JPH10199910A - Semiconductor device, manufacture thereof and ic card using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flexible COB(chip-on-board package) IC having a specified strength for flexible IC cards. SOLUTION: A flexible COB/IC 10 having a specified strength for IC cards is composed of a carrier 12 and a chip 21. The carrier 12 is an insulating flexible sheets 15 having eight outer side leads at both sides of a center outer lead 16a on one main surface, with connection holes 18 bored at positions facing side outer leads 16. The chip 21 is disposed in a hole 17 at the center of the sheet 15 and fixed to the center outer lead 16a, through an insulative adhesive layer 24. Wires 26 bonded to electrode pads 22 of the chip 21 are connected to respective side outer leads 16 at the connection holes 18. The chip 21 and wires 26 on the sheet 15 are sealed with a resin, to form a resin sealed body 28 having a convex part 29 at the top surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a semiconductor device having a chip-on-board package (hereinafter referred to as a COB), and more particularly to a semiconductor device which is effective when used in a so-called IC card. .

[0002]

2. Description of the Related Art An IC card includes a semiconductor integrated circuit device having a COB (hereinafter referred to as a COB IC) built in a plastic card. Among IC cards, those in which a microcomputer is constructed by COB / IC are called smart cards, and those using ICs having an EEPROM, a flash memory, or the like are called memory cards. COB ・ I
C is inserted into a storage recess recessed on the surface near one end of the plastic card and adhered by an adhesive, and the outer lead is exposed outside the storage recess.

Conventional COB.I used for IC card
C, a carrier in which a plurality of outer leads are fixed to one main surface of an insulating sheet and a plurality of connection holes are opened at positions facing predetermined outer leads of the sheet; A semiconductor chip fixed on the other main surface, one end part is bonded to each outer lead in each connection hole and the other end part is bonded to each electrode pad of the semiconductor chip, and each outer lead and the semiconductor chip are separated. Some include a wire that is electrically connected, and a resin sealing body that seals the semiconductor chip and the wire group with a resin.

Japanese Patent Application Laid-Open No. 2-112264 discloses an example of this type of semiconductor device, its manufacturing method, and an IC card using the same.

[0005]

In the conventional COB / IC used for the above-mentioned IC card, since the semiconductor chip is fixed on the sheet, the thickness of the COB is reduced by the thickness of the semiconductor chip and the thickness of the sheet. It is determined by the sum with the outer lead. Here, when the sheet in the carrier is formed of a flexible material without changing the thickness of the semiconductor chip, the sheet, and the outer leads, the strength of the COB / IC as a whole decreases, so that the defect rate increases. It has been found by the present inventors that there is a problem that the In addition, the so-called glass or COB / IC sheet is generally widely used for printed wiring boards.
When it is made of an epoxy resin, there is a problem that not only the flexibility is low but also the cost cannot be reduced.

An object of the present invention is to provide a semiconductor device and a method for manufacturing the same, which can prevent a decrease in strength and reduce costs even when a sheet of a carrier is formed of a flexible material. Is to do.

[0007] The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0008]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

That is, a semiconductor device which has solved the problem is as follows.
An insulating sheet having a plurality of outer leads fixed to one main surface is formed of a flexible material, and a semiconductor chip receiving hole is formed at a position of the sheet facing the semiconductor chip. The semiconductor chip is fixed to the outer lead exposed at the bottom of the semiconductor chip housing hole by an adhesive layer. According to this semiconductor device, since the semiconductor chip is fixed in the semiconductor chip receiving hole formed in the sheet, the thickness of the semiconductor chip can be set to be thicker by the thickness of the sheet. Mechanical strength can be increased.

[0010] The outer lead to which the semiconductor chip is fixed is separated from the other outer lead and is configured to be electrically insulated, so that the electrical insulation state between the semiconductor chip and the other outer lead is reliably maintained. Can be.

By forming the main surface of the resin sealing body opposite to the outer lead group in a convex shape, the point pressure strength of the resin sealing body is increased, and the mechanical strength of the entire semiconductor device is increased. be able to.

By forming a stress absorbing portion having a divergent taper at a contact portion of the resin sealing body with the sheet, peeling between the resin sealing body and the sheet can be prevented. Even when bending stress is applied to the body, separation between the resin sealing body and the sheet can be reliably prevented.

[0013]

1 shows a COB IC according to an embodiment of the present invention. FIG.
(B) is a partially cut side view, and (c) is an enlarged partial front sectional view taken along line cc of (b). Figure 2 shows the COB · I
It is a partially cut-away plan view of C. FIG. 3 to FIG. 9 are explanatory views for explaining a method of manufacturing a COB / IC according to an embodiment of the present invention. FIG. 10 shows an IC card using the COB.IC, (a) is a plan view, (b)
FIG. 4 is an enlarged partial cross-sectional view taken along line bb in FIG.

