publication Number Publication Date
JPS4822901B1 true JPS4822901B1 (en) 1973-07-10

Family

ID=25255069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45038775A Pending JPS4822901B1 (en) 1969-06-02 1970-05-08

Country Status (5)

Country Link
US (1) US3661761A (en)
JP (1) JPS4822901B1 (en)
DE (1) DE2026321A1 (en)
FR (1) FR2052341A5 (en)
GB (1) GB1294025A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50119203U (en) * 1974-03-14 1975-09-29
JPS536963Y2 (en) * 1973-05-08 1978-02-22
JPS5441522Y2 (en) * 1973-10-25 1979-12-05

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3767559A (en) * 1970-06-24 1973-10-23 Eastman Kodak Co Sputtering apparatus with accordion pleated anode means
FR2119930B1 (en) * 1970-12-31 1974-08-19 Ibm
US4036723A (en) * 1975-08-21 1977-07-19 International Business Machines Corporation RF bias sputtering method for producing insulating films free of surface irregularities
GB1544172A (en) * 1976-03-03 1979-04-11 Int Plasma Corp Gas plasma reactor and process
US4035276A (en) * 1976-04-29 1977-07-12 Ibm Corporation Making coplanar layers of thin films
US4029562A (en) * 1976-04-29 1977-06-14 Ibm Corporation Forming feedthrough connections for multi-level interconnections metallurgy systems
DE2705611A1 (en) * 1977-02-10 1978-08-17 Siemens Ag METHOD OF COVERING A FIRST LAYER OR SEQUENCE OF LAYERS ON A SUBSTRATE WITH A FURTHER SECOND LAYER BY SPUTTERING
US4153528A (en) * 1978-06-26 1979-05-08 International Business Machines Corporation Contoured quartz anode plate
DE3165961D1 (en) * 1980-05-12 1984-10-18 Fujitsu Ltd Method and apparatus for plasma etching
US4396458A (en) * 1981-12-21 1983-08-02 International Business Machines Corporation Method for forming planar metal/insulator structures
CA1247464A (en) * 1985-05-13 1988-12-28 Hiroaki Nakamura Method for forming a planarized thin film
US6248219B1 (en) * 1986-06-23 2001-06-19 Unaxis Balzers Aktiengesellschaft Process and apparatus for sputter etching or sputter coating
CH668565A5 (en) * 1986-06-23 1989-01-13 Balzers Hochvakuum METHOD AND ARRANGEMENT FOR SPRAYING A MATERIAL AT HIGH FREQUENCY.
US4756810A (en) * 1986-12-04 1988-07-12 Machine Technology, Inc. Deposition and planarizing methods and apparatus
US5490910A (en) * 1992-03-09 1996-02-13 Tulip Memory Systems, Inc. Circularly symmetric sputtering apparatus with hollow-cathode plasma devices
US6942764B1 (en) 1995-08-24 2005-09-13 Taiwan Semiconductor Manufacturing Company, Ltd. Arc-sprayed shield for pre-sputter etching chamber
US6342135B1 (en) 1995-11-02 2002-01-29 Taiwan Semiconductor Manufacturing Company Sputter etching chamber with improved uniformity
US6436253B1 (en) 1998-05-20 2002-08-20 Taiwan Semiconductor Manufacturing Company Sputter etching chamber with improved uniformity
US6475400B2 (en) 2001-02-26 2002-11-05 Trw Inc. Method for controlling the sheet resistance of thin film resistors
US20040226516A1 (en) * 2003-05-13 2004-11-18 Daniel Timothy J. Wafer pedestal cover
JP5648189B2 (en) * 2008-11-24 2015-01-07 エリコン アドバンスド テクノロジーズ アーゲー High frequency sputtering equipment
KR101641398B1 (en) * 2008-12-23 2016-07-20 에바텍 어드벤스드 테크놀로지스 아크티엔게젤샤프트 Rf sputtering arrangement
TW201425615A (en) * 2012-12-24 2014-07-01 Hon Hai Prec Ind Co Ltd Electrode and film coating device
US11469085B2 (en) 2016-12-27 2022-10-11 Evatec Ag Vacuum plasma workpiece treatment apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS536963Y2 (en) * 1973-05-08 1978-02-22
JPS5441522Y2 (en) * 1973-10-25 1979-12-05
JPS50119203U (en) * 1974-03-14 1975-09-29

Also Published As

Publication number Publication date
US3661761A (en) 1972-05-09
DE2026321A1 (en) 1970-12-10
FR2052341A5 (en) 1971-04-09
GB1294025A (en) 1972-10-25

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