JP4631988B2 - Circuit board - Google Patents

Description

  The present invention relates to a circuit board to which paper, a plastic sheet or the like is attached.

  2. Description of the Related Art Conventionally, in an electronic device such as a mobile phone device, a name plate on which a serial number is written is attached to a predetermined position inside or outside the electronic device so that the name plate can be seen as necessary. In many foldable mobile phone devices, a nameplate is stuck inside.

  The state of sticking the nameplate of the conventional foldable mobile phone device 80 will be described with reference to FIGS. 9 shows a left side view of the foldable mobile phone device 80, and FIG. 10 shows a perspective view when the foldable mobile phone device 80 is turned over, the battery cover is removed, and the battery is taken out.

  The foldable mobile phone device 80 connects the first housing 10 provided with a liquid crystal display unit (not shown) and the second housing 20 provided with an operation unit (not shown) with a hinge 30, as shown by arrows in FIG. 9. It can be opened and closed. A battery 40 is accommodated in the second housing 20. The nameplate 60 on which the production number and the like are written is attached to the area facing the space in which the battery 40 is stored.

  As shown in FIG. 10, the second housing 20 constitutes one housing by combining the upper housing 20 a and the lower housing 20 b vertically. A rectangular hole 20c for inserting and removing the battery 40 is formed in the lower housing 20b, and a battery cover 20d that closes the hole 20c is detachably attached. When the battery cover 20d is removed and the battery 40 is taken out, the nameplate 60 can be seen from the hole 20c.

  Conventionally, a partition wall 20e that partitions the battery 40 and a circuit board (hereinafter referred to as a printed board) 70 inside the lower housing 20b has been used as a plane portion on which the nameplate 60 is pasted. If the lower housing 20b has the partition wall 20e, not only the strength of the lower housing 20b is secured, but the partition wall 20e made of plastic is a smooth flat surface, and the nameplate 60 can be applied beautifully and in a good-looking manner. it can. However, depending on the method of work, air bubbles may enter between the nameplate 60 and the partition wall 20e, or may be attached obliquely to the original attachment position. In this case, depending on the viewer, the impression is that the way to make the product is complicated and there is no dignity. For this reason, when applying the nameplate 60, it has been required to correctly apply the nameplate 60 to the original attaching position so that air bubbles do not enter.

  As countermeasures against air bubbles when pasting the nameplate 60, conventionally, an adhesive previously applied to the back of the nameplate of paper or plastic sheet is not applied to the entire surface, and no adhesive is applied to a part. A method of forming an adhesive part and using a non-adhesive part as an air vent passage has been adopted. FIG. 11 (a) to FIG. 11 (d) show the pattern of the adhesive on the back of the nameplate. In FIG. 11 (a), a sticking agent is applied to the back surface portion 61 of the nameplate 60a, and non-adhesive portions 62 to which the sticking agent is not applied are formed in a plurality of thin streaks at predetermined intervals in the lateral direction. ing. In FIG.11 (b), the thin stripe-shaped non-adhesion part 62 is formed in the back face of the nameplate 60b at the grid | lattice form which opened the predetermined space | interval vertically and horizontally. In FIG.11 (c), the thin stripe-shaped non-adhesion part 62 is formed in the diagonal grid | lattice form in the back surface of the nameplate 60c. In FIG.11 (d), when the sticking agent is apply | coated to the back surface of the nameplate 60d, the non-adhesion part 62 which has not applied the sticking agent is formed widely, and when applying the nameplate 60, The air under the nameplate 60 could be pushed out of the nameplate 60 from the air vent passage formed by these non-adhesive portions 62 (see, for example, Patent Document 1).

  In addition, without using an adhesive on the nameplate in advance, an insulating sheet is used to attach the nameplate to the nameplate, and it is formed as an insulating sheet with an air escape groove with a non-adhesive part formed between the adhesive parts of the insulating sheet. It has also been proposed to attach an insulating sheet first and then a nameplate on the insulating sheet.

