JPH1167879A - Method and apparatus for mounting semiconductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a method and an apparatus, in which the attitude of a die is corrected in order to increase its mounting accuracy, without including the mounting in the a unit process time. SOLUTION: In a method, a die is first taken out from an expanding sheet (Process A), and the posture of the die which is taken out is corrected (Process B). Then, the posture of the die is reversed by 90 deg. (Process C), and the die is conveyed up to a substrate (Process D). After that, the die is attached to the substrate (Process E). At this time, the process B, in which the posture of the die is corrected and the process C in which the posture of the die is reversed by 90 deg., are performance in parallel with the process A, in which the die is taken out from the expanding sheet and to the process D in which the taken out die is conveyed up to the substrate. Thereby, the positional accuracy of the die which is mounted on the substrate is increased by correcting its attitude, and the correction time of the posture of the die and the 90 deg. reversing time of the die are not included in the unit process time in a mounting operation. Thereby, the die can be mounted at high speed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for mounting a semiconductor chip on a semiconductor chip.

[0002]

2. Description of the Related Art As a conventional semiconductor mounting method, there is a method as disclosed in JP-A-6-177435. This conventional method involves mounting a light emitting diode, and is mounted by the following procedure so as to be perpendicular to the substrate 2 as shown in FIG.

That is, the adhesive tape 50 on which the die 1 which is the semiconductor chip of the light emitting diode is mounted is sent by the conveying means 52, and the path of the die 1 which is the semiconductor chip of each light emitting diode is changed at the end of the conveying means 52. The die 1 faces the vacuum collet 51 and the die 1 is
Then, the die 1 is mounted on the substrate by sending it to the substrate.

[0004]

In the above conventional example, a step of aligning and attaching the die 1 to the adhesive surface of the adhesive tape 3 is required, and after taking out the die 1 which is a semiconductor chip, There is a problem that bonding accuracy is low because the posture is not corrected. Further, there is a problem that the bonding tact becomes long unless the time for correcting the attitude of the die 1 is omitted.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor mounting method and a semiconductor mounting method capable of correcting a die attitude for improving mounting accuracy without including a mounting tact time. To offer.

[0006]

In order to achieve the above object, according to the first aspect of the present invention, a step of removing a die from an expanded sheet, a step of correcting the attitude of the extracted die, and inverting the attitude of the die by 90 ° Removing the die from the expanded sheet, comprising the steps of: carrying out the tie, transporting the tie to the substrate, and attaching the die to the substrate, and correcting the die position and inverting the die position by 90 °. And the step of transporting the extracted tie to the substrate.

According to a second aspect of the present invention, in the first aspect of the present invention, the step of taking out the die from the expanded sheet using the take-out means having the posture correcting function and the step of correcting the posture of the taken-out die are made the same. Features.
According to a third aspect of the present invention, in the second aspect of the present invention, the relative angle between the expanded sheet and the substrate is set to 90 °, and the position of the die on the expanded sheet and the position of the die attached to the substrate are the same.

According to a fourth aspect of the present invention, in the second aspect, the relative angle between the expanded sheet and the substrate is 180 °.
The method is characterized in that the orientation of the die is reversed by 90 ° during the transport of the die. According to a fifth aspect of the present invention, in the first aspect of the present invention, the step of taking out the die and the step of attaching the die are performed in parallel, and the die is turned by 90 ° in the step of taking out the die from the expanded sheet.

According to a sixth aspect of the present invention, in the first aspect, the step of taking out the die and the step of attaching the die are performed in parallel, and the die is turned by 90 ° in the step of attaching the die to the substrate. . In the invention of claim 7, in the invention of claim 1, the step of taking out the die and the step of attaching the die are performed in parallel, and the die is turned 90 ° in the process of transporting the die from the step of taking out the die to the step of attaching the die. It is characterized by doing.

According to an eighth aspect of the present invention, in the invention of the seventh aspect, the step of taking out the die, the step of correcting the posture of the taken out die, inverting the posture of the die by 90 °, and the step of attaching the die are each performed. The method is characterized in that the die is cyclically executed, the die is continuously passed through the process, and the die is continuously mounted on the substrate. In the invention of claim 9,
Take-out means for taking out the die from the expanded sheet, posture correcting means for correcting the posture of the taken-out die,
In a semiconductor mounting apparatus having a reversing means for reversing the posture of the die by 90 °, a conveying means for conveying the die, and an attaching means for attaching the die to the substrate, the die is simultaneously held at the position of the extracting means for extracting and holding the die. It is characterized by comprising a posture correcting means for performing posture correction.

According to the tenth aspect of the present invention, the take-out means for taking out the die from the expanded sheet, the posture correcting means for correcting the posture of the taken-out die, and the posture of the die at 90 °
In a semiconductor mounting device having a reversing means for reversing, a conveying means for conveying a die, and an attaching means for attaching the die to a substrate, the semiconductor mounting apparatus includes a part for holding the die and a function for moving the part from the take-out position to the attaching position. Means for removing, attaching, and transporting means by means of the means, and a position holding the die is provided with a posture correcting means for correcting the posture at the same time as holding the die. A function of reversing the attitude of the die by 90 ° during the movement up to

In the eleventh aspect of the present invention, a take-out means for taking out the die from the expanded sheet, a posture correcting means for correcting the posture of the taken-out die, and a posture of the die at 90 °
In a semiconductor mounting device having reversing means for reversing, conveying means for conveying a die, and attaching means for attaching the die to the substrate, the die attaching surface of the expanded sheet and the attaching surface of the substrate have a 90 ° relationship. Means for arranging the expanded sheet and the substrate on the substrate, and having a portion for holding a die, the means being movable in a direction perpendicular to the surface of the expanded sheet and movable in a direction perpendicular to the surface of the substrate. In this case, the take-out means, the attachment means, and the transfer means are also used, and the position holding the die is provided with a posture correction means for correcting the posture while holding the die.

According to the twelfth aspect of the present invention, the take-out means for taking out the die from the expanded sheet, the posture correcting means for correcting the posture of the taken-out die, and the posture of the die at 90 °
In a semiconductor mounting device having a reversing means for reversing, a conveying means for conveying the die, and an attaching means for attaching the die to the substrate, the direction of the mounting surface of the substrate and the direction of the die attaching surface of the expanded sheet are opposite to each other, and While arranging the expanded sheet and the substrate in parallel,
It is rotatable by a rotating shaft having an inclination of 45 ° and is capable of linearly moving in the opposite direction. A portion for holding a die is provided on the peripheral portion, and by a rotation of 180 ° and a linear motion about the rotating shaft. Means for moving the holding part from the take-out position side to the mounting position side to hold the die, and the means to serve as the take-out means, the mounting means, and the conveying means; And a posture correcting means for performing a posture correction at the same time as the holding.

According to a thirteenth aspect of the present invention, in the twelfth aspect of the present invention, a plurality of die holding portions are provided on the peripheral portion of the main body at predetermined intervals in a circumferential direction, and are formed in a multiple series. In the invention of claim 14, take-out means for taking out the die from the expanded sheet, posture correcting means for correcting the posture of the taken-out die, reversing means for reversing the posture of the die by 90 °, and conveying means for conveying the die, A mounting means for attaching the die to the substrate, wherein the attaching means is provided with a mechanism capable of rotating the part holding the die of the attaching means by 90 ° from a state at the time of taking out the die. A posture correcting means for performing posture correction at the same time as holding is provided.

