JPH1187381A - Method and device for sealing semiconductor device with resin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent defectives due to the generation of voids through the fluid states of resins at the time of resin-sealing by the difference of the melting viscosity of the resins and defectives, due to the positional change of an element- loading section. SOLUTION: Cavities 2, 9 are formed in parallel in a direction along which gravity works, and a gate 4 for filling a resin is formed at the lowermost ends of the cavities 2, 9. Air vents 3, 10 for discharging air in the cavity 4 are formed at the uppermost ends of the cavities facing opposite to the gate 4. The position of a runner 5 is placed at a section lower than that the gate 4, and a pot 6 is installed at a place lower than the runner 5. As a result since the resin is fluidized in a opposite direction to the direction along which gravity works at all times by mounting components filled with the resin at an earlier rate at lower places in gravity, the resin can be filled uniformly by the left-right cavities, because the resin is fludized between the left-right cavities when fine filling difference is generated by the structure of a package by the left-right cavities.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing method and a resin sealing device for a semiconductor device, and more particularly to a resin sealing method and a resin sealing device for a resin-sealed semiconductor device using a transfer resin sealing molding machine. .

[0002]

2. Description of the Related Art FIG. 10 shows a conventional resin sealing method. In the figure, a cavity 31 is formed inside a flat main surface 30M of an upper mold 30. A bottom surface 31M of the cavity 31 is parallel to the main surface 30M, and an air bend 32 is formed at an end of the cavity 31. Is formed. Similarly, a cavity 34 is formed inside a flat main surface 35M of the lower mold 35, a bottom surface 34M of the cavity 34 is parallel to the main surface 35M, and an air bend 33 is formed at an end of the cavity 34. Have been.

[0003] In a mold cavity formed by cavities 31 and 34 vertically separated by upper and lower molds 30 and 35, an element 24 on an element mounting portion (island) 23 of the lead frame 20 and an inner of the lead frame 20 are formed. A semi-finished product of the semiconductor device having the leads and wire 22 bonded thereto is placed, and the outer portion of the lead frame 20 including the outer leads is the upper mold 3.
0 and the main surface 35M of the lower mold 35. An air bend for molding is constituted by the air bends 32 and 33 of the upper and lower molds.

Here, as shown in FIG.
Principal surfaces 3 of upper and lower dies 30, 35 for holding the lead frame
0M and 35M are mounted in a direction perpendicular to the direction of gravity 100, that is, in a horizontal direction, so that the lead frame and the cavity also extend in the horizontal direction.

[0005] The thermosetting resin 12 charged into the pot 6 is melted by the heat of a mold in a high temperature state (about 150 to 200 ° C) and injected by a plunger 13 so that the gate on the side surface of the cavity is formed. 4, the resin was filled in the cavity in the horizontal direction.

The resin-sealed portion (package) of the resin-sealed semiconductor device thus formed has a width and a length of about 4 to 50 mm due to recent demands for a thinner and smaller size. The thickness is as thin as about 4 mm or less, especially in recent packages, and tends to be as thin as 1 mm or less.

The element mounting portion 23 of the lead frame 20
The distance between the inner leads around is also 0.2mm with miniaturization
It tends to be narrow to the extent.

On the other hand, the thermosetting resin used as a sealing material is melted by heating from a solid state to a liquid state as shown in FIG. 9, and the viscosity of the molten resin decreases with time, but is further heated. And after the region of the lowest melt viscosity, the viscosity increases.

The thixotropic properties of the resin also show the same behavior,
The higher the viscosity of the resin, the higher the thixotropy.

[0010] The molten resin basically exhibits the behavior of a fluid, and flows from a position having a high potential with respect to gravity to a position having a low potential.

As shown in FIG. 9, when the resin is sealed, the cavity is filled with the resin in the state of the resin in the lowest viscosity region. With a high resin, the behavior of filling the cavity with the resin changes as follows.

(1) When a resin having a low melt viscosity is used, the thixotropy of the resin is low and the flow resistance is low.
As shown in FIGS. 11 to 13, the resin tends to be filled from the lower cavity 34, which has a low potential with respect to gravity. For this reason, when the resin in the lower cavity 34 flows in the direction opposite to the gate, the resistance when the resin flows into the upper cavity 31 through the gap between the inner leads becomes larger, so that the upper cavity is filled with the resin. In addition, the filling of the resin into the upper mold is delayed.

