JPH1197811A - Structure for display section of printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the efficiency of a displaying work, allow a display face to recognized be more easily, and increase the workability in manufacturing, by forming a resist printed layer on a substrate, then forming a silk printed layer on part of the resist printed layer corresponding to a display face, and displaying the information about printed wiring board on the silk printed layer. SOLUTION: On a printed wiring board 1, electronic components such as integrated circuits and capacitors mounted and are connected by a printed pattern 4 to. constitute a circuit function. On a display face 2 of the wiring board 1, the design revision at the time of designing the circuit to show the type of the circuit function is displayed by pasting a label 6 or sealing. In this case, a resist printed layer 8, in which a printed pattern 4 is to be formed is formed on the entire surface of a substrate 1a of the printed board 1, and then a silk printed layer 9 is formed flat on part of the resist printed layer 8 to print out that part of the resist printed layer 8, and over that, a label 6 is pasted or sealed by ink. Thus, by showing the display section through the silk printed layer, the perception of the display face can be enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display structure of a printed wiring board for displaying a design revision, a production lot number, a production number, and the like on a printed wiring board used for electronic equipment and the like.

[0002]

2. Description of the Related Art Various electronic components constituting an electronic circuit are mounted on a printed wiring board, and these electronic components are wired and connected by a printed pattern. Generally, the printed wiring board displays the design revision (revision number) at the time of circuit design, the lot number and the manufacturing number at the time of assembly and manufacturing, etc. by character stamping or labeling. Managing.

FIG. 8 and FIG. 9 are a plan view showing a display portion structure of a conventional printed wiring board and a cross-sectional view taken along the line BB of FIG. In FIG. 1, display surfaces 2 and 3 for displaying a serial number and the like on a printed wiring board 1 do not cover the printed patterns 4 and 5 at positions not covering electronic components (integrated circuit IC, capacitor C, resistor R, etc.). It is provided at a position that does not affect the mounting of the electronic device to the electronic device body, and at a position that can be visually recognized. The positions of the display surfaces 2 and 3 and their directions are clearly shown in the assembly drawing, and the operation of attaching the label 6 or stamping 7 is performed.

On the printed wiring board 1, only the space is provided, and the display surfaces 2 and 3 are clearly displayed on the assembly drawings without displaying anything. Display surfaces 2 and 3 are resist printed layers 8
Are provided on the non-resist print layer from which the display surfaces 2 and 3 have been removed.
Patterns 4 and 5 are wired so as to avoid the above.

[0005]

In the above-mentioned conventional example,
The display surfaces 2 and 3 are formed on a non-resist print layer, and the display is performed by attaching a label 6 or applying a seal 7 on the substrate 1a. Therefore, when the color of the substrate 1a of the printed wiring board 1 is similar to the surface color of the resist print layer 8, there is a disadvantage that the recognizability of the display surfaces 2 and 3 is reduced.

Further, when the display positions are two or more, as in the case of the display surfaces 2 and 3, it is easy to be confused as to which display to display. Is inconvenient.

Further, as the size of the electronic device is reduced, the size of the printed wiring board 1 is also reduced and the density thereof is increased. Therefore, it is difficult to secure a space for the display surfaces 2 and 3. For this reason, it is becoming difficult to wire the print patterns 4 and 5 avoiding the display surfaces 2 and 3.

The present invention has been made in order to solve such a conventional problem, and has a high recognizability of a display surface, a high workability even in a case where there are a plurality of display surfaces, and a small size.
An object of the present invention is to provide a display unit structure of a printed wiring board suitable for high-density mounting.

[0009]

According to a first aspect of the present invention, there is provided a display unit structure of a printed wiring board, wherein a resist print layer is provided on a substrate, and a silk print layer is provided at a position of the display surface on the resist print layer. The information on the printed wiring board is displayed by stamping or labeling on the silk print layer.

According to the present invention, the position at which the information on the printed wiring board is displayed is displayed by the silk print layer, so that the recognizability of the position of the display surface is improved, and the display position is not specified in the assembly drawing. Alternatively, the display operation can be performed without looking at the assembly drawing.