According to a fifteenth aspect of the present invention, in accordance with the fourteenth aspect of the present invention, a plurality of dies holding portions are provided, and the portions can be sequentially moved with respect to the die taking-out position to constitute a multiple type take-out means. It is characterized by. Claim 16
In the invention of the above, take-out means for taking out the die from the expanded sheet, posture correcting means for correcting the posture of the taken-out die, reversing means for reversing the posture of the die by 90 °, conveying means for conveying the die, and substrate for the die Mounting means for attaching the die to the take-out means so that the position of the die taken out by the take-out means is rotatable by 90 ° so as to reverse the posture of the die by 90 °;
An attitude correcting means for receiving the rotated die and correcting the attitude of the die is fixedly arranged, and the mounting means takes out and holds the die held by the attitude correcting means, and moves the die to the mounting position of the substrate. It is characterized in that it can be moved to attach the die to the substrate.

According to a seventeenth aspect, in the sixteenth aspect, the take-out means and the attachment means are of a multiple type in which a plurality of die holding portions are provided. In the invention of claim 18, take-out means for taking out the die from the expanded sheet, posture correcting means for correcting the posture of the taken-out die, inverting means for inverting the posture of the die by 90 °, and conveying means for conveying the die, Mounting means for attaching the die to the substrate, wherein the reversing means is provided with a die holding portion provided with a posture correcting means for receiving the die taken out by the taking out means and simultaneously correcting the posture of the die and holding the die. It is characterized by having a mechanism for rotating the part by 90 ° to reverse the posture of the die by 90 ° and transporting the die to a position where the die is transferred to the mounting means.

According to a nineteenth aspect of the present invention, in the invention of the eighteenth aspect, the take-out means is provided with a plurality of portions for holding the taken-out dies at predetermined intervals on the same circumference, and can move the portions in the circumferential direction. The mounting means is provided with a plurality of parts for receiving and holding the die from the reversing means at predetermined intervals on the same circumference so that the parts can be moved in the circumferential direction. The reversing means comprises a mechanism in which a plurality of the holding portions are provided at predetermined intervals on the same circumference and the holding portions can be moved in the circumferential direction.

According to a twentieth aspect of the present invention, in the invention according to the eighteenth aspect, the reversing means is a mechanism in which a plurality of the holding portions are provided at predetermined intervals on the same circumference so that the holding portions can be moved in the circumferential direction. It is characterized by comprising.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The semiconductor mounting method of the present invention basically includes, as shown in FIG. 1, a step A for taking out a die from an expanded sheet, a step B for correcting the attitude of the taken-out die, and A step C of inverting the orientation by 90 °, a step D of transporting the tie to the substrate, and a step E of attaching the die to the substrate; a step B of correcting the orientation of the die; and a step C of inverting the orientation of the die by 90 °. In parallel with the process A for removing the die from the expanded sheet and the process D for transporting the removed tie to the substrate, thereby improving the positional accuracy of the die mounted on the substrate by posture correction, and at the same time, reducing the tact time in mounting. This realizes high-speed mounting so that the time does not include the tie attitude correction time and the 90 ° inversion time of the die.

Further, as an embodiment of the method of FIG.
As shown in FIG. 2, there is a method in which the step of taking out the die from the expanded sheet and the step of correcting the attitude of the taken out die are the same step A ′ as shown in FIG. In another embodiment, the relative angle between the expanded sheet and the substrate is 90 °, and the positions of the dies on the expanded sheet and the dies attached to the substrate are the same. The step of inverting the position of the die by 90 ° can be the same step.

An apparatus according to an embodiment based on the method of the present invention will be described below. (Embodiment 1) In this embodiment, as shown in FIG. 4, a substrate table (not shown) on which a substrate 2 on which a die 1 is mounted is placed.
And a wafer table (not shown) for fixing a wafer sheet, which will be described later,
A reversing device 5 that has a function of correcting the attitude of the die 1 and a function of reversing the die 1 by 90 ° while transporting the die 1 taken out of the wafer sheet to the substrate table side.
A suction head 3 for taking out the die 1 from the wafer sheet and placing it on the reversing device 5; a suction head 4 for attaching the die 1 to the substrate 1 by picking up the die 1 from the reversing device 5; Each drive device (not shown) for moving 3, 4; a die push-up device (not shown), which will be described later; and control for controlling each of the tables, suction heads 3, 4, reversing device 5, and drive device. Means (not shown).

The substrate table and the wafer table are provided with a biaxial unit constituted by a combination of a linear motion guide mechanism and a ball screw, and an XY linear motion mechanism driven by a stepping motor or a servomotor. The suction heads 3 and 4 are movable in the ZX direction by a two-axis unit constituted by a combination of a linear motion guide mechanism and a ball screw and a ZX linear motion driving device driven by a stepping motor or a servomotor. I have.

Here, the wafer is cut in the orthogonal direction to separate the individual dies 1, and in this state, the expanded sheet 6 on which the wafer is adhered is radially expanded to form the adjacent dies 1.
Are widened, and this state is referred to as the above-mentioned wafer sheet. The wafer table (not shown) for fixing the wafer sheet is adapted to move in the XY directions as described above, and the table surface for fixing the wafer sheet is opened below the die 1. Yes,
A die push-up device (not shown) for driving a die push-up pin (not shown) for piercing the expand sheet 6 from the opening and peeling the die 1 from the adhesive force of the expand sheet 2 is arranged below the wafer table. .

The reversing device 5 has a mounting recess 8 for holding the die 1 on the outer peripheral surface of the main body 7.
Is a function of correcting the attitude of the die 1
Each of the three surfaces comes into contact with and engages with each other, and has three orthogonal inner surfaces, and a hole for vacuum suction is opened at the apex angle of the three inner surfaces. Next, the operation of the apparatus of the present embodiment will be described.

That is, in synchronization with the operation of the die push-up pin, the pick-up suction head 3 having a suction means such as vacuum suction is moved to the position of the die 1 to be picked up. The header is brought into contact with the upper surface of the die 1 to adsorb the die 1, and at the same time the die push-up pin contacts the die 1, the suction head 3 is moved in the direction of taking out the die 1 (Z direction in the figure), and then in the X direction. To position it above the reversing device 5.

Here, the reversing device 5 is a driving device (not shown).
And the position of the mounting recess 8 in which the reference surface on which the lower surface of the die 1 taken out by the rotation of the reversing device 5 comes into contact is upward and horizontal, and The position of the mounting concave portion 8 where the side where the placed die 1 does not contact the reference surface faces upward corresponds to both ends of the rotation range of 90 °, and the reference surface where the lower surface of the die 1 contacts the upward direction. Then, the suction head 3 is lowered toward the mounting recess 8 which has become horizontal, and the sucking die 1 is mounted on the mounting recess 8. Thereafter, the suction head 5 is raised and moved to the wafer table side, and the operation shifts to the operation of taking out the next die 1 in the same manner as described above.

