JPH1174412A - Method and device for manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To control manufacturing by a tape carrier itself. SOLUTION: An integrated manufacturing device for COB (chip-on-board package)Ics.has a loading device 2, a chip bonding device 3, an information display device 4, a curing device 5, a wire bonding device 6, a buffer 7, a transfer molding device 40, a residue removing device 8, and an unloading device 9. These devices are arranged in series. The information display device 4 displays a start display hole 71 for displaying the start, an end display hole 79 for displaying end, a change display hole 78 for displaying the changes of kinds or materials and the lot, a defect display hole 72 for displaying defects, a pitch display hole 73 for displaying pitch, and a joint display hole 76 for displaying a joint 75 by adhesive tapes of a tape carrier 11. Thus, the holding of the joint in molding a forming block by the detection of the joint display hole can be prevented at the time of formation, and the leaking of resin can be avoided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing technique, and more particularly to a control technique for manufacturing a semiconductor device using a tape carrier. For example, the present invention relates to a chip-on-board package (hereinafter referred to as COB). ) And a tape carrier package (hereinafter, referred to as TCP).

[0002]

2. Description of the Related Art Generally, a semiconductor integrated circuit device having a COB (hereinafter referred to as a COB IC) is widely used for an IC card. That is, the IC card is COB
-The IC is built in a plastic card. Among IC cards, those in which a microcomputer is constructed by COB / IC are called smart cards, and those using ICs having an EEPROM, a flash memory, or the like are called memory cards. The COB / IC is inserted into a storage recess provided on the surface near one end of the plastic card and adhered by an adhesive, and the outer lead is exposed outside the storage recess.

Conventional COB.I used for IC card
C, a carrier in which a plurality of outer leads are fixed to one main surface of an insulating sheet and a plurality of connection holes are opened at positions facing predetermined outer leads of the sheet; A semiconductor chip fixed on the other main surface, one end part is bonded to each outer lead in each connection hole and the other end part is bonded to each electrode pad of the semiconductor chip, and each outer lead and the semiconductor chip are separated. Some include a wire that is electrically connected, and a resin sealant that seals the semiconductor chip and the wire group with a resin.

Japanese Patent Application Laid-Open No. 2-112264 discloses an example of this type of semiconductor device, its manufacturing method, and an IC card using the same.

[0005]

With the increase in demand for IC cards, there has been a demand for the development of a technique for mass-producing COB / IC using a tape carrier. Here, in order to realize mass production in an IC manufacturing method using a tape carrier, it is necessary to continue the production by connecting the tape carriers with an adhesive tape. Further, in a method of manufacturing a COB / IC using a tape carrier, it is necessary to form a resin sealing body on the tape carrier by a transfer molding method.
However, when performing the transfer molding method of the resin sealing body to the tape carrier, when the step portion of the adhesive tape which is the seam of the tape carrier is sandwiched between the mating surfaces in the molding die of the transfer molding device, the step of the adhesive tape is increased. Liquid resin as a molding material leaks from the
Problems such as poor molding of the resin sealing body and fouling of the molding die occur.

An object of the present invention is to provide a semiconductor device manufacturing technique capable of controlling the manufacturing by the tape carrier itself.

[0007] The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0008]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

That is, a mounting step in which semiconductor chips are sequentially mounted at intervals in the longitudinal direction on a tape carrier fed in a longitudinal direction, and a resin sealing body for resin-sealing the semiconductor chips is provided on the tape carrier. A method of manufacturing a semiconductor device, comprising a step of forming a resin sealing body to be formed, wherein a display unit for displaying information relating to control of manufacturing is attached to the tape of the tape carrier.

In the above-described means, for example, by attaching a seam display portion for displaying a seam of the tape carrier to the upper side of the seam of the tape carrier, the seam can be recognized in advance when performing the transfer molding method. Because they can, seams can be avoided. As a result, molding by a transfer molding method of the resin sealing body to the tape carrier can be realized.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a method of manufacturing a COB IC according to an embodiment of the present invention, wherein (a) is a schematic view of the manufacturing apparatus, and (b) is a part of the product. FIG. 3C is an enlarged partial cross-sectional view taken along line cc of FIG. 2A and 2B show a COB IC, (a) is a front sectional view, (b) is a partially cut side view, and (c) is c in (b).
FIG. 4 is an enlarged partial front sectional view taken along line -c. Figure 3 shows the COB
-It is a partially cut-away plan view of IC. FIG. 4 to FIG. 10 are explanatory views for explaining each step in the method of manufacturing the COB / IC. 11A and 11B show an IC card using the COB.IC of the present invention, wherein FIG. 11A is a plan view, and FIG. 11B is an enlarged partial sectional view taken along line bb of FIG.