In the present embodiment, the semiconductor device according to the present invention is configured as a COB IC used in an IC card as shown in FIGS. The COB IC 10 includes a carrier 12 and a semiconductor chip 21. The carrier 12 includes a substantially square thin sheet 15 having insulation and flexibility.
Nine outer leads 16 are fixed to one main surface of the sheet 15. The nine outer leads 16 have one other rectangular outer lead (hereinafter, referred to as a central outer lead) 16a, and eight other outer leads (hereinafter, referred to as both outer leads) beside both long sides. They are arranged symmetrically. Each of the outer leads 16 is separated from each other and is in an electrically disconnected state. That is, the outer leads 16 on both sides are electrically disconnected from each other, and the group of outer leads 16 on both sides and the outer lead 16a at the center are electrically disconnected.

A semiconductor chip receiving hole 17 is formed at a position facing the outer lead 16a at the center of the sheet 15, and the outer lead 16a at the center closes one end opening of the semiconductor chip receiving hole 17 and is exposed at the bottom. It is in a state. The semiconductor chip 21 has a central outer lead 16 a exposed at the bottom of the semiconductor chip housing hole 17.
It is fixed on the top. A plurality of connection holes 18 are respectively formed at positions on both sides of the sheet 15 facing the outer leads 16. One end of each of the electrode pads 22 formed on the main surface of the semiconductor chip 21 on the side opposite to the sheet 15 is connected to the other end of a wire 26 having one end bonded to each of the outer leads 16 on both sides in each connection hole 18. The outer leads 16 on both sides and the semiconductor chip 21 are electrically connected by wires 26. Here, the outer leads 16a at both sides and the outer leads 16a at the center are electrically disconnected from each other, and the outer leads 16a at the center are electrically disconnected from the outer leads 16 at both sides. It has become. The semiconductor chip 21 and the group of wires 26 are resin-sealed by a resin sealing body 28. And this COB ・ IC1
0 is manufactured by a manufacturing method described later.

Hereinafter, COB · which is an embodiment of the present invention will be described.
A method for manufacturing an IC will be described. By this description, the details of the configuration of the COB / IC according to the configuration will be clarified.

The method for manufacturing a COB / IC according to the present embodiment includes the steps shown in FIG.
The tape carrier 11 shown in FIG. FIG.
Is composed of a number of carriers (hereinafter, referred to as unit carriers) 12 and has a tape 13 as a material of a sheet. The tape 13 is made of an insulating and flexible resin, and is formed in an elongated tape shape having a constant width. A large number of feed holes 14 are formed at both ends of the tape 13 at regular intervals in the longitudinal direction. Tape 13
A pair of sheets 15 between the rows of the two feed holes 14
15 are virtually formed side by side in the lateral direction, and both groups of sheets 15 are arranged in a line on each side of the tape 13.

Nine outer leads 16 are provided on one main surface (hereinafter, referred to as a first main surface) of the sheet 15 of each unit carrier 12, and four outer leads 16 are provided on both sides of the central outer lead 16a. They are arranged symmetrically left and right and fixed. The outer leads 16 are formed by patterning a copper foil adhered to the first main surface of the tape 13 by lithography and etching, and forming a 5 μm nickel plating film and a 0.1 μm
Of gold plating (both not shown). Each of the outer leads 16 is separated from each other and is in an electrically disconnected state.

At the center of the sheet 15, a semiconductor chip receiving hole (hereinafter, referred to as a receiving hole) 17 is opened from the other main surface (hereinafter, referred to as a second main surface) side of the first main surface. The central outer lead 16a is exposed at the bottom of the housing hole 17. Eight connection holes 18 are symmetrically arranged on each side of the accommodation hole 17 of the sheet 15 and are opened from the second main surface side. The bottom of each connection hole 18 has both sides. Each of the outer leads 16 is exposed.

On the second main surface of the sheet 15 of each unit carrier 12, a cavity resist layer 19 is provided with an accommodation hole 1.
It is formed in a substantially square frame shape so as to surround the group 7 and the group of connection holes 18, and the cavity resist layer 19 is set so as to correspond to the outer edge of the cavity in a transfer molding apparatus described later. A gate resist layer 20 is formed in a substantially rectangular shape with a constant width at a predetermined position on the outer periphery of the cavity resist layer 19 on the side of the feed hole 14, and the gate resist layer 20 is formed by a gate in a transfer molding apparatus described later. Is set to correspond to. The cavity resist layer 19 and the gate resist layer 20 are formed by being applied by a screen printing method and then being cured by ultraviolet rays, and have a thickness of 10 to 30 μm.

The tape carrier 1 constructed as described above
In the semiconductor chip fixing step 1, a semiconductor chip (hereinafter, referred to as a chip) is fixed as shown in FIG. The chip 21 is diced into small pieces smaller than the size of the receiving hole 17 in the subsequent dicing process after the integrated circuit of the microcomputer is formed in the state of the semiconductor wafer in the so-called pre-process in the IC manufacturing process. Thus, the IC structure is manufactured. A plurality of (six in the present embodiment) electrode pads 22 are formed on an outer peripheral portion of one main surface (hereinafter, referred to as a first main surface) of the chip 21. Incidentally, the electrode pads 22 are also formed in a semiconductor wafer state. A main surface of the chip 21 opposite to the first main surface (hereinafter referred to as a second main surface)
Main surface. ), A VCC electrode 23 is set.