That is, FIGS. 11A and 11B are plan views showing the resin operating state in the first half of resin sealing using a low-viscosity resin.
It is sectional drawing (B) in the -G part. The resin flows in the flow direction 50 indicated by the arrow, and the resin 15 initially filled in the lower cavity 34 (shown by hatching in the lower right in the plan view (A)) 15 is filled in the upper cavity 31 (plan view). (In (A), this is indicated by hatching falling to the left.)
It is showing that it is more than.

FIG. 12 is a view showing the operation state of the resin in the middle half of the resin encapsulation using a low-viscosity resin, wherein FIG.
(B) is a cross-sectional view taken along the line HH in (A). As shown in the flow direction 50, the resin flows into the upper cavity 31 through the gap between the inner leads.

FIG. 13 is a view showing a resin operation state in the latter half of resin sealing using a low-viscosity resin, (A) is a plan view,
(B) is a cross-sectional view taken along the line II of (A). The upper cavity 31 is filled with the resin passing through the gap between the inner leads.

(2) On the other hand, when a resin having a high melt viscosity is used, the flow resistance of the resin increases because the resin has a high thixotropic property. For this reason, as shown in FIGS. 14 and 15, the resin filled from the gate is also filled into the lower cavity 34. However, the flow resistance when the resin flows in the opposite direction to the gate causes the lower cavity 34 to be filled near the gate. Since the flow resistance when the resin in the upper cavity 31 flows between the inner leads having a relatively wide gap becomes smaller,
The resin filled from the gate also fills the upper cavity, which is against gravity.

As described above, since the distance between the inner leads around the element mounting portion is small, and the resin viscosity is high and the flow resistance is large, the resin filled in the upper and lower cavities can be removed between the inner leads around the element mounting portion. Flow through the cavity on the opposite side is small, so that the upper and lower cavities are apparently filled with the resin while flowing separately.

That is, FIG. 14 is a plan view (A) showing a resin operating state in the first half of resin sealing using a high-viscosity resin and FIG.
FIG. 15 is a cross-sectional view (B) of the -J portion, and FIG. 15 is a plan view (A) showing a resin operation state in the latter half of resin sealing using a high-viscosity resin and a cross-sectional view (B) of the KK portion. .

As shown in these figures, the flow 50 of the resin passing between the inner leads around the element mounting portion is small, and the resin flows from the vicinity of the gate through the respective cavities to be filled.

As described above, in the conventional sealing method, the resin is filled in the cavity at right angles to the gravity, that is, in the horizontal direction. Therefore, the flow of the resin is affected by the viscosity and gravity of the resin, and the resin flows from the lower cavity first. Or the resin is divided into upper and lower cavities with the lead frame as a boundary, and the upper and lower cavities are filled with the resin at different filling speeds.

This state is variously affected by the package structure such as the thickness ratio of the upper and lower cavities and the size of the element mounting portion, the sealing conditions, and the like, and changes.

On the other hand, Japanese Patent Application Laid-Open No. 7-1496 discloses a technique for inclining a cavity.

However, even if the gate is inclined and provided in the cavity so as to be located under the gravity, the cavity is inclined, so that the relation between the upper and lower cavities with respect to the gravity is limited to gravity. As a result, the filling of the resin is affected by the gravity and the viscosity of the resin as described above.

[0024]

The problem is that, in the prior art, since the cavity is provided horizontally or inclined, when the resin is sealed with a low-viscosity resin, as shown in FIG. At first, the resin is filled from the lower cavity side of the gate side which is lower than the gravity due to the influence of gravity.
When the lower cavity side is completely filled,
2. As shown in FIG. 13, the resin flows from the lower cavity to the upper cavity through the inner leads.

For this reason, the resin flowing from the gate side of the upper cavity and the resin flowing from the lower cavity to the upper cavity are joined at a portion where the upper cavity is present, so that this portion contains bubbles, and as a final product, In some cases, void appearance was observed. The disadvantages due to the above-described bubble-related phenomenon are the same as in the case of the inclination as in the case of the horizontal.