In the present embodiment, the method of manufacturing a semiconductor device according to the present invention uses a COB · I
It is configured as a method for manufacturing C, and is implemented by an integrated COB / IC manufacturing apparatus (hereinafter, referred to as an integrated manufacturing apparatus) 1. The integrated manufacturing apparatus 1 includes a loading device 2, a chip bonding device 3, an information display device 4, a curing device 5, a wire bonding device 6, a buffer device 7, a transfer molding device 40, a residue molded body removing device 8, and an unloading device 9. And these are arranged in series.

The loading device 2 feeds the tape carrier wound on the reel to the chip bonding device 3 and feeds the tape carrier at a pitch. Chip bonding device 3
Fixes a semiconductor chip to a tape carrier with an adhesive. The information display device 4 displays a manufacturing control information display section on the tape of the tape carrier. The curing device 5 cures the adhesive. The wire bonding apparatus 6 bonds wires for electrically connecting the semiconductor chip and the outer leads. The buffer device 7 adjusts the time lag between the wire bonding device 6 and the transfer molding device 40. The transfer molding device 40 forms a resin-sealed body for resin-sealing a semiconductor chip and a wire mounted on a tape carrier. The residue molded body removing device 8 removes a residue molded body such as a runner molded body or a gate molded body adhered to the tape carrier.

The COB IC 10 according to the present embodiment includes a carrier 12 and a semiconductor chip 21. The carrier 12 is provided with a sheet 15 of a substantially square thin plate shape having insulation and flexibility, and nine outer leads 16 are fixed to one main surface of the sheet 15. The nine outer leads 16 are one rectangular outer lead (hereinafter, referred to as “outer lead”).
It is called the outer lead in the center. The other eight outer leads (hereinafter, also referred to as both outer leads) are arranged symmetrically on both long sides of 16a. Each of the outer leads 16 is separated from each other and is in an electrically disconnected state. That is, the outer leads 16 on both sides are electrically disconnected from each other, and the group of outer leads 16 on both sides and the outer lead 16a at the center are electrically disconnected.

A semiconductor chip receiving hole 17 is formed at a position facing the outer lead 16a at the center of the sheet 15, and the outer lead 16a at the center closes one end opening of the semiconductor chip receiving hole 17 and is exposed at the bottom. It is in a state. The semiconductor chip 21 has a central outer lead 16 a exposed at the bottom of the semiconductor chip housing hole 17.
It is fixed on the top. A plurality of connection holes 18 are respectively formed at positions on both sides of the sheet 15 facing the outer leads 16. One end of each of the electrode pads 22 formed on the main surface of the semiconductor chip 21 on the side opposite to the sheet 15 is connected to the other end of a wire 26 having one end bonded to each of the outer leads 16 on both sides in each connection hole 18. The outer leads 16 on both sides and the semiconductor chip 21 are electrically connected by wires 26. Here, the outer leads 16a at both sides and the outer leads 16a at the center are electrically disconnected from each other, and the outer leads 16a at the center are electrically disconnected from the outer leads 16 at both sides. It has become. The semiconductor chip 21 and the group of wires 26 are resin-sealed by a resin sealing body 28.

Hereinafter, COB · which is an embodiment of the present invention will be described.
A method for manufacturing an IC will be described. By this description, the details of the configuration of the COB / IC according to the configuration will be clarified.

In the method of manufacturing a COB / IC according to the present embodiment, a tape carrier 11 shown in FIG. 4 is used. The tape carrier 11 includes a large number of carriers (hereinafter, referred to as unit carriers) 12 and includes a tape 13 which is a material of a sheet. The tape 13 is made of an insulating and flexible resin, and is formed in an elongated tape shape having a constant width. A large number of feed holes 14 are formed at both ends of the tape 13 at regular intervals in the longitudinal direction. A pair of sheets 15, 15 are virtually formed between the rows of the two feed holes 14 groups of the tape 13 so as to be arranged side by side in the lateral direction. Each is arranged in a line.

Nine outer leads 16 are provided on one main surface (hereinafter, referred to as a first main surface) of the sheet 15 of each unit carrier 12, and four outer leads 16 are provided on both sides of the central outer lead 16a. They are arranged symmetrically left and right and fixed. The outer leads 16 are formed by patterning a copper foil adhered to the first main surface of the tape 13 by lithography and etching, and forming a 5 μm nickel plating film and a 0.1 μm
Of gold plating (both not shown). Each of the outer leads 16 is separated from each other and is in an electrically disconnected state.

At the center of the sheet 15, a semiconductor chip receiving hole (hereinafter, referred to as a receiving hole) 17 is opened from the other main surface (hereinafter, referred to as a second main surface) side with respect to the first main surface. The central outer lead 16 a is exposed at the bottom of the housing hole 17. On each side of the accommodation hole 17 of the sheet 15, eight connection holes 18 are arranged symmetrically and opened from the second main surface side, and the bottom of each connection hole 18 has both sides. Each of the outer leads 16 is exposed.