In the semiconductor chip fixing step, an adhesive layer 24 having an insulating property is applied on the outer lead 16a at the center exposed at the bottom of each accommodation hole 17 in the tape carrier 11. Filler 25 having an insulating property is mixed in the adhesive forming the adhesive layer 24,
The filler 25 has a particle size of 20 to 100 μm. The VCC electrode 23 of the chip 21 is adhered to the adhesive layer 24. Since the adhesive is mixed with an insulating filler 25 having a particle size of 20 to 100 μm, the adhesive layer 2
In a state where the chip 21 is adhered on the outer lead 16a at the center of the accommodation hole 17 by the chip 4, the chip 21 is completely insulated from the outer lead 16a at the center.

Next, in the connection step, as shown in FIG. 5, each wire is provided between each electrode pad 22 of the chip 21 and each of the outer leads 16 on both sides exposed at the bottom of each connection hole 18. 26 is bonded. A gold wire is used as a wire constituting the wire 26. Since the surface of the outer lead 16 is covered with a gold plating film (not shown), the bondability is extremely good. As a result, the chip 21 is electrically connected to the outer leads 16 on both sides via the wires 26. By the way, the outer lead 16a at the center
Are electrically floating from the pellet 21 and the outer leads 16 on both sides.

As described above, the assembly 2 in which the chip and wire bonding are performed on the tape carrier 11
7, the resin sealing body 28 is molded by the transfer molding apparatus 40 shown in FIG.

The transfer molding apparatus 40 shown in FIG. 6 includes an upper mold 41 and a lower mold 42 which are mutually matched by a mold clamping device (not shown) or the like. A plurality of cavities 43 are submerged in the mating surface of the upper die 41 in a row of two rows. A pair of pots 44 are formed on the mating surface of the lower mold 42, and two pots 44 are formed outside the two rows of the cavities 43. A plunger 45 driven up and down by a cylinder device (not shown) is movable in each pot 44. It is inserted in.

A pair of runners 47, 47 corresponding to two rows of cavities 43 are provided on the mating surface of the upper mold 41, with each cull 46 being opposed to each pot 44, respectively. Each is connected. Both runners 4
7 and 47 are laid in parallel with each row outside of both rows of the cavity 43, and both runners 47 and 47 are provided.
Is connected to each gate 48 opened for each cavity 43 in each row. Also, both runners 4
7 and 47 are laid so as to be in contact with both sides of the tape carrier 11 when the assembly 27 is installed in the transfer molding apparatus 40 as described later.

As shown in FIG. 7, a concave mirror-shaped portion 49 as a concave portion is formed on the ceiling surface corresponding to the bottom of the hole of each cavity 43.
9 forms a convex mirror-shaped part 29 as a convex part on the upper surface of the resin sealing body 28. At the center of the ceiling surface of each cavity 43 on the side opposite to the gate 48, a convex portion 50 having a substantially semi-elliptical shape in a plan view is protruded at a constant height. An ejector pin guide hole 51 is formed on the center line of the projection 50, and the ejector pin guide hole 51 is provided in the ejector pin guide hole 51.
Is inserted so that it can advance and retreat.

When the resin molded body 28 is molded by the transfer molding apparatus 40 having the above-described configuration, the assembly 27 is set on the lower mold 42 with the respective chips 21 facing upward. You. A tablet (not shown) on which a molding resin as a molding material has been pressed is put into a pot 44. At this time, as the molding resin, a molding resin having the same color as or close to the color of a card body of an IC card described later is used. For example, when the color of the card body of the IC card using the COB / IC is white, a molding resin colored white is used. That is,
Not only a molding resin mixed with carbon (black), which is generally used as a molding material for a resin sealing body of an IC package, but also other molding resins are used. This is because COB
When the IC is used for the IC card, the color of the resin sealing body 28 is prevented from being seen through the protection cover of the IC card.

Next, the upper mold 41 and the lower mold 42 are clamped. When the mold is clamped, the chip 21 is housed in the cavity 43 of the upper mold 41, and the outer peripheral edge of the cavity 43 and the gate 48 are connected to the cavity resist layer 19 and the gate for the tape carrier 11. Each of them comes into a state of being pressed against the resist layer 20. In this state, the inner end sides of the two runners 47 are in contact with both end sides of the tape carrier 11, respectively.

The tablet is heated by a heater (not shown) and melted to form a liquid resin (hereinafter referred to as a resin).
At 53, the resin 53 is pushed out of the pot 44 by the plunger 45, and the runner 47 and the gate 48
Through the cavity 43. After a lapse of a predetermined time, the filled resin 53 is thermally cured. Since the resin 53 is transferred (transferred) through the runner 47 and the gate 48 and is filled in the cavity 43, the runner 47 and the gate 48, which are intermediate transfer paths, are provided.
In this case, the resin 53 is filled and cured.