  When affixing the nameplate to the insulation sheet, air can escape from the multiple air vent passages leading to the outer edge of the nameplate where the adhesive is not applied, preventing air bubbles from entering the nameplate. It was.

Japanese Utility Model Publication No. 61-201232

  On the other hand, electronic devices such as a foldable mobile phone device have been reduced in size and weight, and recently, a reduction in thickness has been demanded. One way to make electronic devices such as foldable mobile phone devices thinner is to eliminate the conventional partition wall that separates the battery from the printed circuit board inside the lower housing, and attach the nameplate directly to the printed circuit board. In this case, the thickness can be reduced by the thickness of the partition wall.

  When the above-described thinning is performed, the name plate is attached to a printed circuit board that is originally uneven, unlike the case where the name plate is attached to a smooth flat surface of a partition wall made of plastic. Therefore, there arises a problem that air bubbles are easily formed between the nameplate and the printed board. However, in the conventional method of forming a non-adhesive part that does not apply an adhesive on the back of the nameplate and using it as an air vent passage, if the unevenness of the printed board does not match the application pattern of the adhesive on the back of the nameplate, the printed board And the nameplate sticking agent do not come into contact with each other, and the sticking power as a whole is reduced, and it is difficult to stick so as not to leave bubbles.

  An object of the present invention is to prevent air from being left under the nameplate by taking measures on the printed circuit board side to allow air to escape when the nameplate is attached to the printed board.

  The present invention includes a circuit board, a polygonal seal, a pattern composed of a plurality of wirings or resist provided on the circuit board, and a resist covering a part of the pattern, and at least one side of the seal is a pattern. It is configured to be stuck so as to straddle the resist.

  With this configuration, when the nameplate with the adhesive applied on the back side is affixed to the resist-side surface of the substrate, the air sandwiched between the nameplate and the resist on the substrate is separated from the air vent pattern formed on the resist by the air vent pattern. Since it escapes to the outer space, no bubbles remain under the nameplate.

  Further, in the present invention, the part to which the seal is adhered is composed of a pattern and a resist covering the pattern, and the part where the seal straddles the pattern and the resist is formed by the first groove part formed by the pattern and the resist. It is comprised by the 2nd groove part.

  With this configuration, the outer side of the outer surface of the nameplate is covered with the resist, and the metal portion that is the wiring portion of the substrate does not appear on the surface. Further, the inner side of the outer shape of the nameplate covers the metal portion of the substrate with the nameplate. This protects the metal part and suppresses metal corrosion.

  When the nameplate with the adhesive applied on the back side is affixed to the resist side of the printed circuit board, the air sandwiched between the nameplate and the resist on the printed circuit board is the space around the outer surface of the nameplate from the pattern of air passages formed on the resist. Run away. With this configuration, there is an effect that bubbles do not remain under the nameplate.

  In the present invention, the metal portion of the printed board is covered with a nameplate for protection, and the metal corrosion is suppressed.

  Moreover, if the present invention in which the nameplate is directly attached to the printed circuit board is applied to an electronic device such as a foldable mobile phone device, the partition wall that separates the conventional battery from the printed circuit board inside the lower housing is eliminated. There is an effect that the thickness can be reduced by the thickness of the wall.

The top view which shows the printed circuit board and nameplate concerning Embodiment 1 of this invention The fragmentary sectional view when a nameplate is stuck on the printed circuit board concerning Embodiment 1 of this invention Partial sectional view when a nameplate is affixed to another printed circuit board according to the first embodiment of the present invention. The top view which shows the printed circuit board and nameplate concerning Embodiment 2 of this invention Partial sectional view when a nameplate is stuck on a printed circuit board according to Embodiment 2 of the present invention The top view which shows the printed circuit board and nameplate concerning Embodiment 3 of this invention Partial sectional view when a nameplate is stuck on a printed circuit board according to Embodiment 3 of the present invention The top view which shows the printed circuit board and nameplate concerning Embodiment 4 of this invention Left side view of a conventional folding mobile phone device A perspective view of the conventional foldable mobile phone device with the battery cover and battery removed The figure which shows the application pattern of the pasting agent of the nameplate

  The best mode for carrying out the present invention will be described below with reference to the drawings.

