JPH1187448A5 - - Google Patents
Info
- Publication number
- JPH1187448A5 JPH1187448A5 JP1997303808A JP30380897A JPH1187448A5 JP H1187448 A5 JPH1187448 A5 JP H1187448A5 JP 1997303808 A JP1997303808 A JP 1997303808A JP 30380897 A JP30380897 A JP 30380897A JP H1187448 A5 JPH1187448 A5 JP H1187448A5
- Authority
- JP
- Japan
- Prior art keywords
- light
- change
- rate
- semiconductor region
- reflectance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30380897A JP3681523B2 (ja) | 1996-11-08 | 1997-11-06 | 光学的評価装置,光学的評価方法,半導体装置の製造装置,半導体装置の製造装置の管理方法 |
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8-296592 | 1996-11-08 | ||
| JP29659296 | 1996-11-08 | ||
| JP35061296 | 1996-12-27 | ||
| JP8-350612 | 1996-12-27 | ||
| JP1538297 | 1997-01-29 | ||
| JP9-15382 | 1997-07-15 | ||
| JP9-189841 | 1997-07-15 | ||
| JP18984197 | 1997-07-15 | ||
| JP30380897A JP3681523B2 (ja) | 1996-11-08 | 1997-11-06 | 光学的評価装置,光学的評価方法,半導体装置の製造装置,半導体装置の製造装置の管理方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH1187448A JPH1187448A (ja) | 1999-03-30 |
| JP3681523B2 JP3681523B2 (ja) | 2005-08-10 |
| JPH1187448A5 true JPH1187448A5 (enExample) | 2005-08-18 |
Family
ID=27519697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30380897A Expired - Fee Related JP3681523B2 (ja) | 1996-11-08 | 1997-11-06 | 光学的評価装置,光学的評価方法,半導体装置の製造装置,半導体装置の製造装置の管理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3681523B2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6049220A (en) * | 1998-06-10 | 2000-04-11 | Boxer Cross Incorporated | Apparatus and method for evaluating a wafer of semiconductor material |
| SG103865A1 (en) * | 2001-06-01 | 2004-05-26 | Toshiba Kk | Film quality inspecting method and film quality inspecting apparatus |
| US6878559B2 (en) * | 2002-09-23 | 2005-04-12 | Applied Materials, Inc. | Measurement of lateral diffusion of diffused layers |
| WO2005031832A1 (ja) | 2003-09-24 | 2005-04-07 | Matsushita Electric Industrial Co., Ltd. | 不純物導入方法、不純物導入装置およびこれらを用いて形成した電子素子 |
| EP1753019A4 (en) * | 2004-05-21 | 2008-12-03 | Panasonic Corp | PROCESS FOR INTRODUCING UNPARALLENCE AND ELECTRONIC ELEMENT THEREWITH |
| US20090233383A1 (en) * | 2005-02-23 | 2009-09-17 | Tomohiro Okumura | Plasma Doping Method and Apparatus |
| JP4363368B2 (ja) | 2005-06-13 | 2009-11-11 | 住友電気工業株式会社 | 化合物半導体部材のダメージ評価方法、及び化合物半導体部材の製造方法 |
| US20180286643A1 (en) * | 2017-03-29 | 2018-10-04 | Tokyo Electron Limited | Advanced optical sensor, system, and methodologies for etch processing monitoring |
| US10978278B2 (en) | 2018-07-31 | 2021-04-13 | Tokyo Electron Limited | Normal-incident in-situ process monitor sensor |
-
1997
- 1997-11-06 JP JP30380897A patent/JP3681523B2/ja not_active Expired - Fee Related
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