On the other hand, the die 1 placed on the mounting recess 8 is
The orientation is corrected by that the surface in the direction contacts the three reference surfaces of the mounting recess 8, and the reversing device 5
Is rotated by 90 ° to transport the die 1 to the substrate table side. When the mounting recess 8 on which the die 1 is mounted reaches a position rotated by 90 ° due to the rotation of the reversing device 5, the die 1 on the mounting recess 8 is turned 90 ° from the state at the time of removal. ing.

That is, the reversing device 5 includes a step of transporting the die 1, a step of correcting the attitude of the die 1, and a step of rotating the die 1 by 90 °.
And a rotating step. Then, the mounting suction head 4 is moved onto the mounting recess 8 and lowered to bring the header into contact with the side surface of the die 1 on the mounting recess 8 to suck the die 1. After the suction, the suction head 4 is raised. Thereafter, the substrate 2 is moved in the lateral direction (Y direction) to be positioned above the substrate 2, the substrate 2 is moved by the substrate table, and the position where the die 1 is attached and the position of the suction head 4 are made to correspond.
Thereafter, the die 1 is lowered in the direction of the substrate 2, and the die 1 is attached to a predetermined position of the substrate 2. After the attachment, the suction head 4 is moved above a predetermined position of the reversing device 5 to perform the suction operation on the next die 1. FIG. 5 shows a flowchart of each step described above.

In this manner, the two suction heads 3 and 4 are operated in parallel, and the posture of the die 1 is corrected and 90 °
By performing the reversing process in parallel with the transfer from the removal of the die 1 to the die press, the positional accuracy of the die 1 mounted on the substrate is improved, and the tact time in mounting, the posture correction time of the die 1 and the die A high-speed mounting that does not include the 90 ° inversion time of 1 can be realized.

Further, since the function of correcting the attitude of the die 1 is not provided in the suction heads 3, 4, the suction heads 3, 4 can be reduced in size and weight. (Embodiment 2) In Embodiment 1, the reversing device 5 is used. In this embodiment, as shown in FIG.
This embodiment differs from the first embodiment in that a rotary type multiple reversing device 5 ′ in which eight mounting recesses 8 are provided at regular intervals on the outer periphery of the main body 7 is used. The multiple reversing device 5 'has a driving device for rotating the main body 7 in the vertical direction, and has a structure in which the one-axis rotary unit is driven by a stepping motor, a servomotor, or an index cylinder. The mounting recess 8 is provided with three reference planes for correcting the attitude of the die 1 as in the first embodiment. Other configurations are the same as those of the first embodiment.

In this embodiment, the reversing device 5 'is set at 45.degree.
The die 1 taken out by the take-out head 3 is rotated step by step, and the posture of the die 1 is corrected by placing the die 1 on the mounting concave portion 8 and the die 1 is received by the mounting head 4 while being rotated 90 °. You can pass it. Then, the die 1 transferred to the mounting head 4 is mounted on the substrate 2 in the same manner as in the first embodiment.

FIG. 7 shows a flowchart of each step described above. Thus, in this embodiment, both suction heads 3,
4 is operated in parallel, and the position accuracy of the die mounted on the substrate is improved by performing the posture correction of the die 1 and the 90 ° inversion process in parallel with the transfer from the removal of the die 1 to the die press. At the same time, the tact time in mounting includes the attitude correction time of the die 1 and the 9
High-speed mounting that does not include the 0 ° inversion time can be realized.

Since the function of correcting the attitude of the die 1 is not provided in the suction heads 3 and 4, the suction head can be reduced in size and weight. (Embodiment 3) Embodiment 3 is different from Embodiment 2 in that the suction heads 3 and 4 in Embodiment 2 are each changed to a multiple type, and the other configuration is the same as that of Embodiment 2.

The suction heads 3 and 4 of this embodiment are provided with eight headers 11 whose suction ports face downward at equal intervals on the outer peripheral surface of the main body 10 which rotates in the horizontal direction as indicated by arrows in FIG. The function of rotating the main body 10 in the horizontal direction has a structure in which the one-axis rotary unit is driven by a stepping motor, a servomotor, or an index cylinder.

Further, a driving device for directly moving each header 11 in the Z direction (up and down direction) is provided. This device comprises a one-axis unit constituted by a linear motion guide mechanism. Are driven by a driving means including a stepping motor or a servomotor. Thus, in this embodiment,
45 ° in the horizontal direction of the main body 10 of the take-out suction head 3
Each rotation, the vertical movement of the header 11, the movement of the wafer table, and the operation of the die push-up device move the header 1 corresponding to the predetermined die 1 from the expander sheet 6.
When the header 11 that has sucked out the die 1 and sucked the die 1 is positioned above the mounting recess 8 of the rotary reversing device 5 ′, the header 11 is lowered and the die 1 is mounted on the mounting recess 8. To the reversing device 5 '. Then, the die 1 is turned 90 ° and the posture is corrected by the reversing device 5 ′ in the same manner as in the second embodiment, and the die 1 is conveyed to the substrate 2 side. The die 1 is transferred, and the die 1 is attached to a predetermined position on the substrate 2 by vertically moving the header 11 of the mounting suction head 4, rotating the main body 10 every 45 ° in the horizontal direction, and moving the substrate table.

FIG. 9 shows a flowchart of each of the steps described above. As described above, also in this embodiment, the two suction heads 3 and 4 are operated in parallel, and the posture of the die 1 is corrected and
By performing the 0 ° inversion process in parallel with the transfer from the removal of the die 1 to the die press, the positional accuracy of the die 1 mounted on the substrate 2 is improved, and the posture correction of the die 1 is performed in the tact time in mounting. 90 of time and die 1
° High-speed mounting without inversion time can be realized.

Since the function of correcting the attitude of the die 1 is not provided in the suction heads 3 and 4, the size and weight of the suction head can be reduced. Fourth Embodiment In the first to third embodiments, the posture correction is performed by the mechanism for correcting the posture of the die 1 after the die 1 is taken out. However, in the present embodiment, the die 1 is taken out. At the same time, the posture is corrected.

That is, in this embodiment, as shown in FIG. 10, a header 21 is provided at the tip of an arm body 20 which rotates vertically within a range of 90 °, and a suction head 22 which moves as a whole in the vertical direction (Z direction). Is provided between the wafer table and the substrate table so as to be used for both taking out and mounting, and to correct the attitude of the die 1 when the die 1 is attracted to the header 21 as an attitude correction mechanism. Are provided.

The driving device for the linear motion of the suction head 22 in the vertical direction is constituted by a combination of a one-axis unit composed of a combination of a linear motion guide mechanism and a ball screw, and a driving source composed of a stepping motor or a servomotor. The vertical rotation (oscillation) function is constituted by a combination of a one-axis rotary unit and a driving source including a stepping motor, a servomotor or a cylinder.

The die push-up device 25 located below the opening of the wafer table has a linear motion guide mechanism as a linear motion function for moving a die push-up pin (not shown) in the vertical direction (Z direction). It has a one-axis unit constituted by a combination of a ball screw or a cam, and a drive source comprising a stepping motor or a servomotor.

The posture correcting recess 2 provided in the header 21
As shown in FIGS. 11 (a) and 11 (b), reference numeral 3 has three inner surfaces serving as references for positioning the die 1, and a die suction hole 24 is provided at the apex angle of the three surfaces. Are defined as a <A, b <B, c <C, and the lengths A to C of the corresponding sides of the die 1 are defined as a <A, b <B, and c <C. Die 1
The three outer surfaces are brought into contact with the three reference surfaces to perform positioning and correct the posture.