On the second main surface of the sheet 15 of each unit carrier 12, a cavity resist layer 19 is provided with an accommodation hole 1.
It is formed in a substantially square frame shape so as to surround the group 7 and the group of connection holes 18, and the cavity resist layer 19 is set so as to correspond to the outer edge of the cavity in a transfer molding apparatus described later. A gate resist layer 20 is formed in a substantially rectangular shape with a constant width at a predetermined position on the outer periphery of the cavity resist layer 19 on the side of the feed hole 14, and the gate resist layer 20 is formed by a gate in a transfer molding apparatus described later. Is set to correspond to. The cavity resist layer 19 and the gate resist layer 20 are formed by being applied by a screen printing method and then being cured by ultraviolet rays, and have a thickness of 10 to 30 μm.

The tape carrier 1 constructed as described above
1 is supplied to the loading device 2 of the integrated manufacturing apparatus 1 in a state wound on a reel. The loading device 2 feeds the tape carrier 11 to the chip bonding device 3 from the winding end. The tape carrier 11 fed from the loading device 2 is pitch-fed. In the chip bonding apparatus 3, a semiconductor chip (hereinafter, referred to as a chip) is attached to the tape carrier 11 that is fed out.
Is carried out as shown in FIG. The chip 21 is diced into small pieces smaller than the size of the receiving hole 17 in the subsequent dicing process after the integrated circuit of the microcomputer is formed in the state of the semiconductor wafer in the so-called pre-process in the IC manufacturing process. Thus, the IC structure is manufactured. A plurality of (six in the present embodiment) electrode pads 22 are formed on an outer peripheral portion of one main surface (hereinafter, referred to as a first main surface) of the chip 21. Incidentally, the electrode pads 22 are also formed in a semiconductor wafer state. A VCC electrode 23 is set on a main surface of the chip 21 opposite to the first main surface (hereinafter, referred to as a second main surface).

In the chip bonding apparatus 3, an insulating adhesive is applied by a dispenser (not shown) on the center outer lead 16a exposed at the bottom of the receiving hole 17 in the tape carrier 11, and the adhesive is applied. Layer 24 is formed. A filler 25 having an insulating property is mixed in the adhesive constituting the adhesive layer 24, and the particle size of the filler 25 is formed to 20 to 100 μm. Subsequently, the chip 21 held by vacuum suction by a collet (not shown) is bonded to the adhesive layer 24.
Since the filler 25 having an insulating property with a particle size of 20 to 100 μm is mixed in the adhesive, the chip 21 is attached to the center of the accommodation hole 17 on the outer lead 16 a by the adhesive layer 24. In this state, insulation is completely maintained with respect to the outer lead 16a of the portion.

The tape carrier 11 that has passed through the chip bonding device 3 reaches the information display device 4. The information display device 4 displays, at a predetermined position on the tape 13 of the tape carrier 11, a display section for displaying information relating to manufacturing control, as shown in FIG. First, at the beginning of the tape carrier 11, a display mark 70 for displaying information necessary for specifying a product such as a product name or a lot name of a product to be manufactured is displayed. For example, the display mark 70 is represented in advance by alphabetical characters, numerals, or the like, and is displayed by being printed on the tape 13 using a dot printer or the like (not shown). Incidentally, in the chip bonding apparatus 3, the tape carrier 11
Is a predetermined number of rows (5 rows in the illustrated example)
Only continuous chip bonding is not performed. Therefore, the information display device 4 automatically displays the display mark 70 by recognizing the area where the chip bonding is not performed.

At the beginning of the tape carrier 11,
A start display hole 71 as a start display unit for displaying start is formed at a predetermined position. Incidentally, the punching is performed by punching the tape 13 of the tape carrier 11. In the present embodiment, the start display hole 71 is constituted by one small hole perforated on the line of one group of the receiving holes 17. The information display device 4 automatically perforates the start display hole 71 by recognizing the area where the chip bonding is not performed.

For example, if the outer lead 16 of the tape carrier 11 is defective,
No chip 21 is bonded to 7. Therefore, when the information display device 4 recognizes the accommodation hole 17 to which the chip 21 is not bonded, the information display device 4 pierces the failure indication hole 72 for displaying a defect in the designated corner portion of the accommodation hole 17 in the tape 13 of the tape carrier 11. .

The information display device 4 sequentially pierces the pitch display holes 73 for displaying the pitch every predetermined number of pitches. The position of the pitch display hole 73 is specified by counting the number of rows of the storage holes 17 and the number of the feed holes 14 by a predetermined number. In the present embodiment, the pitch display hole 73 is constituted by one small hole punched on the center line of the tape 13, and the pitch display hole 73 is punched in the tape 13 at a predetermined interval.