As shown in FIGS. 14 and 15, for the high-viscosity resin, the resin flowing between the inner leads near the gate and flowing into the upper cavity and the resin flowing into the lower cavity due to the influence of gravity are respectively lead frame. Since it is easy to flow separately in the upper and lower cavities from the boundary, the filling speed of the resin in the upper and lower cavities often differs depending on the package structure and sealing conditions.

For this reason, as shown in FIG. 15, the element mounting portion connected to the frame by the thin suspension lead is pushed by the flow of the previously filled resin, and the element mounting portion changes from its original position. Sometimes. The inconvenience relating to this change in position is the same as in the case of inclination as in the case of horizontal.

In the worst case, the wire is broken due to a change in the position of the element mounting portion. In a package having a resin thickness of 1 mm or less, such as a recent thin package, the element or the element mounting portion is exposed on the surface of the package. And so on.

As described above, according to the conventional sealing method, it is often difficult to seal without causing a defect due to a void defect or a change in the position of the element mounting portion depending on the viscosity state of the resin. There was something.

The reason why the above problem occurs is as follows.

As described above, the resin sealing portion (package) generally has a width and length of about 4 to 50 mm, while the thickness is generally as thin as about 4 mm or less.

The resin is filled from the gate provided in a part of the cavity in the longitudinal direction of the gate facing portion.

However, in the conventional resin sealing method, the cavity is provided at right angles (horizontally) or inclined with respect to gravity, so that the direction in which the resin is filled and the direction in which the resin is affected by gravity are different.

For this reason, in the case of a low-viscosity resin, the resin that is greatly affected by gravity is filled, and in the case of a high-viscosity resin, the resin that is more affected by the flow resistance of the resin than the effect of gravity is filled. Will be

As described above, since the filling direction of the resin and the direction affected by gravity are different, the flow state of the resin changes due to the difference in the viscosity of the resin.

An object of the present invention is to provide a molding method and a molding method for preventing the occurrence of a void defect and a change in the position of an element mounting portion due to the viscosity of a resin in the resin sealing of a resin-sealed semiconductor device. An object of the present invention is to provide a molding device.

[0037]

SUMMARY OF THE INVENTION The present invention is characterized in that a first mold having a first cavity provided inside a main surface and a second mold having a second cavity provided inside a main surface. A mold cavity is formed from the first and second cavities by aligning the main surfaces of the first and second molds using a mold, and a sealing material is provided in the cavity via a gate. And a resin sealing portion is formed by the cavity by discharging the air in the cavity from an air vent for air discharge with the filling. There is provided a resin sealing method for a semiconductor device in which the filling is performed with the main surface of the second cavity being parallel to the direction of gravity. Here, the sealing material may be filled in the cavity from the pot through the runner and the gate, and may flow in the opposite direction to the direction of gravity until finally reaching the air vent. Further, an inner portion of the lead frame including the element mounting portion on which the element is mounted and the inner lead is placed in the cavity, and an outer portion of the lead frame including the outer lead is parallel to the direction of gravity. The above-described filling can be performed in a state of being sandwiched between the main surfaces of the first and second molds to form the resin sealing portion. Further, the resin sealing portion is made of SOP type or QF
It can be a P-type package.

Another feature of the present invention is that a first mold having a first cavity provided inside a main surface parallel to the direction of gravity and a first mold provided inside the main surface parallel to the direction of gravity. A second mold provided with two cavities, and forming a molding cavity extending in parallel with the direction of gravity from the first and second cavities by matching the main surfaces. A gate for introducing a sealing material is provided at a lowermost end side, and an air vent for discharging air in the cavity is provided at an uppermost end side of the cavity, whereby pots and runners are components related to the filling of the sealing material. The gate, cavity, and air vent are provided in a resin sealing device for a semiconductor device in which components that are filled faster are provided at lower positions with respect to gravity. Here, the bottom surface of the first cavity is parallel to the main surface of the first mold, the bottom surface of the second cavity is parallel to the main surface of the second mold,
Thereby, it is preferable that the bottom surfaces of the first and second cavities are also parallel to the direction of gravity. Further, an SOP type resin sealing portion may be formed with the sealing material, the gate may be connected to a lower side of the cavity, and the air vent may be connected to an upper side of the cavity.
Alternatively, a QFP type resin sealing portion is formed from the sealing material, the gate is connected to a lower corner portion of the cavity, the air vent is connected to a corner portion above the cavity, Other air vents can be respectively connected to the corner portions on both sides.