At the time of transport and filling, the liquid resin 53 tends to leak from between the mating surfaces of the upper mold 41 and the lower mold 42, but the outer periphery of the cavity 43 and the gate 4
Since the cavity resist layer 19 and the gate resist layer 20 of the tape carrier 11 pressed against the tape 8 just serve as packing, the occurrence of leakage is prevented. Therefore, occurrence of resin flash is prevented. Further, so-called indentations are formed on the outer leads 16 with the mold clamping. However, the cavity resist layer 19 and the gate resist layer 20 of the tape carrier 11 pressed against the outer peripheral edge of the cavity 43 and the gate 48 are just cushioned. Therefore, the phenomenon that so-called indentations are formed on the outer leads 16 is prevented.

Resin 53 filled in cavity 43
Is thermally cured, the upper mold 41 and the lower mold 42 are opened, and the resin sealing body 28 formed by the cavity 43 is removed from the cavity 43 by the ejector pin 5.
2 and is released from the mold.

On the main surface of the resin sealing body 28 opposite to the tape carrier 11, a convex mirror-shaped portion 29 is formed by a concave mirror-shaped portion 49 of the cavity 43. A concave portion 50A is recessed by the convex portion 50 of the cavity 43 in a part of the outer periphery of the convex mirror-shaped portion 29, and an ejector pin mark 52A is formed by an ejector pin 52 at the bottom of the concave portion 50A.

As shown in FIG. 7B,
Even if a projection-shaped burr 51A is formed around the ejector pin mark 52A due to the gap between the ejector pin guide hole 51 and the ejector pin 52, the ejector pin mark 5
Since 2A is formed at the bottom of the concave portion 50A, the burr 51A does not protrude above the convex mirror-shaped portion 29. When the burr 51A does not protrude above the convex mirror-shaped portion 29,
Even if the burr 51A occurs, the COB
It is possible to avoid occurrence of a trouble when mounting the IC 10 on the IC card.

When the resin sealing body 28 is molded and released as described above, the molded product 30 shown in FIG. 8 is in a manufactured state. In the molded article 30 shown in FIG. 8, the sheet 1 of each carrier 12 of the tape carrier 11
5 is formed with a resin sealing body 28, and the outer leads 16 are exposed on one main surface of the resin sealing body 28. A molded body of a pair of runners 47, 47 (hereinafter, referred to as a runner molded body) 4 is provided at both ends of the tape carrier 11.
7A and 47A are respectively attached.
That is, the inner edge of each runner molded body 47A is tape 1
3 is attached to the edge. A molded body (hereinafter, referred to as a gate molded body) 48A of each gate 48 connected to each runner molded body 47A is attached to the gate resist layer 20 of the tape carrier 11.

Thereafter, the runner molding 47A of the molding 30 is formed.
The gate molding 48A and the like are removed from the tape carrier 11 as shown in FIG. At this time, since the inner side edge of the runner formed body 47A is attached to the end side of the tape 13, the runner formed body 47A
When the tape 3 is removed, the end surface of the tape 13 becomes a clean surface state in which no resin flash remains. In other words, when the resin 53 leaked from the runner 47 is thinly adhered to the end face of the tape 13 to form a resin flash, the resin flash remains adhered to the surface of the end face of the tape 13. When the body 47A is attached to the end face of the tape 13, no resin flush occurs, and the runner molded body 47A can be removed without leaving the resin flush on the surface of the end face of the tape 13.

Since each gate molding 48A connected to the runner molding 47A is attached to the gate resist layer 20 of the tape carrier 11, an interface between the gate resist layer 20 and the tape 13 is formed. Is peeled off neatly. As a result, the gate molded body 48A is cut off at the boundary with the resin sealing body 28 by a so-called chocolate breaking action, so that the gate molded body 48A is easily and cleanly separated from the resin sealing body 28.

The molded product shown in FIG. 9 (hereinafter, referred to as the molded product) in which the runner molded product, the gate molded product, and the like are removed as described above, and the resin sealing body 28 group is molded on the tape carrier 11.
It is called an intermediate product. ) 31 is wound in a reel shape.
At this time, since the tape 13 of the intermediate product 31 has flexibility, it can be wound in a reel shape. In addition, since no resin flash remains on both end faces of the tape 13 of the tape carrier 11, the intermediate product 31
Is wound, no foreign matter is generated by the resin flash.

When wound, the resin sealing body 28 is in a state where an external force acts. However, the chip 21 itself has a tape 1
3, that is, the thickness is set to be as thick as the thickness of the sheet 15, whereby the strength is increased, and no trouble occurs.

The intermediate product 31 wound in a reel shape is I
At the time of mounting on a C card, the sheet 15 is cut into a substantially rectangular shape along the outer shape line. As a result, the COB / IC 10 according to the configuration shown in FIGS. 1 and 2 is manufactured.