By the way, an IC using a tape carrier
In order to realize mass production in the manufacturing method of the above, it is necessary to continue the production by joining tape carriers with an adhesive tape. Therefore, as shown in FIG. 1, a seam 75 connected by the adhesion of the adhesive tape 74 is formed in the middle of the tape carrier 11. The adhesive tape 74 is formed by cutting a polyimide adhesive tape into a rectangle having the same width as the width of the tape 13. The information display device 4 is a tape carrier 11
Seam display hole 76 for displaying seam 75 of tape 1
3 is perforated at a position closer to the start end side of the adhesive tape 74. The position of the joint display hole 76 is specified by recognizing the adhesive tape 74. In the present embodiment, the joint display hole 76 is constituted by two small holes which are arranged next to each other and are respectively drilled. That is,
One of the small holes is formed on the center line of the tape 13, and the other small hole is formed on a line of the other group of housing holes 17 different from the group of housing holes 17 in which the start indication holes 71 are arranged.

By the way, when the production by the tape carrier is continued for a long time, a lot change or a change of the kind is interposed in the middle. In such a case, it is necessary to indicate on the tape carrier 11 that the lot or the type has been changed on the way. For this reason, as shown in FIG. 1, a change display in which the chip 21 is not continuously chip-bonded by a predetermined number of rows (two rows in the illustrated example) by the chip bonding apparatus 3 at a position where the tape carrier 11 has been changed An area 77 is formed. It should be noted that a portion where chip bonding is not performed is recognized as a defective portion.
2 will be automatically pierced by the information display device 4.

The information display device 4 displays the change display hole 78 by recognizing the change display area 77 not chip-bonded. In the present embodiment, the change display hole 78 is constituted by two small holes which are arranged next to each other and are respectively drilled. That is,
One of the small holes is punched on the center line of the tape 13, and the other small hole is punched on the line of the group of accommodation holes 17 in which the start indication holes 71 are arranged. In addition, a display mark 70 is displayed in the change display area 77 in order to display information necessary for specifying the product such as the product type name and the lot name of the changed product.

Finally, at the end of the tape carrier 11, an end indicator hole 79 as an end indicator for indicating the end is provided.
Are drilled in place. In the present embodiment, the end indication hole 79 is constituted by one small hole perforated on the line of the other accommodation hole 17 group row different from the accommodation hole 17 group row in which the start indication hole 71 is arranged. The information display device 4 automatically pierces the end display hole 79 in response to the end signal transmitted from the chip bonding device 3.

As described above, the tape carrier 11 on which the display section for displaying the information on the production control is displayed at a predetermined position by the information display device 4 is sent to the cure device 5. The curing device 5 cures (cures) the adhesive layer 24 in which the chip 21 is adhered to the central outer lead 16a by heating the tape carrier 11 as a whole.

Next, in the wire bonding apparatus 6, as shown in FIG. 6, between each of the electrode pads 22 of the chip 21 and each of the outer leads 16 on both sides exposed at the bottom of each of the connection holes 18. Each wire 26 is bonded. A gold wire is used as a wire constituting the wire 26. Since the surface of the outer lead 16 is covered with a gold plating film (not shown), the bondability is extremely good. As a result, the chip 21 is electrically connected to the outer leads 16 on both sides via the wires 26. Incidentally, the outer leads 16a at the center are electrically floating from the chip 21 and the outer leads 16 on both sides.

As described above, the assembly 2 in which the chip and wire bonding are performed on the tape carrier 11
7 is a transfer molding device 4 via a buffer device 7
It is sent to 0. The transfer molding device 40 collectively molds the plurality of resin sealing bodies 28 on the tape carrier 11 by batch processing. Therefore, the buffer device 7 absorbs the difference between the processing time by the pitch feed of the wire bonding device 6 and the processing time by the batch processing of the transfer molding device 40 by loosening the tape carrier 11. The buffer device 7 is a tape carrier 1
When the joint display hole 76 formed in No. 1 is detected,
The adhesive tape 74 adhered to the joint 75 is prevented from being caught in the transfer molding device 40 beforehand.

The transfer molding apparatus 40 shown in FIG. 7 has an upper mold 41 and a lower mold 42 which are mutually matched by a mold clamping device (not shown) or the like. A plurality of cavities 43 are submerged in the mating surface of the upper die 41 in a row of two rows. A pair of pots 44 are formed on the mating surface of the lower mold 42, and two pots 44 are formed outside the two rows of the cavities 43. A plunger 45 driven up and down by a cylinder device (not shown) is movable in each pot 44. It is inserted in.