(Embodiment 1)
FIG. 1 is a plan view showing a state in which a printed circuit board according to Embodiment 1 of the present invention and a nameplate attached to the printed circuit board are arranged. The printed circuit board 5a according to the first embodiment of the present invention is provided with a rectangular circuit pattern 51a on an epoxy resin plate 50a, and a resist (the metal surface of the circuit pattern is not brought into direct contact with external air on the printed circuit board 5a. Insulating layer) 52a is formed. The epoxy resin plate 50a has a thickness of about 1 mm, the circuit pattern 51a has a thickness of about 100 μm, and the resist 52a has a thickness of about 35 μm.

  As a method of making a printed board, it is a common practice to make a three-layer structure of an epoxy resin plate, a circuit pattern, and a resist in this way, but in the printed board 5a according to Embodiment 1 of the present invention, in particular A feature is that a thin space communicating with the surface of the resist 52a is formed. That is, in FIG. 1, the grooves 7 shown in a lattice shape are formed by making the thickness of the resist 52a thinner than other resist regions. Four grooves 7 having a width of about 1 mm are arranged in parallel in the vertical direction, and three grooves 7 are arranged in parallel in the horizontal direction, and these are intersected to form a space communicating with each other. The lengths of the lattice-shaped grooves 7 in the vertical direction and the horizontal direction are longer than the lengths of the name plate 6 in the vertical direction and the horizontal direction, respectively. Therefore, when the nameplate 6 is stuck on the lattice-shaped groove portion 7, the tip end portion of the lattice-shaped groove portion 7 protrudes outside the nameplate 6.

  When the nameplate 6 is affixed to the position shown by the two-dot chain line on the resist 52a of the printed board 5a, that is, on the printed board 5a in FIG. The air sandwiched between 5a and the name plate 6 escapes to the outside of the name plate 6 through the space of the communicating groove portion 7.

  FIG. 2 is a cross-sectional view showing a state in which the nameplate 6 is stuck on the printed circuit board 5a by being pressed in order from the left end toward the right end. FIG. 2 shows an AA cross section of the printed circuit board 5a of FIG. Further, in FIG. 2, for easy understanding of the present invention, the region of the lattice-like groove portion 7 of the resist 52a will be described by showing an extreme case in which the resist is completely removed and the thickness is zero.

  In FIG. 2, the printed circuit board 5a is provided with a circuit pattern 51a on an epoxy resin plate 50a, and a resist 52a is formed thereon. Between the resists, there are lattice-like grooves 7 where no resist is provided. When the nameplate 6 is pasted on the resist 52a from the left end toward the right end, the air sandwiched between the resist 52a and the nameplate 6 moves as indicated by a right-pointing arrow. When the right end of the nameplate 6 is pasted, the air sandwiched between the resist 52a and the nameplate 6 escapes to the right. In FIG. 2, the thickness of the resist 52a and the height of the groove portion 7 are exaggerated for the sake of clarity. However, as described above, the groove portion 7 has a groove width of about 1 mm. The thickness is about 35 μm (= 0.035 mm). After the nameplate 6 is once applied to the entire surface of the resist 52a, the position corresponding to the groove portion 7 of the nameplate 6 is pressed outward from the center of the nameplate 6 in particular. If so, even a small amount of air remaining in the position corresponding to the groove portion 7 can be pushed out. For this reason, if the operation of pressing the nameplate 6 once from the center of the nameplate 6 after the resist 52a is pasted on the entire surface, small bubbles are left even at positions corresponding to the grooves 7 of the nameplate 6. Without sticking, the adhesive on the back of the nameplate 6 can be attached to the resist 52a.