According to the present invention, the main surface of the mold is made parallel to the direction in which gravity acts, that is, perpendicular to the horizontal plane, and the cavity extends parallel to this main surface. Since the resin is filled from the gate located at the bottom of the cavity to the air vent side where the position is gravitationally higher, the direction in which the resin flows is always opposite to the direction in which gravity acts. .

For this reason, since the resin filled in the cavity always exerts a force to flow toward the gate side due to the influence of gravity, a slight difference occurs between the filling states of the resin in the left and right cavities depending on the shape of the package. In this case, the resin flows from the cavity on the early side to the cavity on the late side through the gap between the inner leads, so that the left and right cavities are substantially simultaneously filled with the resin from the gate side.

Since the resin is simultaneously filled in the left and right cavities and sequentially from the gate side, the air vent located at the top of the cavity is not blocked by the resin to the end, and all the air in the cavity is discharged from the air vent. Therefore, it is difficult to get air into the resin.

[0042]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.

FIGS. 1 to 4 are drawings showing a first embodiment of the present invention.

That is, FIG. 1A is a front view showing a sealing mold according to the first embodiment of the present invention, and FIG. 1B is a cross section corresponding to the AA section of FIG. FIG.

FIG. 2 is a plan view (A) showing a state of a lead frame and wire bonding of a semiconductor device commonly called SOP applied to the first embodiment, and a plan view showing a state after resin sealing. FIG.

FIG. 3 is a plan view showing a resin operating state in the first half of resin sealing according to the first embodiment, and FIG.
FIG. 4 is a cross-sectional view (B) of the first embodiment and FIG. 4 is a plan view showing a resin operation state in the latter half of the resin sealing according to the first embodiment and a cross-sectional view (B) of a C-C part.

First, referring to FIG. 1B, a cavity 2 is formed inside the right mold 1 from the flat main surface 1M, and the bottom surface 2M of the cavity 2 is parallel to the main surface 1M.
An air bend 3 is formed at an end of the cavity 1.

Similarly, a cavity 9 is formed inside the flat main surface 8M of the left mold 8 and the bottom surface 9M of the cavity 9 is parallel to the main surface 8M.
The air bend 10 is formed at the end of the.

The element 24 on the element mounting portion (island) 23 of the lead frame 20 and the lead frame 20 are accommodated in a molding cavity formed by the cavities 9 and 2 separated in the left and right directions by the right and left molds 8 and 1. A semi-finished product of the semiconductor device in which the inner lead 21 and the inner lead 21 are wire-bonded with the wire 22 is placed, and the outer portion of the lead frame 20 including the outer lead is the right mold 1.
And the main surface 8M of the left mold 8. An air bend for molding is constituted by the air bends 10 and 3 of the left and right dies.

As shown in FIG. 2A, the lead frame set here has an element mounting portion 23, an element mounting portion hanging lead 25, an outer lead 27, and an interval around the element mounting portion 23 of about 0.2 mm. Lead frame 2 in which inner leads 21, tie bars 26, and positioning holes 28 are formed
0, the semiconductor element (pellet) 24 on the element mounting portion 23
Is mounted, and the electrodes of the semiconductor element and the inner leads 21 are mounted.
Is a lead frame structure wire-bonded with a wire 22.

In the present invention, as shown in FIG. 1B, the main surfaces 8M, 1M of the left and right dies 8, 1 for holding the lead frame.
Extend parallel to the direction of gravity 100, that is, perpendicular to the horizontal plane, so that the lead frame and the cavity also extend parallel to the direction of gravity 100.

As described above, according to the present invention, the lead frame 2
Molds 1 and 8 are separated from right and left with 0 as a boundary, and each mold is provided with a pair of cavities 2 and 9 for forming a package (sealing resin portion). I have.