A pair of runners 47, 47 corresponding to two rows of cavities 43 are provided on the mating surface of the upper mold 41, with each cull 46 being opposed to each pot 44, respectively. Each is connected. Both runners 4
7 and 47 are laid in parallel with each row outside of both rows of the cavity 43, and both runners 47 and 47 are provided.
Is connected to each gate 48 opened for each cavity 43 in each row. Also, both runners 4
7 and 47 are laid so as to be in contact with both sides of the tape carrier 11 when the assembly 27 is installed in the transfer molding apparatus 40 as described later.

As shown in FIG. 8, a concave mirror-shaped portion 49 as a concave portion is formed on the ceiling surface corresponding to the hole bottom of each cavity 43, and this concave mirror-shaped portion 4 is formed.
9 forms a convex mirror-shaped part 29 as a convex part on the upper surface of the resin sealing body 28. At the center of the ceiling surface of each cavity 43 on the side opposite to the gate 48, a convex portion 50 having a substantially semi-elliptical shape in a plan view is protruded at a constant height. An ejector pin guide hole 51 is formed on the center line of the projection 50, and the ejector pin guide hole 51 is provided in the ejector pin guide hole 51.
Is inserted so that it can advance and retreat.

When the resin molding 28 is molded by the transfer molding apparatus 40 having the above-described configuration, the assembly 27 is set on the lower mold 42 with the respective chips 21 facing upward. You. A tablet (not shown) on which a molding resin as a molding material has been pressed is put into a pot 44. At this time, as the molding resin, a molding resin having the same color as or close to the color of a card body of an IC card described later is used. For example, when the color of the card body of the IC card using the COB / IC is white, a molding resin colored white is used. That is,
Not only a molding resin mixed with carbon (black), which is generally used as a molding material for a resin sealing body of an IC package, but also other molding resins are used. This is because COB
When the IC is used for the IC card, the color of the resin sealing body 28 is prevented from being seen through the protection cover of the IC card.

Next, the upper die 41 and the lower die 42 are clamped. At this time, the trapping of the adhesive tape 74 in the tape carrier 11 between the mold mating surfaces can be prevented in advance by the control based on the detection of the joint display hole 76. When the mold is clamped, the chip 21 is housed in the cavity 43 of the upper mold 41, and the outer peripheral edge of the cavity 43 and the gate 48 are connected to the cavity resist layer 19 and the gate for the tape carrier 11. Each of them comes into a state of being pressed against the resist layer 20. In this state, the inner edges of both runners 47, 47 are tape carrier 1
1 are in contact with both sides.

The tablet is heated by a heater (not shown) and melted to form a liquid resin (hereinafter referred to as resin).
At 53, the resin 53 is pushed out of the pot 44 by the plunger 45, and the runner 47 and the gate 48
Through the cavity 43. After a lapse of a predetermined time, the filled resin 53 is thermally cured. Since the resin 53 is transferred (transferred) through the runner 47 and the gate 48 and is filled in the cavity 43, the runner 47 and the gate 48, which are intermediate transfer paths, are provided.
In this case, the resin 53 is filled and cured.

When the resin 53 is conveyed and filled, the liquid resin 53 tends to leak from between the mating surfaces of the upper mold 41 and the lower mold 42.
Since the cavity resist layer 19 and the gate resist layer 20 of the tape carrier 11 pressed against the tape 8 just serve as packing, the occurrence of leakage is prevented. Therefore, occurrence of resin flash is prevented. Further, so-called indentations are formed on the outer leads 16 with the mold clamping. However, the cavity resist layer 19 and the gate resist layer 20 of the tape carrier 11 pressed against the outer peripheral edge of the cavity 43 and the gate 48 are just cushioned. Therefore, the phenomenon that so-called indentations are formed on the outer leads 16 is prevented. Incidentally, since the adhesive tape 74 is prevented from being pinched between the mold mating surfaces by the control based on the detection of the joint display hole 76, leakage due to the step of the adhesive tape 74 does not occur.

Resin 53 filled in cavity 43
Is thermally cured, the upper mold 41 and the lower mold 42 are opened, and the resin sealing body 28 formed by the cavity 43 is removed from the cavity 43 by the ejector pin 5.
2 and is released from the mold.

In the resin sealing body 28, a convex mirror-shaped portion 29 is formed by a concave mirror-shaped portion 49 of the cavity 43 on the main surface opposite to the tape carrier 11. A concave portion 50A is recessed by the convex portion 50 of the cavity 43 in a part of the outer periphery of the convex mirror-shaped portion 29, and an ejector pin mark 52A is formed by an ejector pin 52 at the bottom of the concave portion 50A.