The configurations of the substrate table and the wafer table are the same as in the first embodiment. In this embodiment, the arm 20 of the suction head 22 is rotated to position the header 21 on the wafer table, and the wafer table is moved so that the die 1 to be picked up faces the header 21.

In this state, the posture correcting recess 2 of the header 21 is
Then, the suction head 22 is lowered so that the die 1 is sucked into the die 3, and the corresponding die 1 is sucked into the attitude correcting concave portion 23 of the header 21 in accordance with the operation of the die lifting device as in the first embodiment. Let it. Due to this suction, the posture of the die 1 is corrected by the three surfaces serving as the reference of the posture correcting concave portion 23.

Then, the suction head 22 is raised, and the arm 20 is rotated by 90 ° to move the header 21 to the substrate table side. By this 90 ° rotation, the die 1 is turned 90 °. Then, the substrate table is moved so that the mounting position of the substrate 2 is opposed to the die 1 of the header 21. Thereafter, the suction head 22 is lowered to lower the header 21.
Is attached to the substrate 2. After this mounting, the suction head 22 is raised and the arm 20
Is inverted by 90 °, the header 21 is returned to the position where the die 1 is taken out, and the operation shifts to the operation of taking out the next die 1.

As described above, in this embodiment, the suction head 22
The position of the die 1 can be corrected at the same time when the die 1 is taken out, and the die 1 can be conveyed at the same time as the die 1 is turned 90 ° by the 90 ° rotation of the arm 20 of the suction head 22. In addition, it is possible to realize high-speed mounting that does not include the attitude correction time of the die 1 and the 90 ° inversion time of the die 1 in the tact time in mounting.

Further, since the suction head 22 is used for both take-out and mounting, and also serves as a mechanism for correcting the posture and inverting 90 °, the apparatus can be simplified and downsized. (Fifth Embodiment) In the fourth embodiment, the suction head 22 is
By rotating the arm body 20 provided with the
In the present embodiment, the configuration shown in FIG.
And both tables are arranged so that the table surface of the wafer table for fixing the wafer sheet with respect to the table surface of the substrate table is 90 °,
The suction head 22 for both taking out and mounting is movable in the vertical direction (Z direction) and in the X direction. The header 21 provided at the tip of the arm 20 has the same posture as in the fourth embodiment. A correction recess 23 is provided.

The wafer table moves in the YZ directions. The wafer table is driven by a two-axis unit constituted by a combination of a linear motion guide mechanism and a ball screw as a YZ linear driving device, and a stepping motor or a servo motor. Means. The board table moves in the XY directions, and is configured by a combination of a linear motion guide mechanism and a ball screw as an XY linear motion driving device.
It comprises a shaft unit and a driving means comprising a stepping motor or a servomotor.

The suction head 22 has a two-axis unit constituted by a combination of a linear motion guide mechanism and a ball screw as an XZ linear motion mechanism, and a stepping motor or a servo motor. The die push-up device 25 has the same configuration as that of the fourth embodiment. In this embodiment, the suction head 22 is moved in the X direction so that the header 21 is positioned so as to face the table surface of the wafer table. Move the table.

In this state, the die 1 is in the position correcting recess 2.
Then, the suction head 22 is moved so as to be sucked by the suction die 3, and the corresponding die 1 is sucked into the attitude correction concave portion 23 of the header 21 in accordance with the operation of the die push-up device as in the first embodiment. Due to this suction, the posture of the die 1 is corrected by the three surfaces serving as the reference of the posture correcting concave portion 23. Then, the suction head 22 is raised and moved toward the substrate table side, so that the header 21 faces the substrate 2. Then, the substrate table is moved so that the mounting position of the substrate 2 is opposed to the die 1 of the header 21. Thereafter, the suction head 22 is moved to attach the die 1 sucked to the header 21 to the substrate 2. After the attachment, the suction head 22 is moved in the direction of the wafer table and lowered, and the die 1 is moved.
The header 21 is returned to the position for taking out the next die 1
Move to the operation of extracting

As described above, the present embodiment is based on the method corresponding to the flowchart shown in FIG. 3, and the attitude of the die 1 can be corrected simultaneously with the removal of the die 1 by the suction head 22, and the wafer table can be corrected. By making the table surface and the table surface of the substrate table 90 °, a mechanism for inverting the die 1 by 90 ° becomes unnecessary, and therefore, the apparatus can be simplified and downsized. Further, since the distance between the two tables can be reduced, the transport distance of the die 1 due to the movement of the suction head 22 can be reduced.

(Embodiment 6) In Embodiment 5, the table surface of the substrate table and the table surface of the wafer table are set to 90 °. In this embodiment, as shown in FIG. A suction head 22 is provided between the tables so as to be rotatable by a rotation shaft 22a inclined at 45 ° with respect to both table surfaces and movable in a vertical direction (Z direction).

The suction head 22 has the arms 20 protruding, and a header 21 is provided at an end of each arm 20. The header 21 has a take-out position, that is, the header 21 of the arm 20.
When the suction head 22 is located at a position facing the table surface of the wafer table, an attitude correction concave portion 23 is provided so as to have an upward opening. The posture correcting recess 23 has a downward opening.

The posture correcting concave portion 23 has three inner surfaces serving as reference surfaces as in the third embodiment. The linear drive device of each table has an XY linear motion function and has the same configuration as that of the first embodiment. Die thruster 2
The linear motion mechanism 5 has the same configuration as that of the fourth embodiment except that the direction in which the push-up pin 25a pushes up the die is downward.

45 ° inclined rotary shaft 2 of suction head 22
The rotation mechanism 2a is composed of a one-axis rotary unit and a driving means composed of a stepping motor or a servomotor, and a linearly-moving driving device in the vertical direction (Z direction) is composed of a combination of a linear motion guide mechanism and a ball screw. And a driving unit including a stepping motor or a servomotor.

In this embodiment, the suction head 22 is raised so that the header 21 of the upper arm 20 faces the table surface of the wafer table, and the die 1 to be picked up faces the header 21. Is moved to the wafer table. In this state, the suction head 22 is moved so that the die 1 is accommodated in the concave portion 23 for posture correction, and the corresponding die 1 is corrected for the posture of the header 21 in accordance with the operation of the die lifting device as in the first embodiment. Recess 2
The die 1 is adsorbed in 3. Due to this suction, the posture of the die 1 is corrected by the three surfaces serving as the reference of the posture correcting concave portion 23.

Then, the suction head 22 is rotated by 180 ° so that the header 21 holding the die 1 faces the substrate table, and the header 21 is positioned above the substrate 2. Then, the substrate table is moved so that the mounting position of the substrate 2 faces the die 1 of the header 21, and the suction head 22
To attach the die 1 adsorbed to the header 21 to the substrate 2. After the attachment, the suction head 22 is raised, and the suction head 22 is then shifted to the operation of taking out the die 1 in the same manner as described above.