The cavities 2 and 9 are provided in parallel with the direction 100 in which gravity acts.
At the lowermost end of 9, a gate 4 is provided in the right mold as an injection port for filling the cavity with the resin.

The gate 4 is connected to a pot 6 via a runner 5 provided on the right mold. Air vents 3 and 10 for discharging air from the cavities are provided at the uppermost ends of the cavities 2 and 9, respectively. A resin reservoir 11 is provided below the left mold.

A plurality of such air vents, cavities, gates, runners, and pots are arranged laterally as shown in FIG. 1A, and a plurality of elements of the lead frame 20 positioned by the gauge pins 7. Resin sealing portions of a plurality of semiconductor devices are simultaneously formed in the mounting portion 23 and its vicinity.

While positioning the lead frame 20 with the gauge pins 7, the outer leads 27 are attached to the main surfaces 1M and 8M of the dies 1 and 8 so that the element mounting portion 23, the wires 22, and the inner leads 21 do not protrude out of the cavity. The outside of the lead frame 20 is held.

Before the lead frame is held by the mold, the thermosetting resin 12 is inserted into the pot 6 in advance.

As described above, in the mold of the present invention, the pot 6, the runner 5, the gate 4, the cavities 2, 9, and the air vents 3, 10 relating to the filling of the resin are arranged from the lower position to the upper position in the order listed in relation to gravity. The runners, cavities, and air vents are arranged parallel to the direction of gravity.

As described above, the resin 12 is put into the pot 6 and the lead frame 20 is connected to the main surfaces 1 of the left and right dies 1, 8.
M and 8M, the resin charged into the pot is melted by the heat of the mold held in a high temperature state (150 to 200 ° C.). From the cavities 2 and 9 through the runner 5 and the gate 4.

Since the cavity is provided in parallel with the direction in which gravity acts and a gate is provided at the lowermost portion of the cavity, the resin filled in the cavity flows in the direction opposite to the direction in which gravity acts. .

Therefore, in both the first half and the second half of the resin sealing operation, as shown in FIGS. 3 and 4, the resin filled in the cavities 2 and 9 is always under the influence of gravity 100 on the gate 4 side (lower side). ), A slight difference in the filling state of the resin in the left and right cavities 9 and 2 due to the shape of the package, the gap between the inner lead from the earlier filling cavity to the later filling cavity. As a result, the filling difference between the left and right cavities is eliminated, and the left and right cavities 9, 2 are moved from bottom to top as shown in the flow direction 40 of the arrow. Is simultaneously filled with the resin 12.

Here, the above content will be further described in relation to the viscosity of the resin. When sealing with a low-viscosity resin, the resin easily flows through the gap between the inner leads because the flow resistance of the resin is small. It is easily understood that the difference in filling of the cavities is eliminated by the flow of the resin between the left and right cavities as described above, and the flow resistance is large in a resin having a high viscosity, but by reducing the filling speed of the resin. Since the resistance when the resin flows between the inner leads decreases, the same result as that of the low-viscosity resin is obtained.

The resin is simultaneously filled in the left and right cavities and sequentially from the lowermost gate side. The air vent located at the top of the cavity is not filled with the resin to the end, and all the air in the cavity is exhausted from the air vent, so that the incorporation of air into the resin can be reduced.

As described above, in the present invention, the order of the portions where the resin is filled quickly (pot 6 → runner 5 → gate 4)
→ Place each component in cavity 2, 9 → air vent 3, 10) so that it is at a low position against gravity.
And by providing the cavity parallel to the direction of gravity 100, that is, perpendicular to the horizontal plane,
It is possible to eliminate the difference between the filling of the resin in the left and right cavities when filling the resin, and to reduce the entrapment of air when the resin flows.

In the semiconductor device of the first embodiment, commonly called SOP, outer leads (external terminals) 27 are provided in two directions as shown in FIG. Has a thickness of about 3 mm or less, and has a rectangular parallelepiped shape having a long planar shape of 4 to 20 mm.