According to a second aspect of the present invention, there is provided a display unit structure for a printed wiring board according to the first aspect, wherein the silk print layer has an asymmetrical shape on the left, right, front and rear, and the shape of information to be displayed by this shape. It is configured to indicate the display direction.

According to the present invention, it is possible to easily recognize the display direction of information to be displayed, for example, character information, based on the shape of the silk print layer, and it is possible to prevent an error during the display operation.

According to a third aspect of the present invention, there is provided a display portion of a printed wiring board according to the first aspect, wherein the silk print layer has an asymmetrical shape on the left, right, front and back, and the shape of the information to be displayed by this shape. It is configured to indicate the type.

According to the present invention, the type displayed by the shape of the silk print layer, for example, the type of display such as a design revision at the time of circuit design, a lot number and a serial number at the time of assembly and manufacture can be easily recognized. It is possible to prevent mistakes during work.

According to a fourth aspect of the present invention, in the display portion structure of the printed wiring board according to the first aspect of the present invention, the silk print layer is formed to have a planar surface, and a stamped or labeled display is provided on the surface. It is configured to perform the following.

According to the present invention, when there is no space for securing a display surface and display is performed on a print pattern, the surface of the print pattern is painted out with a silk print layer, formed into a planar shape, and stamped or displayed thereon. By performing labeling display, the display can be performed without affecting the print pattern.

[0017]

FIG. 1 is a plan view showing an embodiment of a display portion structure of a printed wiring board according to the present invention, and FIG. 2 is a sectional view taken along the line AA in FIG. Note that FIG.
The same parts as those shown in FIG. 9 are denoted by the same reference numerals and described.

In the present embodiment, the printed wiring board 1
Are mounted with electronic components such as an integrated circuit IC, a capacitor C, and a resistor R.
5 to form a circuit function.

On the display surface 2 of the printed wiring board 1,
A design revision is displayed at the time of circuit design to indicate the form of the circuit function, and a lot number is displayed on the display surface 3 to indicate a lot number at the time of manufacture. And display surface 2
Are displayed on the label 6 and pasted, and the display surface 3 is marked with black ink 7 to provide two types of display.

As shown in FIG. 2, the display surface 2 is provided with a resist print layer 8 for applying a print pattern 4 on the entire surface of the substrate 1a of the printed wiring board 1, and the inner surface of the resist print layer 8 is painted over to form a surface. A rectangular silk print layer 9 is formed,
The structure is such that a label 6 is attached thereon. Similarly, the display surface 3 has a configuration in which a seal 7 is formed on the rectangular silk print layer 10 with black ink.

As shown in an exploded perspective view of FIG. 3, the upper left corner and the upper right corner of the display surface 2 are provided with chamfers 9a and 9b in the silk printing layer 9 to provide a silk screen. A chamfered portion 10a is provided at the lower left corner in the drawing of the printing layer 10, and the display surfaces 2 and 3 are each asymmetrical with respect to the center.

The positions of the chamfers 9a, 9b and 10a indicate the directionality of the characters displayed on the display surfaces 2 and 3. In FIG. 3, when viewed from the displayed character direction,
The upper left chamfers 9a and 10a with respect to the longitudinal direction of the silk print layers 9 and 10 are recognized as the starting positions of the characters.

The silk printed layers 9 and 10 have different shapes depending on the presence or absence of the upper right chamfered portion 9b, and it can be recognized that different characters are displayed by the different shapes. In FIG. 3, a display “02” of the design revision at the time of circuit design is performed on the display surface 2, and a lot number display “A1101” at the time of manufacture is performed on the display surface 3.

As described above, when a plurality of display surfaces are provided on one printed wiring board, the character direction can be recognized by the shapes of the silk printed layers 9 and 10, and the display type can be recognized by the number of chamfered portions. ing.

The display position of the design revision at the time of circuit design or the display position of the lot number at the time of manufacture according to the present embodiment may be reversed, and can be arbitrarily determined. The position of the chamfered portion and the character direction with respect to the chamfered portion may be other positions and other character directions.