As described above, in this embodiment, the attitude of the die 1 can be corrected simultaneously with the removal of the die 1 and the suction head 2
The die 1 can be turned 90 ° and mounted on the substrate 2 only by the rotation and the vertical movement of the die 2, so that the device can be simplified and downsized. (Embodiment 7) The suction head 22 of the above-described embodiment 6 has the header 2
1, the suction head 22 of the present embodiment has a multiple structure in which four arms 20 are provided at 90 ° intervals. The die 1 taken out by the header 21 is the suction head 2
By rotating and lowering the arm 2 by the pitch of the projecting position of the arm body 20, the die 1 adsorbed by the header 21 on the substrate 1 side is mounted on the substrate 2, and after this mounting, the suction head 22 is raised. The die 1 is taken out by the header 21 facing the wafer table. After the take-out, the suction head 22 is rotated and lowered in the same manner as described above. Is attached to the substrate 2.

As described above, in this embodiment, the use of the multiple suction heads 22 makes it possible to shorten the time for taking out and attaching the die 1 compared to the sixth embodiment. (Embodiment 8) This embodiment is provided with a take-out suction head 3 and a mounting head 4 similarly to Embodiment 1, but instead of providing an independent reversing device, FIG.
Arm 30 movable vertically (Z direction) as shown in FIG.
The main body 31 rotatably provided at the end of the main body 31 so as to be rotatable about the rotation axis 3a within a range of 90 ° in the vertical direction, and the header 21 having the above-described posture correcting concave portion 23 at the front end of the main body 31. It is characterized in that the attitude of the die 1 is corrected by the attitude correcting recess 23, and the die 1 is turned by 90 ° by rotating the body 31 by 90 °.

Here, the drive mechanism of the arm 30 provided with the take-out suction head 3 includes a one-axis unit constituted by a combination of a linear motion guide mechanism in the vertical direction (Z direction) and a ball screw, a stepping motor or a servomotor. Drive means. The drive mechanism of the main body 31 is constituted by a one-axis rotary unit that rotates in the vertical direction, and a drive unit using a stepping motor, a servomotor, or a cylinder.

The driving mechanism of the substrate table on which the substrate 2 is placed and the driving mechanism of the wafer table for fixing the wafer sheet are the same as those in the first embodiment. The driving mechanism of the die pushing-up device 25 has the same configuration as that of the die pushing-up device 25 shown in FIG. Thus, take-out suction head 3
The main body 31 is rotated so that the header 21 faces downward, and the arm 30 is lowered in synchronization with the operation of the die lifting pin of the die lifting device 25. By the movement of the wafer table, the die 1 to be taken out, which is opposed to the header 21, is sucked into the attitude correcting concave portion 23 of the header 21 by the movement of the wafer table until the die push-up pin contacts the die 1. Arm 30 in the direction of taking out the die 1 at the same time as the
Is moved and the main body 31 is rotated by 90 ° so that the header 21 at the tip is oriented in the Y direction. Here, the side surface of the die 1 that is not in contact with the inner surface of the attitude correcting concave portion 23 faces upward. That is, the attitude of the die 1 is corrected by the attitude correcting recess 23, and the die 1 is turned 90 ° by rotating the body 31 by 90 °.

In this state, the mounting suction head 4 is moved to the wafer table side, and the tip is further lowered to a position where it comes into contact with the upward side surface of the die 1 which is sucked by the header 21 of the suction header 3. Adsorb to the tip. After the suction, the suction head 4 is raised and moved above the substrate 2 on the substrate table. And substrate 2
Is moved by the substrate table so that the position where the die 1 is attached and the position of the die 1 that is being sucked by the suction head 4 correspond to each other. Attach die 1 to.

On the other hand, the arm 30 is lowered, and the main body 31 is rotated by 90 ° so that the header 21 of the take-out suction head 3 faces downward, and the above-described operation of removing the die 1 is performed. As described above, in the present embodiment, the posture correction and the 90 ° reversal of the die 1 can be performed only by the rotation and the vertical movement of the take-out suction head 3, so that the reversing device or the like is not required, and the device is simplified. And downsizing can be achieved.

(Embodiment 9) In this embodiment, as shown in FIG. 16, in the same manner as in Embodiment 3, both the take-out suction head 3 and the mounting suction head 4 have eight headers 11 at 45 ° from the center of rotation. Although it is composed of multiple types provided at intervals of
Without the reversing device, each of the headers 11 of the take-out suction head 3 can be moved up and down and rotated by 90 °, and the header 11 is provided with a concave portion 23 for posture correction, and the posture of the die 1 in the header 11 Correction and 90 ° inversion are possible.

Here, the drive device for rotating each header 11 of the take-out suction head 3 by 90 ° comprises a one-axis rotary unit which rotates in the vertical direction, and a drive means using a stepping motor, a servomotor or a cylinder. The configuration of the mounting suction head 4 is the same as that of the mounting suction head 4 of the third embodiment, and the vertical movement (Z direction) of the header 11 of the removal suction head 3 and the horizontal rotation of the main body 10 are also described. The structure of the drive mechanism of Example 3
It has the same configuration as the take-out suction head 3. The drive mechanism of the substrate table on which the substrate 2 is placed and the drive mechanism of the wafer table for fixing the wafer sheet are the same as those in the first embodiment. Further, the driving mechanism of the die push-up device 25 has the same configuration as that of the die push-up device 25 shown in FIG.

In this embodiment, the vertical direction of the header 11 of the take-out suction head 3 and the horizontal direction
With the rotation of 5 °, the movement of the wafer table in the X and Y directions, and the operation of the die push-up device 25, a predetermined die 1 was sucked out of the expander sheet 6 by the corresponding header 11, and the die 1 was sucked. At a position where the header 11 is rotated 180 ° from the take-out position, the header 1
1 is rotated 90 ° in the vertical direction so that its tip is oriented in the X direction. Here, the side surface of the die 1 that is not in contact with the inner surface of the attitude correcting concave portion 23 faces upward. That is, the attitude of the die 1 is corrected by the attitude correcting recess 23, and the
The 90 ° rotation of 1 results in a 90 ° inversion.

On the other hand, the mounting suction head 4 is rotated by 90 °, and the header 11 is lowered so that the tip of the header 11 corresponding to the upward side surface of the die 1 suctioned by the header 11 of the removal suction head 3 comes into contact. Then, the tie 1 is sucked and received, and after this reception, a predetermined movement on the substrate 2 is performed by the vertical movement of the header 11 and the horizontal rotation of the main body 10 by 45 ° and the movement of the substrate table in the XY directions. Attach die 1 in position.

As described above, in the present embodiment, the posture correction of the die 1 is performed by 90 ° by the header 11 of the suction head 3 for taking out.
Since the reversal can be performed, a reversing device or the like is not required, and the device can be simplified and downsized. In addition, since both the take-out suction head 3 and the mounting head 4 are multiple heads, the mounting tact can be improved. (Embodiment 10) In Embodiment 8, the attitude correction concave portion 23 is provided in the header 21 of the take-out suction head 3, and the attitude of the die 1 is corrected at the same time when the die 1 is sucked to the header 21. The present embodiment is characterized in that, as shown in FIG. 17, a posture correcting device 40 provided with a posture correcting concave portion 23 separately from the header 21 'of the suction head 3 for taking out is fixedly arranged.