As shown in FIG. 8B,
Even if a projection-shaped burr 51A is formed around the ejector pin mark 52A due to the gap between the ejector pin guide hole 51 and the ejector pin 52, the ejector pin mark 5
Since 2A is formed at the bottom of the concave portion 50A, the burr 51A does not protrude above the convex mirror-shaped portion 29. When the burr 51A does not protrude above the convex mirror-shaped portion 29,
Even if the burr 51A occurs, the COB
It is possible to avoid occurrence of a trouble when mounting the IC 10 on the IC card.

When the resin sealing body 28 is molded and released as described above, the molded article 30 shown in FIG. 9 is manufactured. In the molded product 30 shown in FIG. 9, a resin sealing body 28 is molded on the sheet 15 of each unit carrier 12 of the tape carrier 11, and the outer leads 1 are formed.
The sixth group is exposed on one main surface of the resin sealing body 28. Molded bodies (hereinafter, referred to as runner molded bodies) 47A, 47A of a pair of runners 47, 47 are attached to both ends of the tape carrier 11, respectively. That is, the inner side edge of each runner molded body 47A is in a state of being attached to the edge side of the tape 13. The molded body 48A of each gate 48 connected to each runner molded body 47A (hereinafter referred to as a gate molded body) is a tape carrier 1
It is in a state of being attached on the first gate resist layer 20.

The molded product 30 is sent from the transfer molding device 40 to the residue molded product removing device 8. The residue molded body removing device 8 removes the runner molded body 47A and the gate molded body 48A of the molded product 30 from the tape carrier 11 as shown in FIG. At this time, the runner molding 47
Since the inner end of A is attached to the end of the tape 13, when the runner molded body 47A is removed from the tape 13, the end of the tape 13 has a clean surface with no resin flash remaining. State. In other words, when the resin 53 leaked from the runner 47 is thinly adhered to the end face of the tape 13 to form a resin flash, the resin flash remains adhered to the surface of the end face of the tape 13. When the body 47A is attached to the end face of the tape 13, no resin flush occurs, and the runner molded body 47A can be removed without leaving the resin flush on the surface of the end face of the tape 13.

Since each gate molded body 48A connected to the runner molded body 47A is attached to the gate resist layer 20 of the tape carrier 11, an interface between the gate resist layer 20 and the tape 13 is formed. Is peeled off neatly. As a result, the gate molded body 48A is cut off at the boundary with the resin sealing body 28 by a so-called chocolate breaking action, so that the gate molded body 48A is easily and cleanly separated from the resin sealing body 28.

The molded product shown in FIG. 10 (hereinafter, referred to as an intermediate product) in which the runner molded product, the gate molded product, and the like have been removed as described above and the group of resin seals 28 has been molded on the tape carrier 11. 31 is sent to the unloading device 9 and wound up in a reel shape. On this occasion,
Since the tape 13 of the intermediate product 31 has flexibility,
It can be wound into a reel shape. In addition, since no resin flash remains on both end surfaces of the tape 13 of the tape carrier 11, even when the intermediate product 31 is wound, no foreign matter is generated by the resin flash.

When wound, the resin sealing body 28 is in a state where an external force acts. However, the chip 21 itself has a tape 1
3, that is, the thickness is set to be as thick as the thickness of the sheet 15, whereby the strength is increased, and no trouble occurs.

The intermediate product 31 wound in a reel shape is I
At the time of mounting on a C card, the sheet 15 is cut into a substantially rectangular shape along the outer shape line. As a result, the COB / IC 10 according to the configuration shown in FIGS. 2 and 3 is manufactured.

The COB / IC manufactured as described above
10 is mounted on the IC card 32 as shown in FIG. The IC card 32 includes a main body 33 formed of a rectangular card shape using a resin such as vinyl chloride, and has one main surface (hereinafter referred to as a front side surface) of the main body 33.
Is provided with a storage recess 34 at the center of one end in the longitudinal direction. The storage recess 34 has a large-diameter recess 35 having substantially the same size as the sheet 15 of the COB
A small-diameter concave portion 36 having substantially the same size as the resin sealing body 28 of the IC 10 is provided, and the large-diameter concave portion 35 and the small-diameter concave portion 36 are formed in a stepped hole shape concentrically arranged.

The COB / IC 10 is stored in the storage recess 34 with the resin sealing body 28 facing inward.
Is bonded to the stepped surface between the large-diameter concave portion 35 and the small-diameter concave portion 36 by an adhesive layer 37 formed thinly. At this time, even if the burrs 51A (see FIG. 8) protrude from the ejector pin marks 52A, the burrs 51A (see FIG. 8) are in the state of being accommodated in the recess 50A.
It does not become an obstacle to the storage of the OB / IC 10.

When the outer leads 16 of the COB / IC 10 are fixed to the recess 34 by the adhesive layer 37, the outer leads 16 are exposed to the surface of the main body 33 in the recess 34. A transparent protective cover (not shown) is formed on each of the front and rear sides of the main body 33 except for the area of the outer leads 16.