When the resin is sealed in such a mold, a cavity (not shown) is formed in a press machine (not shown) for opening and closing the molds 1 and 8 of the present invention to the right and left as shown in FIG.
0 to 170 ° C. by installing a heater (not shown) inside the mold.
To be kept. The resin 12 is put into the pot 6 and the lead frame 20 is positioned by the gauge pins 7 and held by the dies 1 and 8 so that the element mounting portion 23, the wire 22, and the inner lead 21 do not protrude outside the cavity. I do.

The plunger 13 is connected to a cylinder device (not shown) and can move freely in the pot 6 to the left and right. When the resin 12 is put into the pot 6, the plunger 13 is placed on the right side so that the resin is contained in the pot. When the resin is injected after holding the mold, the resin is kept pressed until the cavity and the air vent are completely filled with the resin.

As a result, as described above, 12 charged into the pot 6 is melted by the heat of the mold, and the plunger 13 is melted.
And flows from the lower position to the higher position with respect to gravity due to the runner 5 → gate 4 → cavities 2, 9 → air vents 3, 10.

For this reason, in the case of the SOP type semiconductor device, as shown in FIG. 1B, a wire 22 or an element 24 is provided in the left cavity 9 and an element mounting portion 23 is provided in the right cavity 2, so that the left and right cavities are provided. By controlling the filling rate of the resin in accordance with the viscosity of the resin despite the different cross-sectional structures, the resin flows through the gap between the inner leads as shown in FIG. 3 and FIG. It is possible to fill the cavity with the resin without causing a difference in the resin filling in the cavity.

The filling of the resin is performed in the order of pot → runner → cavity → air vent in order from the low position with respect to gravity, so that the air in the runner or cavity is constantly pushed up by the resin to the upper air vent side and discharged from the air vent. In addition, it is possible to reduce entrapment of air into the resin when the resin flows.

As a result, the SOP type sealing resin portion (package) 29 (see FIG. 2) having a width and length of about 4 to 50 mm and a thickness of about 4 mm or less, for example, as thin as 1 mm.
(B)) can be formed safely and reliably.

FIGS. 5 to 8 are views showing a second embodiment of the present invention.

That is, FIG. 5A is a front view showing a sealing mold, and FIG. 5B is a cross-sectional view corresponding to the DD section of FIG.

FIG. 6A is a plan view showing a state of wire bonding with a lead frame of a semiconductor device commonly called QFP applied to the second embodiment, and FIG. 6B is a plan view showing a state after resin sealing. FIG.

FIG. 7 is a plan view showing an operation state of resin in the first half of resin encapsulation in the second embodiment, and FIG.
8A and 8B are a plan view showing a resin operation state in the latter half of the resin encapsulation according to the second embodiment and a cross-sectional view (B) in an FF section.

In FIGS. 5 to 8, the same or similar parts as those in FIGS. 1 to 4 are denoted by the same reference numerals.
Duplicate description will be omitted as much as possible.

As shown in FIGS. 6A and 6B, the QFP
In the type semiconductor device, outer leads (external terminals) 27 are led out of a sealing resin portion (package) 29 in four directions, and the thickness of the package 29 is about 4 mm or less. The length is 7 to 50 mm, which is a thin and long rectangular parallelepiped.

In this QFP, since external terminals are provided in four directions, as shown in FIGS.
In general, the runner 5 is provided at a corner of a cavity for forming a package.

Further, similarly to the first embodiment, a plurality of patterns are arranged and formed on one lead frame 20.

As shown in FIG. 5B, also in the second embodiment, the flat main surfaces 1M and 8M of the dies 1 and 8 sandwiching the outside including the outer leads of the lead frame 20 have the gravity direction 100M. The cavities 2, 9 formed so that the main surfaces 1M, 8M and the bottom surfaces 2M, 9M are parallel to each other are also parallel to the gravity, that is, perpendicular to the horizontal plane. It is provided so that it becomes. The gate 4 is provided at the lowermost end of the cavity.

The air vent 3 is provided at the corner of the cavity opposite to the gate 4 so that the gate,
The air vent facing the cavity and the gate is configured to be on the same straight line as the direction in which gravity acts.

For this reason, in order to seal a plurality of lead frames taken into one piece with a resin, the mold according to this embodiment is, as shown in FIG.
Are arranged obliquely according to the shape of the lead frame.