  FIG. 3 shows a cross-sectional view of the printed circuit board when the thickness of the resist 52b in the region of the lattice-like groove 7 is made thinner than the resist in other regions. As a method of forming regions having different thicknesses on the resist, a resist having a predetermined thickness is applied once on the entire surface of the printed circuit board, and then a resist having a predetermined thickness is applied only to regions other than the grid-like grooves 7. There is a method of applying twice. Even in the case shown in FIG. 3, as in the case shown in FIG. 2, when the name plate 6 is pasted on the resist 52b from the left end to the right end, the air sandwiched between the resist 52b and the name plate 6 is used. Moves as indicated by the right arrow. When the right end of the nameplate 6 is pasted, the air sandwiched between the resist 52b and the nameplate 6 escapes to the right. And the effect that a bubble does not remain under the nameplate 6 is acquired.

(Embodiment 2)
Next, a printed circuit board according to Embodiment 2 of the present invention will be described. In addition, about the same location as Embodiment 1, the same number is attached | subjected and description is abbreviate | omitted. FIG. 4 is a plan view showing a state in which a printed board according to Embodiment 2 of the present invention and a nameplate attached to the printed board are arranged.

  In the printed circuit board 5c according to Embodiment 2 of the present invention, elongated circuit patterns 51c are provided in parallel on an epoxy resin plate 50c, and a resist 52c is formed thereon. The resist 52c has a plurality of thin grooves 8 arranged in parallel along the elongated circuit pattern 51c. The narrow groove 8 has a width of about 1 mm and a length longer than the corresponding length of the nameplate 6. The epoxy resin plate 50c has a thickness of about 1 mm, the circuit pattern 51c has a thickness of about 100 μm, and the resist 52c has a thickness of about 35 μm.

  FIG. 5 shows a cross-sectional view of the state after the nameplate 6 is stuck on the printed circuit board 5c. FIG. 5 shows a cross-sectional view of the printed circuit board 5c of FIG. 4 taken along the line BB. In FIG. 5, a printed circuit board 5c is provided with a circuit pattern 51c on an epoxy resin plate 50c, and a resist 52c is formed thereon. The resist 52c is formed with the same thickness both where the circuit pattern 51c on the printed circuit board 5c is present and where it is not. The fact that the circuit pattern 51c on the printed circuit board 5c is formed with the same thickness in both the places where the circuit pattern 51c is present and the absence of the circuit pattern 51c on the printed circuit board 5c as shown in FIG. The surface of 52c is low. This lowered portion forms a narrow groove 8. As shown in FIG. 5, when the name plate 6 is pasted on the resist 52 c, a space is created between the name plate 6 and the narrow groove portion 8.

  When the nameplate 6 is attached along the groove portion 8 from the lower end to the upper end of the nameplate 6 shown in FIG. 4, for example, the air sandwiched between the nameplate 6 and the resist 52c is separated from the nameplate 6 by using the narrow groove portion 8 as an air vent groove. Go through. After the nameplate 6 is once applied to the entire surface of the resist 52c, if the position corresponding to the groove portion 8 of the nameplate 6 is pressed outward from the center of the nameplate 6, it remains at the position corresponding to the groove portion 8. Even a slight amount of air can be pushed out, and the adhesive on the back surface of the nameplate 6 can be attached to the resist 52c at a position corresponding to the groove 8 of the nameplate 6.

(Embodiment 3)
As described above, the representative embodiments of the present invention have been described in the first embodiment and the second embodiment. However, various circuit patterns are formed on an actual printed board. In this embodiment, a lattice-shaped groove shown in the first implementation, or a combination of thin stripe-like groove shown in the second embodiment, or to form a diagonal groove and tortuous groove in some cases You may do it.

  In the third embodiment, if the circuit pattern is covered with resist to prevent corrosion at the outer edge of the place where the nameplate is attached, grooves cannot be formed and air is difficult to escape. Therefore, as shown in FIG. A groove 8 that is not provided with the circuit pattern 51d is provided at the tip of the groove 7 formed of resist.