The take-out suction head 3 is different from the take-out suction head 3 of the eighth embodiment in that the attitude correcting recess 23 is not provided in the header 21 ', but the other structure and the driving mechanism are the same. . The configuration of the mounting suction head 4 and its driving mechanism, the configuration of the substrate table and its driving mechanism, the configuration of the wafer table and its driving mechanism are the same as the configuration of the mounting suction head 4 and the substrate table of the eighth embodiment. It has the same configuration as the drive mechanism and the wafer table. Although the die push-up device is not shown here, it goes without saying that it is provided below the wafer table as in the case of the eighth embodiment.

In this embodiment, the die 1 taken out by the take-out suction head 3 is turned 90 ° by rotating the main body 31 by 90 °, and the vertical movement of the arm 30 and the 90 ° By rotation, the die 1 is suction-mounted in the posture correcting concave portion 23 of the posture correcting device 40, and the posture of the die 40 is corrected. The attitude correcting concave portion 23 is opened upward, and the side surface of the die 1 is exposed upward from this opening.

Then, the die 1 is attached to the suction head 4 for mounting.
Is transferred to the mounting suction head 4 and mounted on the substrate 2 by the movement in the X direction and the movement in the vertical direction (Z direction). The operation of the suction head 4 after receiving is the same as that of the eighth embodiment, and the description is omitted.
In this embodiment, since the fixed attitude correction device 40 is used, the attitude of the die 1 can be corrected with high accuracy, and as a result, high mounting accuracy without variation due to processing accuracy can be obtained.

(Embodiment 11) In this embodiment, a posture correction device 40 fixed in the same manner as in Embodiment 10 is provided, but as shown in FIG. And a rotation axis is provided at the center thereof to enable 360 ° rotation in the vertical direction, and a header 21 ′ is provided at the tip of each piece, so that the vertical movement of the arm 30 and the vertical movement of the main body 31 are provided. The die 1 can be taken out and stored and placed in the posture correction device 40 by rotation at every 90 °.

Further, the mounting suction head 4 is a multiple type having the same configuration as that of the ninth embodiment. The driving mechanism of the arm 30 is the same as in the eighth and tenth embodiments, and the driving mechanism of the main body 31 is 3
Although there is a difference between rotating by 60 ° and rotating within a range of 90 °, it is the same as in the eighth and tenth embodiments. The driving mechanism of the mounting suction head 4 is the same as the mounting suction head 4 of the third and ninth embodiments.

In this embodiment, since the fixed posture correcting device 40 is used, the posture of the die 1 can be corrected with high accuracy, and as a result, high mounting accuracy without variation due to processing accuracy can be obtained. In addition, since multiple suction heads 3 and 4 are used for taking out the die 1 and attaching the die 2, respectively, the mounting tact can be improved.

By the way, in addition to the above-described embodiment, an apparatus based on a method shown in a flowchart as shown in FIG. 19 can be considered as an embodiment of the apparatus of the present invention. In the method shown in this flowchart, a 90 ° reversing mechanism is provided in the take-out suction head 3, and a transfer means which reciprocates between the take-out suction head 3 and the mounting suction head 4 is provided on the way. By providing attitude correction means in
This is a method of simultaneously performing the conveyance and the posture correction.

[0075]

According to the first aspect of the present invention, there is provided a step of taking out a die from an expanded sheet, correcting the posture of the taken-out die, inverting the posture of the die by 90 °, and transporting the tie to the substrate. And the step of attaching the die to the substrate, the step of correcting the position of the die and the step of inverting the position of the die by 90 °, the step of taking out the die from the expanded sheet and the step of transporting the taken out tie to the substrate In addition, the position accuracy of the die mounted on the substrate can be improved, and high-speed mounting that does not include the die posture correction time and the 90 ° inversion time of the die can be realized.

According to a second aspect of the present invention, in the first aspect of the present invention, the step of taking out the die from the expanded sheet using the take-out means having the posture correcting function and the step of correcting the posture of the taken-out die are made the same. The posture of the die can be corrected in the step of taking out the die, and the same effect as the first aspect of the invention can be obtained. The invention of claim 3 is the invention of claim 2
In the invention of the above, since the relative angle between the expanded sheet and the substrate was 90 ° and the position of the die on the expanded sheet and the position of the die attached to the substrate were the same, the die was 9
Since there is no need for a mechanism for inverting by 0 °, there is an effect that the apparatus can be simplified, the cost can be reduced, and the size can be reduced.

According to a fourth aspect of the present invention, in the second aspect of the present invention, the relative angle between the expanded sheet and the substrate is set to 180 ° and the posture of the die is reversed by 90 ° during the transport of the die.
Since there is no need for a mechanism for inverting the die by 90 °, there is an effect that the apparatus can be simplified, the cost can be reduced, and the size can be reduced. According to a fifth aspect of the present invention, in the first aspect, the step of taking out the die and the step of attaching the die are performed in parallel, and the die is turned by 90 ° in the step of taking out the die from the expanded sheet. In addition to the effect of the above, the means for taking out the die can also be used as the means for inverting the die by 90 °, so that it is not necessary to provide a separate inversion means, and the apparatus can be downsized. This has the effect of speeding up the transport and reducing the distance between the take-out step and the step of attaching the die.

According to a sixth aspect of the present invention, in the first aspect of the present invention, the step of taking out the die and the step of attaching the die are performed in parallel, and the die is turned by 90 ° in the step of attaching the die to the substrate. In addition to the effect of the invention, the means for attaching the die can also be used as a means for inverting the die by 90 °, so that it is not necessary to provide a separate inversion means, and the apparatus can be downsized. This has the effect of speeding up the transport and reducing the distance between the take-out step and the step of attaching the die.

According to a seventh aspect of the present invention, in the first aspect of the present invention, the step of taking out the die and the step of attaching the die are performed in parallel, and the die is transported from the step of taking out the die to the step of attaching the die. Since it is turned by 90 °, in addition to the effect of the invention of claim 1, it is possible to use the means for conveyance as a means for turning the die by 90 °, so that it is not necessary to separately provide an inverting means, and the apparatus can be used. This makes it possible to reduce the size of the dies, to speed up the transfer of the dies, and to reduce the distance between the take-out step and the step of attaching the dies.

According to an eighth aspect of the present invention, in the invention of the seventh aspect, the step of taking out the die, the step of correcting the position of the taken out die, inverting the position of the die by 90 °, and the step of attaching the die are each performed. In the above, since the die is continuously mounted on the substrate by being cyclically executed and passing through the die without interruption, in addition to the effect of the invention of claim 7, there is no step having no die, and This has the effect of shortening the transport time and reducing the mounting tact time.

According to a ninth aspect of the present invention, there is provided a take-out means for taking out a die from an expanded sheet, a posture correcting means for correcting the posture of the taken-out die, a reversing means for reversing the posture of the die by 90 °, and a conveyance for conveying the die. Means and a mounting means for attaching the die to the substrate, the position of the take-out means for taking out and holding the die is provided with a posture correction means for performing posture correction simultaneously with holding the die. It is not necessary to provide them independently, reducing the cost of the device and miniaturizing the device.
In addition, since the posture can be corrected at the same time as holding the die, there is an effect that the mounting tact is improved.