As shown in FIG. 5A, in addition to the air vents 3 and 10 at the corners facing the gate 4, air vents 3 and 10 are provided at the remaining two corners of the cavities 2 and 9, respectively. It is.

The pot 6 and the runner 5 are shown in FIG.
As shown in (B), the resin is appropriately selected and arranged so that the flow of the resin from the pot gravitationally proceeds from a lower position to an upper position, that is, proceeds in a direction opposite to the gravitational direction 100.

By arranging the gate at the lowermost end of the cavity and the air vent at the cavity and the gate-facing portion so as to be on the same line as the direction in which gravity acts, as shown in FIGS. 12 is filled at the same speed between the left and right cavities, and the air in the runner and the cavities is discharged from each air vent to the outside of the cavities together with the filling of the resin.

It is apparent that the same effects as those of the first embodiment can be obtained in the second embodiment in which the shape of the package is changed as described above.

[0087]

The first effect of the present invention is that when the cavity is filled with the resin, the positional change of the element mounting portion due to the flow of the resin can be prevented. That is, exposure to the package surface can be prevented.

The reason is that when filling the cavity with the resin, there is little difference between the filling states of the resin in the right and left cavities, so that the force for changing the element mounting portion due to the flow of the resin does not work. Because.

The second effect is that the entrapment of air due to the flow of the resin is less likely to occur, so that void defects and the like can be reduced in appearance.

The reason is that the resin in the cavity is pushed by the resin so that the resin is filled from the gate at the bottom of the cavity toward the air vent in the gate-facing portion and the resin is uniformly filled in the left and right cavities. This is because it is discharged from the air vent to the outside of the cavity.

[Brief description of the drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention,
(A) is a front view of the sealing mold, (B) is A- of (A).
It is sectional drawing corresponding to A section.

FIGS. 2A and 2B are diagrams showing a semiconductor device applied to the first embodiment of the present invention, in which FIG. 2A is a plan view showing a state of a lead frame and wire bonding, and FIG. FIG.

3A and 3B are diagrams illustrating a resin operation state in a first half of resin sealing according to the first embodiment of the present invention, wherein FIG.
(B) is a cross-sectional view taken along the line BB of (A).

FIG. 4 is a diagram showing a resin operation state in the latter half of resin sealing according to the first embodiment of the present invention, where (A) is a plan view,
(B) is a cross-sectional view taken along the line CC of (A).

FIG. 5 is a diagram showing a second embodiment of the present invention;
(A) is a front view of the sealing mold, (B) is D- of (A).
It is sectional drawing corresponding to D section.

FIGS. 6A and 6B are diagrams showing a semiconductor device applied to a second embodiment of the present invention, in which FIG. 6A is a plan view showing a state of a lead frame and wire bonding, and FIG. FIG.

FIGS. 7A and 7B are diagrams showing a resin operation state in the first half of resin sealing according to the second embodiment of the present invention, wherein FIG.
(B) is a sectional view taken along the line EE of (A).

FIG. 8 is a diagram showing a resin operation state in the latter half of resin sealing according to the second embodiment of the present invention, where (A) is a plan view,
(B) is a cross-sectional view taken along the line FF of (A).

FIG. 9 is a view showing a melt viscosity characteristic of a thermosetting resin.

FIG. 10 is a sectional view showing the structure of a conventional sealing mold.

11A and 11B are diagrams illustrating a resin operation state in the first half of resin sealing using a low-viscosity resin in the related art, where FIG. 11A is a plan view and FIG. 11B is a cross-sectional view taken along a line GG of FIG. It is.

12A and 12B are diagrams illustrating a resin operating state in the middle half of resin sealing using a low-viscosity resin in the related art, in which FIG. 12A is a plan view, and FIG. 12B is a cross section taken along the line HH in FIG. FIG.

13A and 13B are diagrams illustrating a resin operation state in the latter half of resin sealing using a low-viscosity resin in the related art, where FIG. 13A is a plan view and FIG. 13B is a cross-sectional view taken along a line II of FIG. It is.

14A and 14B are diagrams illustrating a resin operation state in the first half of resin sealing using a high-viscosity resin in the related art, where FIG. 14A is a plan view and FIG. 14B is a cross-sectional view taken along the line JJ of FIG. It is.