  The groove portion 7 formed of a resist on the circuit pattern is configured as shown in the AA sectional view of FIG. 2 described in the first embodiment. On the other hand, the groove 8 not provided with the circuit pattern 51d is configured as shown in the BB cross-sectional view of FIG. 5 described in the second embodiment.

  If the groove portion 8 not provided with the circuit pattern 51d is formed at the tip of the groove portion 7 where the resist is not provided and communicated with the groove portion 7, a space for removing air is taken, and air easily escapes. FIG. 7 is a sectional view taken along the line CC in FIG. FIG. 7 shows a state where the air pushed out along the groove portion 7 goes out of the nameplate 6 from the groove portion 8.

  As described above, according to the present invention, when the nameplate with the adhesive applied to the back surface is applied to the resist-side surface of the printed circuit board, conventionally, the air sandwiched between the nameplate and the resist of the printed circuit board is formed in the resist. Because the air escapes from the air vent pattern to the outer space of the nameplate, no bubbles remain under the nameplate.

  Further, according to the present invention, the groove can be formed only by the resist near the outer edge of the nameplate, and the inner side of the nameplate attaching portion can be protected by covering the circuit pattern with the nameplate, thereby suppressing metal corrosion.

  If the present invention is applied to an electronic device such as a foldable mobile phone device, the partition wall separating the battery and the printed circuit board inside the lower housing is eliminated, and the thickness is reduced by the thickness of the partition wall. be able to.

  In addition to simply reducing the thickness, for example, by attaching a slightly thick waterproof nameplate made of a plastic sheet to a printed circuit board and bringing the bottom of the hole 20c shown in FIG. It is possible to prevent water from entering the electronic device from 20c. In addition, a waterproof function can be added to protect the internal printed circuit board and the mounted electronic components from being wet.

(Embodiment 4)
As a fourth embodiment, a case where radial grooves are provided in a resist will be described. FIG. 8 is a plan view when the printed circuit board and the nameplate according to Embodiment 4 of the present invention are arranged. As shown in FIG. 8, the printed circuit board 5e is provided with a rectangular circuit pattern 51e, and a resist 52e is provided thereon. In the resist 52e, thin grooves 7 not provided with a resist are arranged in a radial pattern. If the nameplate 6 coated with the adhesive is superimposed on the resist 52e and pressed from the center to the outside, the air sandwiched under the nameplate 6 becomes narrow grooves 7 arranged in a radial pattern. To the outside of the nameplate 6. Further, if the radial grooves 7 are pressed outward from the center, the air slightly remaining in the narrow grooves 7 can be pushed out to the outside of the nameplate. Eventually, if the printed circuit board according to the fourth embodiment is used, no bubbles remain under the nameplate, and the nameplate can be affixed cleanly and nicely on the printed circuit board.

  Although the lattice-like pattern and the radial pattern have been described as the air vent pattern of the present invention, the present invention is not limited to this, and an oblique lattice-like pattern or a dot-like pattern may be used. . If it is a pattern which leads to the area | region which is not covered at least from the area | region where a circuit board is covered with a nameplate, it will function as an air vent pattern of this invention.

  Moreover, although the nameplate was demonstrated as an example as an affixing member of this invention, if it is seals, such as paper and a plastic sheet, not only a nameplate but what kind of seal can be applied.

  Since the present invention can be applied when the nameplate is to be applied to the circuit board neatly and nicely, it can be applied to various machines such as an electronic device such as a mobile phone device for attaching the nameplate to the circuit board, and a control panel of a large machine. Can also be applied.

5 Printed circuit board 6 Name plate 7, 8 Groove 51 Circuit pattern 52 Resist

Claims (1)

A circuit board having a circuit pattern and a resist on the circuit pattern, and having a polygonal seal covering a part of the resist and the circuit pattern,
A first groove not provided with the resist on the circuit pattern;
A second groove formed with the resist on a portion where the circuit pattern is not provided ,
The circuit board, wherein the first groove portion and the second groove portion communicate with each other, and only the second groove portion protrudes from a region where the seal is attached.

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