According to a tenth aspect of the present invention, there is provided a take-out means for taking out a die from an expanded sheet, a posture correcting means for correcting the posture of the taken-out die, a reversal means for reversing the posture of the die by 90 °, and a conveyance for conveying the die. Means for mounting a die on a substrate, the mounting means having a function of moving the part from a take-out position to a mounting position. Means, mounting means, and transfer means, and a position holding die is provided with a posture correcting means for performing posture correction simultaneously with holding the die, and the posture of the die is inverted by 90 ° when moving from the take-out position to the mounting position. The die has a function to rotate the die, and the linear movement of the means with the part holding the die. Can do attitude correction, simplifying the device, downsizing can be achieved, there is an effect that mounting tact can be improved.

According to the eleventh aspect of the present invention, there is provided a take-out means for taking out a die from an expanded sheet, a posture correcting means for correcting the posture of the taken-out die, a reversing means for reversing the posture of the die by 90 °, and a conveyance for conveying the die. Means, in a semiconductor mounting device having an attaching means for attaching the die to the substrate, while arranging the expanded sheet and the substrate such that the die attaching surface of the expanded sheet and the mounting surface of the substrate have a 90 ° relationship, It has a means for holding a die and is capable of moving in a direction perpendicular to the surface of the expanded sheet and moving in a direction perpendicular to the surface of the substrate. A position correcting means for performing position correction at the same time as holding the die is provided in a portion holding the die, so that the means for inverting the die is used. It is unnecessary, and the distance between the expanded sheet and the substrate can be reduced, so that the transport distance of the die can be shortened, so that the device can be simplified and downsized, and the mounting tact time is improved. There is an effect of doing.

According to a twelfth aspect of the present invention, there is provided a take-out means for taking out a die from an expanded sheet, a posture correcting means for correcting the posture of the taken-out die, a reversing means for reversing the posture of the die by 90 °, and a conveyance for conveying the die. Means, and an attaching means for attaching the die to the substrate, wherein the expanded sheet and the substrate are arranged such that the direction of the mounting surface of the substrate and the direction of the die attaching surface of the expanded sheet are opposite and parallel to each other. Along with 4
It is rotatable by a rotating shaft having an inclination of 5 °, and is capable of linearly moving in the above-described opposite direction. Means for moving the holding part from the take-out position side to the mounting position side to hold the die, and the means to serve as the take-out means, the mounting means, and the conveying means; The posture correction means that performs the posture correction at the same time as the holding of the die is provided.
The die can be turned 90 °, the posture of the die can be corrected, and the die can be attached to the substrate. Therefore, one unit can also serve as the take-out unit, the posture correction unit, the reversing unit, the mounting unit, and the transfer unit. In addition, the size and size can be reduced, and the mounting tact time can be improved.

According to a thirteenth aspect of the present invention, in the invention of the twelfth aspect, since a plurality of portions for holding the die are provided in the peripheral portion of the main body at a predetermined interval in the circumferential direction and are formed in a multiple series, it is possible to take out the die from the expanded sheet. This has the effect of reducing the time required for attachment to the substrate, and as a result, the tact time for mounting is further improved.
The invention of claim 14 is a take-out means for taking out the die from the expanded sheet, a posture correcting means for correcting the posture of the taken-out die, a reversing means for reversing the posture of the die by 90 °, and a carrying means for carrying the die, A mounting device for attaching the die to the substrate,
A mechanism that allows the part holding the die of the attaching means to be able to rotate 90 ° from the state at the time of taking out the die is provided in the attaching means, and the part is provided with a posture correcting means for performing posture correction simultaneously with holding the die. The orientation correction can be performed simultaneously with the holding of the die in the mounting means, and the die can be inverted by rotating the part holding the die by 90 °. There is no need to provide independent attitude correcting means and inverting means. In addition, there is an effect that downsizing can be achieved and mounting tact time is improved.

According to a fifteenth aspect of the present invention, in the invention of the fourteenth aspect, a plurality of parts for holding the die are provided, and the multiple parts are configured to be sequentially movable with respect to the die takeout position. In addition to the effects of the fourteenth aspect, there is an effect that the mounting tact is further improved. The invention of claim 16 is a take-out means for taking out the die from the expanded sheet, a posture correcting means for correcting the posture of the taken-out die, a reversing means for reversing the posture of the die by 90 °, and a conveying means for conveying the die, In a semiconductor mounting apparatus having an attaching means for attaching a die to a substrate, a part for holding the die is provided rotatable by 90 ° so that the posture of the taken-out die is reversed by 90 ° in the taking-out means. The position correcting means for receiving the die and correcting the position of the die is fixedly arranged, the mounting means takes out and holds the die held by the position correcting means, moves the die to the mounting position of the substrate, and Can be mounted on the substrate, and by fixing the posture correction means, accurate die posture correction can be performed, and therefore mounting accuracy can be obtained and processing accuracy can be obtained. No variation due, obtain high mounting accuracy, and since having a mechanism for 90 ° inverting the die to the take-out unit, there is an effect that mounting tact can be improved.

According to a seventeenth aspect of the present invention, in the sixteenth aspect of the present invention, the take-out means and the attaching means are of a multiple type in which a plurality of holding portions for the die are provided. There is an effect that the tact time is improved. The invention according to claim 18 is a take-out means for taking out the die from the expanded sheet, a posture correcting means for correcting the posture of the taken-out die, a reversal means for reversing the posture of the die by 90 °, and a carrying means for carrying the die. Mounting means for attaching the die to the substrate, wherein the reversing means is provided with a die holding portion provided with a posture correcting means for receiving the die taken out by the taking out means and simultaneously correcting the posture of the die and holding the die. 90 °
A mechanism for rotating the die to reverse the position of the die by 90 ° and transporting the die to a position where the die is transferred to the mounting means is provided. Due to the existence, the take-out means and the attachment means can be reduced in size and weight, and the posture correction means does not cause variation due to processing accuracy.
There is an effect that mounting accuracy is obtained and mounting tact is improved.

According to a nineteenth aspect, in the eighteenth aspect, the take-out means is provided with a plurality of portions for holding the taken-out dies at predetermined intervals on the same circumference and can move the portions in the circumferential direction. The mounting means is provided with a plurality of parts for receiving and holding the die from the reversing means at predetermined intervals on the same circumference so that the parts can be moved in the circumferential direction. 19. The invention according to claim 18, comprising a series of mounting means, wherein said reversing means is constituted by a mechanism in which a plurality of said holding portions are provided at a predetermined interval on the same circumference so that said holding portions can be moved in the circumferential direction. In addition to the effect described above, there is an effect that the mounting tact is further improved.

A twentieth aspect of the present invention is the mechanism according to the eighteenth aspect, wherein the reversing means is provided with a plurality of the holding portions at predetermined intervals on the same circumference so that the holding portions can be moved in the circumferential direction. With the configuration, in addition to the effect of the eighteenth aspect, in addition to the eighteenth aspect, there is an effect that the presence or absence of the die can be confirmed by the state of the holding portion of the reversing means.

[Brief description of the drawings]

FIG. 1 is a flowchart of an embodiment of the method of the present invention.

FIG. 2 is a flowchart of another embodiment of the method of the present invention.

FIG. 3 is a flowchart of another embodiment of the method of the present invention.