By the way, since the IC card 32 is used by being carried by a person, various strength tests are performed. As an example, COB / IC of IC card 32
There is a point pressure test in which the central portion of the ten resin sealing bodies 28 is pressed with a ball. Since the resin sealing body 28 of the COB / IC 10 according to the above configuration includes the convex mirror-shaped portion 29, the strength against the point pressure test is extremely high. That is, not only the central portion of the resin sealing body 28 is thickened, but also the point pressure is dispersed by the curved surface of the convex mirror-shaped portion 29, so that the proof strength against the point pressure test becomes extremely good.

Although the invention made by the inventor has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and can be variously modified without departing from the gist thereof. Needless to say.

For example, in the above embodiment, COB
The method of manufacturing an IC has been described.
Can also be applied to the manufacturing method.

The mounting step of mounting the chip on the tape carrier includes a fixing step of fixing the chip to the tape carrier,
Further, the present invention is not limited to the connection step in which the outer leads fixed to the tape carrier and the electrode package of the chip are electrically connected. For example, T using tape automated bonding (TAB) technology
In the CP / IC manufacturing method, the mounting step may be configured so that the chip is mechanically and electrically connected to the tape carrier.

The resin-sealed body forming step of forming the resin-sealed body on the tape carrier is not limited to the configuration in which the resin-sealed body is formed by the transfer molding method which is an example of the pressure molding method. For example, in a method for manufacturing a TCP / IC, the resin sealing body molding step may be configured to mold the resin sealing body by a potting method.

The display section is not limited to a small hole formed in the tape, but may be formed by a printing method, a stamping method, or the like.

As the display unit, a start display unit for displaying a start, an end display unit for displaying an end, a change display unit for displaying a change, a defect display unit for displaying a defect, a pitch display unit for displaying a pitch, a tape carrier It is not limited to setting the seam display section for displaying the seam, and can be increased or decreased as appropriate.

The layout of the execution device for performing each step in the integrated manufacturing apparatus is not limited to the above embodiment.

In the above description, mainly the case where the invention made by the inventor is applied to an IC card of a smart card or a memory card and a COB / IC used therefor as a background of application, Not limited to that, other IC cards,
Furthermore, COB used for electronic devices such as mobile phones, etc.
-Can be applied to IC and TCP / IC.

[0062]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

By attaching, for example, a seam display portion for displaying a seam of the tape carrier to the tape of the tape carrier on which the semiconductor chip is mounted while being sent in the longitudinal direction, the seam of the tape carrier is attached well. Since the seam can be recognized in advance when performing the transfer molding method, the seam can be avoided, and as a result,
It is possible to realize the molding of the resin sealing body to the tape carrier by the transfer molding method.

[Brief description of the drawings]

FIGS. 1A and 1B show a method of manufacturing a COB / IC according to an embodiment of the present invention, wherein FIG.
(B) is a partially omitted plan view of the product, and (c) is an enlarged partial sectional view taken along line cc of (b).

FIGS. 2A and 2B show a COB IC, wherein FIG. 2A is a front sectional view, FIG. 2B is a partially cut side view, and FIG.
It is an expansion partial front sectional view along a line.

FIG. 3 is a partially cut plan view of a COB IC.

FIG. 4 shows a tape carrier used in a method of manufacturing a COB / IC according to an embodiment of the present invention;
(A) is a partially omitted plan view on the right side, a partially omitted bottom view on the left side, and (b) is a front sectional view along line bb in (a).

FIG. 5 shows a state after the chip fixing step, in which (a) is a partially omitted plan view on the right side and a partially omitted bottom view on the left side;
(B) is front sectional drawing which follows the bb line | wire of (a).

6 (a) is a partially omitted plan view on the right side and a partially omitted bottom view on the left side, and FIG. 6 (b) is a front view along the line bb in FIG. 6 (a). It is sectional drawing.

7A and 7B show a resin sealing body forming step, in which FIG. 7A is a partially omitted bottom view of the upper mold, and FIG. 7B is a front sectional view.

FIG. 8 also shows a resin sealing body molding step,
(A) is an enlarged partial sectional view, (b) is an enlarged partial sectional view showing after mold release.

9A and 9B show a state after a resin sealing body forming step, in which FIG. 9A is a partially omitted plan view and FIG. 9B is a front sectional view.

10A and 10B show a state after removal of a runner molded body and a gate molded body. FIG. 10A is a plan view partially omitted on the right side, a bottom view partially omitted on the left side, and FIG. It is front sectional drawing which follows the -b line.

FIGS. 11A and 11B show an IC card using a COB.IC. FIG. 11A is a plan view, and FIG. 11B is an enlarged partial cross-sectional view taken along line bb of FIG.