COB IC manufactured as described above
10 is mounted on the IC card 32 as shown in FIG. The IC card 32 includes a main body 33 formed of a rectangular card shape using a resin such as vinyl chloride, and has one main surface (hereinafter referred to as a front side surface) of the main body 33.
Is provided with a storage recess 34 at the center of one end in the longitudinal direction. The storage recess 34 has a large-diameter recess 35 having substantially the same size as the sheet 15 of the COB
A small-diameter concave portion 36 having substantially the same size as the resin sealing body 28 of the IC 10 is provided, and the large-diameter concave portion 35 and the small-diameter concave portion 36 are formed in a stepped hole shape concentrically arranged.

The COB / IC 10 is stored in the storage recess 34 with the resin sealing body 28 facing inward.
Is bonded to the stepped surface between the large-diameter concave portion 35 and the small-diameter concave portion 36 by an adhesive layer 37 formed thinly. At this time, even if the burrs 51A (see FIG. 7) protrude from the ejector pin marks 52A, since the burrs 51A (see FIG. 7) are housed in the recesses 50A, the C
It does not become an obstacle to the storage of the OB / IC 10.

When the outer lead 16 of the COB IC 10 is fixed to the recess 34 by the adhesive layer 37, the outer lead 16 is exposed to the surface of the main body 33 in the recess 34. A transparent protective cover (not shown) is formed on each of the front and rear sides of the main body 33 except for the area of the outer leads 16.

Incidentally, since the IC card 32 is used by being carried by a person, various strength tests are performed. As an example, COB / IC of IC card 32
There is a point pressure test in which the central portion of the ten resin sealing bodies 28 is pressed with a ball. Since the resin sealing body 28 of the COB / IC 10 according to the above configuration includes the convex mirror-shaped portion 29, the strength against the point pressure test is extremely high. That is, not only the central portion of the resin sealing body 28 is thickened, but also the point pressure is dispersed by the curved surface of the convex mirror-shaped portion 29, so that the proof strength against the point pressure test becomes extremely good.

According to the above embodiment, the following effects can be obtained. (1) By fixing the chip to the accommodation hole formed in the sheet, the thickness of the chip can be set to be larger by the thickness of the sheet, so that the mechanical strength of the COB / IC as a whole. Can be increased.

(2) By forming the main surface of the resin sealing body into a convex mirror-shaped portion, the point pressure strength of the resin sealing body can be increased, and the mechanical strength of the entire COB / IC increases. Can be done.

(3) The chip is bonded to the center outer lead with an adhesive layer mixed with an insulating filler having a particle size of 20 to 100 μm, thereby maintaining the chip completely insulated from the outer lead. be able to.

(4) The outer leads at the center to which the chip is bonded are separated from the other outer lead groups on both sides to be electrically disconnected from each other, so that the chip is electrically insulated from the other outer lead groups. Can be reliably maintained.

(5) By setting the color of the molding resin for molding the resin sealing body to be the same as or close to the color of the IC card body, when the COB / IC is mounted on the IC card, It is possible to prevent the resin sealing body from being seen through the protection cover of the IC card.

(6) By forming the cavity resist layer and the gate resist layer on the tape carrier before molding the resin sealing body, the cavity resist layer and the gate are formed at the time of molding the resin sealing body. Since the resist layer can serve as a packing, it is possible to prevent the resin from leaking.

(7) In addition, so-called indentations are formed on the outer leads as the mold is clamped. The outer leads serve as cushions for the cavity resist layer and the gate resist layer pressed against the outer peripheral edge of the cavity and the gate. The so-called indentation can be prevented from being formed on the outer lead.

(8) By arranging the ejector pins in the projecting portions protruding from the ceiling surface of the cavity for molding the resin sealing body, a projection shape is formed around the ejector pin mark of the resin sealing body. Even if burrs are formed, it is possible to prevent the burrs from projecting upward from the surface of the resin sealing body, so that it is possible to avoid occurrence of a failure when mounting the COB / IC on the IC card. .

(9) By laying the runner of the transfer molding apparatus for molding the resin sealing body along the edge of the tape carrier, when the runner molded body is removed from the tape, the resin is applied to the end face of the tape. It is possible to prevent the flash from remaining.

(10) By forming the gate molded body on the gate resist layer, the gate molded body can be peeled off cleanly at the interface between the gate resist layer and the tape, and the gate molded body can be formed of resin. Since it can be cut by the so-called chocolate breaking action at the boundary with the sealing body, the gate molded body can be easily and cleanly separated from the resin sealing body.

(11) By forming the sheet of the tape carrier with a flexible tape, the intermediate product in which the resin sealing body group is formed on the tape carrier can be wound in a reel shape. -It is possible to improve the ease of handling in transporting ICs and mounting on IC cards.

FIG. 11 shows another embodiment of the present invention.
FIGS. 3A and 3B show a tape carrier used in a method for manufacturing a B.IC. FIG. 3A is a partially omitted bottom view, and FIG.
It is front sectional drawing which follows the -b line. FIG. 12 shows a resin sealing body molding step using the tape carrier.