15A and 15B are diagrams illustrating a resin operation state in the latter half of resin sealing using a high-viscosity resin in the related art, where FIG. 15A is a plan view and FIG. 15B is a cross-sectional view taken along a line KK of FIG. It is.

[Explanation of symbols]

 Reference Signs List 1 right mold 1M right mold main surface (flat surface) 2 cavity (right mold) 2M bottom surface of cavity (right mold) 3 air vent (right mold) 4 gate 5 runner 6 pot 7 gauge pin 8 left mold 8M Main surface (flat surface) of left mold 9 Cavity (left mold) 9M Bottom surface of cavity (left mold) 10 Air vent (left mold) 11 Resin reservoir 12 Resin 13 Plunger 14 Resin filled in upper cavity 15 Resin filled in lower cavity 20 Lead frame 21 Inner lead 22 Wire 23 Element mounting part 24 Element 25 Element mounting part hanging lead 26 Tie bar 27 Outer lead 28 Positioning hole 29 Package 30 Upper die 30M Main surface of upper die ( (Flat surface) 31 cavity (upper die) 31M bottom surface of cavity (upper die) 32 air vent (upper die) 33) Air vent (lower mold) 34 Cavity (lower mold) 34M Bottom of cavity (lower mold) 35 Lower mold 35M Main surface (flat surface) of lower mold 40 Flow direction of resin related to the present invention 50 Conventional technology Flow direction of resin with respect to 100 Gravity direction

Claims (8)

[Claims] A first mold provided with a first cavity inside the main surface; and a second mold provided with a second cavity inside the main surface. A mold cavity is formed from the first and second cavities by matching the main surfaces of the molds 2 with each other, and a sealing material is filled in the cavity through a gate. In a resin sealing method for a semiconductor device in which a resin sealing portion is molded by the cavity by discharging air in the cavity from an air vent for discharging air, the main surfaces of the first and second cavities are moved in the direction of gravity. A resin sealing method for a semiconductor device, wherein the filling is performed in a state where the resin is parallel to the resin. 2. The method according to claim 1, wherein the sealing material is filled into the cavity from the pot through a runner and a gate, and flows in a direction opposite to a direction in which gravity acts until finally reaching an air vent. The resin sealing method for a semiconductor device according to the above. 3. A portion inside a lead frame including an element mounting portion on which an element is mounted and an inner lead is placed in the cavity, and a portion outside the lead frame including an outer lead is parallel to a direction of gravity. 2. The resin sealing method for a semiconductor device according to claim 1, wherein said filling is performed to form said resin sealing portion while being sandwiched between main surfaces of said first and second molds. 4. The resin sealing portion is of SOP type or QF type.
2. The method according to claim 1, wherein the package is a P-type package. 5. A first mold provided with a first cavity inside a main surface parallel to the direction of gravity, and a second cavity provided inside a main surface parallel to the direction of gravity. A mold cavity extending from the first and second cavities in parallel with the direction of gravity by combining the main surfaces with each other, and sealed at the lowermost end of the cavity. A gate for introducing a material is provided, and an air vent for discharging air in the cavity is provided at an uppermost end side of the cavity, whereby pots, runners, gates, cavities, and air vents are components related to the filling of the sealing material. A resin sealing device for a semiconductor device, wherein a component with a faster filling is provided at a position lower with respect to gravity. 6. The bottom surface of the first cavity is the first cavity.
And the bottom surface of the second cavity is parallel to the main surface of the second mold, whereby the bottom surfaces of the first and second cavities are parallel to the direction of gravity. 6. The resin sealing device for a semiconductor device according to claim 5, wherein: 7. An SOP type resin sealing portion is formed from the sealing material, the gate is connected to a lower side of the cavity, and the air vent is connected to an upper side of the cavity. The resin sealing device for a semiconductor device according to claim 5. 8. A QFP type resin sealing portion is formed from the sealing material, the gate is connected to a lower corner portion of the cavity, and the air vent is connected to an upper corner portion of the cavity. 6. The resin sealing device for a semiconductor device according to claim 5, wherein another air vent is connected to each of the corner portions on both sides of the cavity.