[Explanation of symbols]

1. Integrated production equipment for COB / IC (integrated production equipment), 2.
... Loading device, 3 ... Chip bonding device, 4
... Information display device, 5 ... Cure device, 6 ... Wire bonding device, 7 ... Buffer device, 8 ... Residual molded body removing device, 9 ... Unloading device, 10 ... COB / IC
(Semiconductor device), 11: tape carrier, 12: carrier (unit carrier), 13: tape, 14: feed hole, 1
Reference numeral 5: sheet, 16: outer lead, 16a: outer lead at the center, 17: semiconductor chip receiving hole (receiving hole), 1
8 ... connection hole, 19 ... resist layer for cavity, 20 ...
Resist layer for gate, 21 ... chip (semiconductor chip),
22 electrode pad, 23 VCC electrode, 24 adhesive layer, 25 filler, 26 wire, 27 assembly, 2
8: resin sealing body, 29: convex mirror-shaped part (convex-shaped part), 3
0: molded product, 31: molded product (intermediate product), 32: IC card, 33: main body, 34: storage recess, 35: large diameter recess,
36: small diameter recess, 37: adhesive layer, 40: transfer molding device, 41: upper die, 42: lower die, 43: cavity, 44: pot, 45: plunger, 46: cull, 4
7 ... runner, 47A ... runner molded body, 48 ... gate, 4
8A: gate molded body, 49: concave mirror-shaped part (concave part), 50: convex part, 50A: concave part, 51: ejector pin guide hole, 51A: burr, 52: ejector pin, 52
A: Ejector pin mark, 53: Liquid resin (resin),
Reference numeral 70: display mark (display), 71: start display hole (start display), 72: defective display hole (defective display), 73: pitch display hole (pitch display), 74: adhesive tape, 75: connection Eyes, 76: joint display hole (joint display part), 77: change display area, 78: change display hole (change display part), 79: end display hole (end display part).

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tsuneo Endo 5-2-1, Josuihonmachi, Kodaira-shi, Tokyo Inside Semiconductor Division, Hitachi, Ltd. No. 15 Sun Eastern Semiconductor Co., Ltd.

Claims (11)

[Claims] 1. A method of manufacturing a semiconductor device, wherein a display section for displaying information related to manufacturing control is attached to a tape of a tape carrier on which semiconductor chips are sequentially transferred and mounted in a longitudinal direction. 2. A mounting step in which semiconductor chips are sequentially mounted on a tape carrier fed in a longitudinal direction at intervals in a longitudinal direction, and a resin sealing body for resin-sealing the semiconductor chips is provided on the tape carrier. A method of manufacturing a semiconductor device, comprising: a step of molding a resin sealing body to be molded, wherein a display unit for displaying information relating to control of manufacturing is attached to a tape of the tape carrier. Method. 3. The mounting step includes: a fixing step of fixing the semiconductor chip to the tape carrier; and a connecting step of electrically connecting an outer lead fixed to the tape carrier and an electrode pad of the semiconductor chip. 3. The method of manufacturing a semiconductor device according to claim 2, comprising: 4. The method according to claim 2, wherein the mounting step is configured to mechanically and electrically connect the semiconductor chip to the tape carrier. 5. The semiconductor device according to claim 2, wherein said resin sealing body molding step is configured to mold said resin sealing body by a pressure molding method. Manufacturing method. 6. The manufacturing of a semiconductor device according to claim 2, wherein the resin sealing body molding step is configured to mold the resin sealing body by a potting method. Method. 7. The device according to claim 1, wherein the display section is constituted by a small hole formed in the tape.
7. The method for manufacturing a semiconductor device according to 2, 3, 4, 5, or 6. 8. A start display unit for displaying a start, an end display unit for displaying an end, a change display unit for displaying a change, a defect display unit for displaying a defect as the display unit,
The pitch display section for displaying a pitch and a seam display section for displaying a seam of a tape carrier are set, according to claim 1, 2, 3, 4, 5, 6, or 7. A method for manufacturing a semiconductor device. 9. A mounting device for mounting a semiconductor chip on a tape carrier fed in a longitudinal direction at an interval in a longitudinal direction, and a resin sealing for molding a resin sealing body for resin sealing the semiconductor chip on the tape carrier. An apparatus for manufacturing a semiconductor device, comprising: a body forming device; and an information display device for attaching a manufacturing control information display section to a tape of the tape carrier. 10. The apparatus according to claim 9, wherein the information display device is configured to open a small hole as a manufacturing control information display section at a predetermined position on the tape. . 11. The information display device includes a start display unit for displaying a start, an end display unit for displaying an end, a change display unit for displaying a change, a defect display unit for displaying a defect, and a pitch. 11. The semiconductor device manufacturing apparatus according to claim 9, wherein a pitch display section for displaying a tape carrier and a seam display section for displaying a seam of a tape carrier are displayed.