The second embodiment is different from the first embodiment in that, as shown in FIG. 11, a resin wiring is prevented by a plating wiring 60 for plating a group of outer leads 16. Are formed, and an index indicating a direction is formed. That is, the tape carrier 1
A resin flash prevention pattern (hereinafter, referred to as a gate pattern) for preventing resin flash at a portion corresponding to the gate on a portion corresponding to the gate on the main surface on the side where the one outer lead 16 group is formed.
61 are formed. A resin flash prevention pattern (hereinafter referred to as a “feed hole pattern”) 62 for preventing resin flash at a portion corresponding to the feed hole 14 is formed at each of the feed holes 14 so as to surround the feed hole 14. Have been. Outer leads (hereinafter, referred to as VCC outer leads 16b) serving as VCC electrodes among the group of outer leads 16 in the wiring 60 for plating.
The index pattern 6 for indicating the position of the outer lead 16b for VCC is provided at the corner corresponding to
3 are formed. The gate pattern 61, the feed hole pattern 62, and the index pattern 63 are formed simultaneously with the outer leads 16 and the plating wiring 60 when patterning the outer leads 16;
It is in a state of being connected to the wiring 60 for plating.

According to the second embodiment, since the gate pattern 61 and the feed hole pattern 62 are formed, as shown in FIG. Since the resin 53 can be prevented from leaking from the gate 48 into the inside of the feed hole 14, the resin flash (not shown) is used to prevent the resin 53 from leaking.
4 can be prevented. By preventing the resin flash from adhering to the feed hole 14,
During the operation of feeding the intermediate product by the sprocket (not shown), the engagement of the teeth of the sprocket with the feed hole can be properly maintained, and the secondary harm occurs due to the resin flash attached to the feed hole falling off. Can be prevented beforehand.

For example, in the electrical characteristic test, when it is necessary to probe the outer leads 16 on the tape carrier 11, the position of the VCC outer leads 16b can be recognized by the index pattern 63. And the desired probing can be performed.

As shown in FIG. 12, in the present embodiment, the center of the side of the ceiling surface of the cavity 43 where the index pattern 63 is located,
An index forming convex portion 54 for forming a shallow hole-shaped index 54A is projected. An index 54A for indicating the position of the VCC outer lead 16b is formed on the edge of the upper surface of the resin sealing body 28 on the side where the VCC outer lead 16b is located by the index molding projection 54. This index 5
Since the position of the VCC outer lead 16b can be recognized by the 4A, the assembling direction of the COB / IC 10 can be specified when assembling the IC card 32.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the embodiment, and various modifications can be made without departing from the gist of the invention. Needless to say.

For example, runners and gates in a transfer molding apparatus for molding a resin sealing body are shown in FIGS.
They can be arranged as shown in each schematic diagram shown in FIG.

In the third embodiment shown in FIG. 13, the cull 46 is arranged only on one side of the molded product 30, and a pair of sub-runners 47 B, 47 B are branched from the runner 47 connected to the cull 46. In addition, four gates 48 are respectively connected to both ends of each sub-runner 47B.

In the fourth embodiment shown in FIG. 14, the cull 46 is disposed only on one side of the molded product 30, and four sub-runners 47 B are branched from the runner 47 connected to the cull 46. In addition, a gate 48 is connected to each of the sub-runners 47B.

In the fifth embodiment shown in FIG. 15, the cull 46 is arranged only on one side of the molded product 30, and a plurality of through gates 48C are connected to the runners 47 connected to the cull 46, respectively. Have been.

The adhesive layer for bonding the chip and the outer lead at the bottom of the storage hole is not limited to being formed by an adhesive containing a filler having a particle diameter of 20 to 100 μm. It may be formed by an adhesive.

The outer lead at the center to which the chip is fixed is not limited to being separated from the other outer leads on both sides, and may be connected to one or more outer leads.

The electrical connection between the chip and the outer lead is as follows:
Not only the wire bonding method but also a method other than the wire bonding method may be used.

The main surface of the resin sealing body is not limited to being formed in a convex mirror shape, but may be formed in another convex shape portion or a flat surface.

Further, as shown in FIG. 16, a contact portion of the outer periphery of the resin sealing body 28 with the sheet 15 has a taper for releasing from the side surface of the resin sealing body 28. The stress absorbing portion 55 having a divergent inclination angle larger than the inclination angle may be formed. When the stress absorbing portion 55 is formed in the resin sealing body 28, the stress at the interface between the resin sealing body 28 and the sheet 15 can be dispersed. Peeling can be prevented. When the separation between the resin sealing body 28 and the sheet 15 is prevented, even when bending stress is applied to the COB / IC 10, the separation between the resin sealing body 28 and the sheet 15 is prevented. Can be prevented,
It is possible to prevent the occurrence of defects such as wire breakage due to the progress of the peeling.

