JPH1187733A5 - - Google Patents

Info

Publication number
JPH1187733A5
JPH1187733A5 JP1997268156A JP26815697A JPH1187733A5 JP H1187733 A5 JPH1187733 A5 JP H1187733A5 JP 1997268156 A JP1997268156 A JP 1997268156A JP 26815697 A JP26815697 A JP 26815697A JP H1187733 A5 JPH1187733 A5 JP H1187733A5
Authority
JP
Japan
Prior art keywords
semiconductor film
forming
heat treatment
amorphous semiconductor
boron
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1997268156A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1187733A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP26815697A priority Critical patent/JPH1187733A/ja
Priority claimed from JP26815697A external-priority patent/JPH1187733A/ja
Publication of JPH1187733A publication Critical patent/JPH1187733A/ja
Publication of JPH1187733A5 publication Critical patent/JPH1187733A5/ja
Withdrawn legal-status Critical Current

Links

JP26815697A 1997-09-11 1997-09-11 半導体装置の作製方法 Withdrawn JPH1187733A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26815697A JPH1187733A (ja) 1997-09-11 1997-09-11 半導体装置の作製方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26815697A JPH1187733A (ja) 1997-09-11 1997-09-11 半導体装置の作製方法

Publications (2)

Publication Number Publication Date
JPH1187733A JPH1187733A (ja) 1999-03-30
JPH1187733A5 true JPH1187733A5 (cg-RX-API-DMAC7.html) 2005-06-02

Family

ID=17454687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26815697A Withdrawn JPH1187733A (ja) 1997-09-11 1997-09-11 半導体装置の作製方法

Country Status (1)

Country Link
JP (1) JPH1187733A (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000208771A (ja) 1999-01-11 2000-07-28 Hitachi Ltd 半導体装置、液晶表示装置およびこれらの製造方法
US6512504B1 (en) 1999-04-27 2003-01-28 Semiconductor Energy Laborayory Co., Ltd. Electronic device and electronic apparatus
TW473800B (en) 1999-12-28 2002-01-21 Semiconductor Energy Lab Method of manufacturing a semiconductor device
US6865093B2 (en) 2003-05-27 2005-03-08 Power Integrations, Inc. Electronic circuit control element with tap element
JP4884735B2 (ja) * 2005-09-16 2012-02-29 株式会社半導体エネルギー研究所 半導体装置の作製方法

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