FIGS. 4 to 6 are plan views showing another embodiment of the silk print layer 9 forming the display surface 2. FIG. The silk print layer 9 shown in FIG.
A chamfered portion 9c is provided in the lower left corner below "a", and the shape on both sides is vertically asymmetric with respect to the center so that the direction can be recognized.

FIGS. 5 and 6 show a case where a silk print layer 9 is provided on the print pattern 4. This is for responding to the miniaturization and high density of the electronic device, and it is difficult to secure the space of the display surface 2 and it is difficult to avoid the pattern 4 from the display surface 2. Therefore, the pattern 4 is provided on the pattern 4. Things.

FIG. 7 is a flowchart showing the steps of manufacturing the printed wiring board 1. The manufacturing process of the printed wiring board 1 is divided into a printed wiring board manufacturing process and an assembly process. The printed wiring board manufacturing process includes manufacturing a copper-clad laminate (step S
1), drilling (step S2), pattern printing (step S3), etching (step S4), plating (step S5), resist printing (step S6), silk printing (step S7), outer shape and V groove processing (step) S
8), check (step S9), and surface treatment (step S10).

The assembling process includes automatic mounting of components (step S11), automatic soldering (step S12), mounting of retrofitted components (step S13), and inspection (step S1).
The printed wiring board for the electronic device is completed by the steps 4) (Step S15).

The formation of the silk printing layers 9 and 10 described above
This is performed in the silk printing process of step S7. The marking or labeling on the display surfaces 2 and 3 is performed in a post-attachment component mounting step of step S13.

[0031]

According to the present invention, the position of the marking display or label pasting display on the printed wiring board is indicated by the silk print layer, so that the display surface can be more easily recognized than the conventional non-resist print layer. It is possible to recognize even if it is not specified in the assembly drawing at the time of manufacture or without looking at the assembly drawing,
The efficiency of display work can be improved.

Further, according to the present invention, the shape of the silk print layer is asymmetric with respect to the center, and the direction of the character to be displayed can be indicated by this shape. A wrong display direction can be prevented.

Further, according to the present invention, the type to be displayed by the shape of the silk print layer, for example, the design revision at the time of circuit design, the lot number and the serial number at the time of assembly and manufacture, etc. can be easily recognized, and the display operation can be performed. The mistake at the time can be prevented.

Further, according to the present invention, when there is no display space and display is performed on a print pattern, the display of the print pattern is filled with a silk print layer, formed into a planar shape, and a seal display or label is formed thereon. By performing the pasting display, the display can be performed without affecting the print pattern by the ink or label of the seal.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of the present invention.

FIG. 2 is a cross-sectional view in the direction of arrows AA shown in FIG.

FIG. 3 is an exploded perspective view of the display unit structure shown in FIG.

FIG. 4 is a plan view showing an embodiment of the present invention.

FIG. 5 is a plan view showing an embodiment of the present invention.

FIG. 6 is a plan view showing an embodiment of the present invention.

FIG. 7 is a flowchart showing a manufacturing process of the printed wiring board.

FIG. 8 is a plan view showing a display unit structure of a conventional printed wiring board.

9 is a cross-sectional view in the direction of arrows BB shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed wiring board 1a Substrate 2, 3 Display surface 4, 5 Print pattern 6 Label 7 Sealing 8 Resist printing layer 9, 10 Silk printing layer 9a, 9b, 9c, 10a Chamfer part

Claims (4)

[Claims] 1. A resist printing layer is provided on a substrate, and a silk printing layer is provided on a position of a display surface on the resist printing layer.
A display structure of a printed wiring board, wherein information on the printed wiring board is displayed by stamping or labeling on the silk print layer. 2. The display unit structure of a printed wiring board according to claim 1, wherein the silk print layer has an asymmetric shape in the left and right or front and rear directions, and indicates a display direction of information to be displayed by the shape. 3. The display unit structure of a printed wiring board according to claim 1, wherein the silk print layer has an asymmetric shape in the left and right or front and back, and indicates a type of information to be displayed by the shape. 4. The display part structure of a printed wiring board according to claim 1, wherein the silk printed layer has a surface formed in a planar shape, and displays a seal or a label on the surface.