In the above description, the case where the invention made by the present inventor is mainly applied to a smart card or a memory card IC card and a COB / IC used therefor as a background of application has been described. Not limited to that, other IC cards,
Furthermore, COB used for electronic devices such as mobile phones, etc.
-Applicable to IC.

[0072]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

By fixing the chip to the accommodation hole formed in the sheet, the thickness can be set to be as large as the thickness of the sheet, so that the mechanical strength of the entire semiconductor device can be increased. .

By forming the main surface of the resin-sealed body in a convex shape, the point pressure strength of the resin-sealed body can be increased, so that the mechanical strength of the entire semiconductor device can be increased. .

[Brief description of the drawings]

1A and 1B show a COB IC according to an embodiment of the present invention, wherein FIG. 1A is a front sectional view, FIG. 1B is a partially cut side view, and FIG. It is an expansion partial front sectional view along a line.

FIG. 2 is a partially cut plan view of the COB · IC.

FIG. 3 shows a tape carrier used in a method of manufacturing a COB / IC according to an embodiment of the present invention;
(A) is a partially omitted plan view on the right side, a partially omitted bottom view on the left side, and (b) is a front sectional view along line bb in (a).

FIG. 4 shows a state after the chip fixing step, in which (a) is a partially omitted plan view on the right side and a partially omitted bottom view on the left side;
(B) is front sectional drawing which follows the bb line | wire of (a).

FIG. 5 shows a state after the connection fixing step, in which (a) is a partially omitted plan view on the right side and a partially omitted bottom view on the left side;
(B) is front sectional drawing which follows the bb line | wire of (a).

6A and 6B show a resin sealing body forming step, wherein FIG. 6A is a partially omitted bottom view of the upper mold, and FIG. 6B is a front sectional view.

FIG. 7 also shows a resin sealing body molding step,
(A) is an enlarged partial sectional view, (b) is an enlarged partial sectional view showing after mold release.

8A and 8B show a state after a resin sealing body forming step, in which FIG. 8A is a partially omitted plan view and FIG. 8B is a front sectional view.

9A and 9B show a state after removal of a runner molded body and a gate molded body. FIG. 9A is a plan view partially omitted on the right side, a bottom view partially omitted on the left side, and FIG. It is front sectional drawing which follows the -b line.

FIGS. 10A and 10B show an IC card using a COB.IC. FIG. 10A is a plan view, and FIG. 10B is an enlarged partial cross-sectional view taken along line bb of FIG.

FIG. 11 shows a tape carrier used in a method of manufacturing a COB / IC according to another embodiment of the present invention,
(A) is a partially omitted bottom view, and (b) is a front sectional view along the line bb in (a).

12A and 12B show a resin sealing body molding process using the tape carrier, wherein FIG. 12A is a front sectional view, FIG. 12B is a sectional view taken along line bb of FIG. 12A, and FIG. (A) c-
FIG. 4 is a cross-sectional view taken along the line c, and FIG.

FIG. 13 is a schematic view showing the arrangement of runners and gates in the method of manufacturing a COB / IC according to the third embodiment of the present invention.

FIG. 14 is a schematic diagram showing the arrangement of runners and gates in the method of manufacturing a COB / IC according to the fourth embodiment of the present invention.

FIG. 15 is a schematic diagram showing the arrangement of runners and gates in a method of manufacturing a COB / IC according to a fifth embodiment of the present invention.

FIG. 16 shows a COB IC according to another embodiment of the present invention.
(A) is a partially cut-away plan view, and (b) is a cross-sectional view taken along the line bb of (a).

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... COB * IC (semiconductor device), 11 ... Tape carrier, 12 ... Carrier (unit carrier), 13 ... Tape, 14 ... Sending hole, 15 ... Sheet, 16 ... Outer lead, 16a ... Center outer lead, 16b ... VCC Outer lead, 17 ... semiconductor chip housing hole (housing hole),
18 connection holes, 19 resist layers for cavities, 20
... Gate resist layer, 21 chip (semiconductor chip), 22 electrode pad, 23 VCC electrode, 24 adhesive layer, 25 filler, 26 wire, 27 assembly, 28 resin seal, 29: convex mirror-shaped part (convex part), 30: molded product, 31: molded product (intermediate product), 32
... IC card, 33 ... Main body, 34 ... Storage recess, 35 ... Large diameter recess, 36 ... Small diameter recess, 37 ... Adhesive layer, 40 ... Transfer molding device, 41 ... Upper mold, 42 ... Lower mold, 43 ... Cavity , 44… pot, 45… plunger, 46…
Cul, 47 ... Runner, 47A ... Runner molded body, 47B ...
Sub-runner, 48 gate, 48A gate molded body, 4
8C: through gate, 49: concave mirror-shaped part (concave part), 50: convex part, 50A: concave part, 51: ejector pin guide hole, 51A: burr, 52: ejector pin, 52
A: Ejector pin mark, 53: Liquid resin (resin),
54: Index forming convex part, 54A: Index, 55: Stress absorbing part, 60: Plating wiring, 61: Resin flash prevention pattern (gate pattern),
62: Resin flash prevention pattern (feed hole pattern), 63: Index pattern.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI H01L 23/28 G06K 19/00 K (72) Inventor Kazuaki Uehara 15 Asahidai, Oro-machi, Moroma-gun, Saitama, Japan In-house (72) Inventor Takuya Nakajo 5-2-1, Kamimizuhoncho, Kodaira-shi, Tokyo In-house Semiconductor Division, Hitachi, Ltd. (72) Kazuyuki Takeshita 5-2-1, Kamimizuhoncho, Kodaira-shi, Tokyo Hitachi, Ltd.Semiconductor Division (72) Inventor Tsuneo Endo 5-2-1, Josuihonmachi, Kodaira-shi, Tokyo Incorporated Hitachi, Ltd. Semiconductor Division (72) Inventor Tsuneo Sato, Kamizuhoncho, Kodaira-shi, Tokyo Gochome No. 20, No. 1 Semiconductor Division, Hitachi, Ltd.

Claims (16)

[Claims] 1. An insulating sheet having a plurality of outer leads fixed to one main surface, and a semiconductor disposed on the other main surface of the sheet and electrically connected to each of the outer leads. In a semiconductor device comprising a chip and a resin sealing body for resin-sealing the semiconductor chip, a position where the sheet is formed of a flexible material and which faces the semiconductor chip in the sheet A semiconductor chip accommodating hole is formed in the semiconductor chip, and the semiconductor chip is fixed to the outer lead exposed at the bottom of the semiconductor chip accommodating hole by an adhesive layer. 2. The semiconductor device according to claim 1, wherein the outer lead to which the semiconductor chip is fixed is separated from the other outer lead and is electrically insulated. 3. The adhesive has a particle size of 20 to 100 μm.
2. The semiconductor device according to claim 1, further comprising a filler having an insulating property. 4. An insulating sheet having a plurality of outer leads fixed to one main surface, and a semiconductor disposed on the other main surface of the sheet and electrically connected to each of the outer leads. In a semiconductor device comprising a chip and a resin sealing body for resin-sealing the semiconductor chip, a main surface of the resin sealing body opposite to the outer lead group is formed in a convex shape. Semiconductor device. 5. The semiconductor device according to claim 1, wherein the sheet is formed of a flexible material, and a semiconductor chip receiving hole is formed in the sheet at a position facing the semiconductor chip. The semiconductor device according to claim 4, wherein the semiconductor chip is fixed to the exposed outer leads by an adhesive layer. 6. The semiconductor device according to claim 1, wherein an index is formed at a position corresponding to a ground outer lead side in the resin sealing body. 7. A stress absorbing portion having a divergent taper is formed at a contact portion of the resin sealing body with the sheet.
Or the semiconductor device according to 6. 8. An IC card, wherein the semiconductor device according to claim 1 is housed in a concave portion provided in a card-shaped main body. 9. The IC card according to claim 8, wherein the color of the resin of the resin sealing body and the color of the card body are set to be the same or close to each other. 10. A plurality of outer leads are fixed to one main surface of a sheet having insulation and flexibility, and a semiconductor chip receiving hole is formed at a position facing a predetermined outer lead of the sheet. A carrier manufacturing step in which a carrier is manufactured, a semiconductor chip fixing step in which a semiconductor chip is fixed by an adhesive layer to the outer leads exposed at the bottom of the semiconductor chip receiving hole in the carrier, and a semiconductor chip in the carrier. A connection step in which each of the outer leads is electrically connected; and a resin sealing body molding step in which a resin sealing body for resin-sealing the semiconductor chip is molded on one main surface of the sheet in the carrier. A method for manufacturing a semiconductor device, comprising: 11. The method according to claim 10, wherein the carrier is a tape carrier. 12. The method according to claim 1, wherein the resin sealing body is molded by a molding die, and a resist layer is previously formed on one main surface of the sheet in a region corresponding to an opening edge of a cavity of the molding die. A method for manufacturing a semiconductor device according to claim 10. 13. The tape carrier, wherein the resin sealing body is molded by a transfer mold, and a transfer molding runner is disposed along an edge of the tape carrier. 13. The method for manufacturing a semiconductor device according to claim 10, 11 or 12. 14. A resin flash preventing pattern is provided on a main surface of the sheet on which the outer leads are fixed.
14. The method for manufacturing a semiconductor device according to claim 10, wherein the semiconductor device is formed together with the outer leads. 15. A protrusion having a diameter larger than that of the ejector pin is protruded at a position where the ejector pin of the cavity for molding the resin sealing body abuts. 15. The method of manufacturing a semiconductor device according to 11, 12, 13, or 14. 16. An index molding projection is provided at a position corresponding to a ground outer lead side of the outer lead group of a cavity for molding the resin sealing body. , 11,12,1
16. The method for manufacturing a semiconductor device according to 3, 14, or 15.