FIG. 4 is a schematic configuration diagram of Embodiment 1 of the present invention.

FIG. 5 is a flowchart showing the operation of the above.

FIG. 6 is a schematic configuration diagram of Embodiment 2 of the present invention.

FIG. 7 is a flowchart showing the operation of the above.

FIG. 8 is a schematic configuration diagram of Embodiment 3 of the device of the present invention.

FIG. 9 is a flowchart showing the operation of the above.

FIG. 10 is a schematic configuration diagram of Embodiment 4 of the device of the present invention.

FIGS. 11A and 11B are perspective views of a header used in the above.

FIG. 12 is a schematic configuration diagram of Embodiment 5 of the present invention.

FIG. 13 is a schematic configuration diagram of Embodiment 6 of the present invention.

FIG. 14 is a schematic configuration diagram of Embodiment 7 of the present invention.

FIG. 15 is a schematic configuration diagram of Embodiment 8 of the present invention.

FIG. 16 is a schematic structural diagram of Embodiment 9 of the present invention;

FIG. 17 is a schematic configuration diagram of a tenth embodiment of the device of the present invention.

FIG. 18 is a schematic configuration diagram of Embodiment 11 of the present invention.

FIG. 19 is a flowchart illustrating the operation of another method and apparatus embodiment of the present invention.

FIG. 20 is an explanatory diagram of a conventional example.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Mizuto Ida 1048 Kazuma Kadoma, Kadoma City, Osaka Inside Matsushita Electric Works, Ltd.

Claims (20)

[Claims] 1. A step of removing a die from an expanded sheet, a step of correcting the position of the extracted die, a step of inverting the position of the die by 90 °, a step of transporting the tie to the substrate, and attaching the die to the substrate. A step of correcting the position of the die and a step of inverting the position of the die by 90 ° in parallel with the step of removing the die from the expanded sheet and the step of transporting the removed tie to the substrate. A semiconductor mounting method characterized by the above-mentioned. 2. The semiconductor mounting method according to claim 1, wherein the step of taking out the die from the expanded sheet using the take-out means having a posture correcting function and the step of correcting the posture of the taken-out die are made the same. 3. The relative angle between the expanded sheet and the substrate is 9
3. The semiconductor mounting method according to claim 2, wherein the position of the die on the expanded sheet and the position of the die attached to the substrate are set to 0 °. 4. The relative angle between the expanded sheet and the substrate is 1
3. The semiconductor mounting method according to claim 2, wherein the orientation of the die is reversed by 90 [deg.] During the transport of the die as 80 [deg.]. 5. The semiconductor mounting method according to claim 1, wherein the step of taking out the die and the step of attaching the die are executed in parallel, and the step of taking out the die from the expanded sheet inverts the die by 90 °. 6. The semiconductor mounting method according to claim 1, wherein the step of taking out the die and the step of attaching the die are performed in parallel, and the step of attaching the die to the substrate is inverted by 90 °. 7. The method according to claim 1, wherein the step of taking out the die and the step of attaching the die are performed in parallel, and the die is turned by 90 ° in the process of transporting the die from the step of taking out the die to the step of attaching the die. The semiconductor mounting method described in the above. 8. The process of taking out the die, correcting the posture of the taken-out die and inverting the posture of the die by 90 °, and mounting the die in a cyclic manner. 8. The semiconductor mounting method according to claim 7, wherein the die is continuously mounted on the substrate by passing through the substrate. 9. A take-out means for taking out a die from an expanded sheet, a posture correcting means for correcting the posture of the taken-out die, a reversing means for reversing the posture of the die by 90 °, a conveying means for conveying the die, What is claimed is: 1. A semiconductor mounting apparatus comprising: mounting means for attaching to a substrate; and a posture correcting means for performing posture correction simultaneously with holding the die at a position of the taking out means for taking out and holding the die. 10. A take-out means for taking out a die from an expanded sheet, a posture correcting means for correcting the posture of the taken-out die, a reversing means for reversing the posture of the die by 90 °,
In a semiconductor mounting apparatus having a transporting unit for transporting a die and an attaching unit for attaching the die to a substrate, the semiconductor mounting device includes a unit for holding the die, and a unit having a function of moving the site from a take-out position to an attaching position. The means also serves as a take-out means, a mounting means, and a transfer means, and a portion for holding the die is provided with a posture correcting means for performing a posture correction simultaneously with holding the die, and the position of the die when moving from the take-out position to the mounting position. Posture 9
A semiconductor mounting device having a function of inverting 0 °. 11. A take-out means for taking out a die from an expanded sheet, a posture correcting means for correcting the posture of the taken-out die, a reversing means for reversing the posture of the die by 90 °,
In a semiconductor mounting device having a conveying means for conveying a die and an attaching means for attaching the die to the substrate, the expanded sheet and the substrate are arranged such that the die attaching surface of the expanded sheet and the mounting surface of the substrate are orthogonal to each other. A means for holding a die and having means movable in a direction perpendicular to the surface of the expanded sheet and movable in a direction perpendicular to the surface of the substrate. A semiconductor mounting device, wherein a portion for holding the die is provided with a posture correcting means for correcting the posture while holding the die. 12. A take-out means for taking out the die from the expanded sheet, a posture correcting means for correcting the posture of the taken-out die, a reversing means for reversing the posture of the die by 90 °,
In a semiconductor mounting device having a conveying means for conveying a die, and an attaching means for attaching the die to the substrate, the expanded sheet is arranged such that the direction of the mounting surface of the substrate and the direction of the die attaching surface of the expanded sheet are opposite and parallel to each other. And a substrate, and can be rotated by a rotation shaft having a 45 ° inclination, and can move linearly in the above-mentioned opposite direction. It has means for moving the part holding the die from the take-out position side to the mounting position side by 180 ° rotation and linear movement, and this means makes the take-out means, the mounting means, and the transfer means also function, and holds the die A semiconductor mounting apparatus characterized in that a posture correcting means for performing a posture correction at the same time as holding the die is provided at a portion where the die is held. 13. The semiconductor mounting device according to claim 12, wherein a plurality of die holding portions are provided on the peripheral portion of said main body at predetermined intervals in a circumferential direction, and are formed in a multiple series. 14. A take-out means for taking out the die from the expanded sheet, a posture correcting means for correcting the posture of the taken-out die, a reversing means for reversing the posture of the die by 90 °,
In a semiconductor mounting device having a transporting unit for transporting a die and an attaching unit for attaching the die to the substrate, a mechanism for rotating a part holding the die of the attaching unit by 90 ° from a state when the die is taken out is attached to the attaching unit. A semiconductor mounting device provided with a posture correcting means for correcting the posture at the same time as holding the die. 15. A multiple take-out means comprising a plurality of parts for holding a die, the parts being sequentially movable with respect to a die take-out position.
5. The semiconductor mounting device according to item 4. 16. A take-out means for taking out the die from the expanded sheet, a posture correcting means for correcting the posture of the taken-out die, a reversing means for reversing the posture of the die by 90 °,
In a semiconductor mounting apparatus having a conveying means for conveying a die and an attaching means for attaching the die to a substrate, a part for holding the die is provided rotatable by 90 ° so that a posture of the die taken out is reversed by 90 ° in a takeout means. , 90
° The attitude correction means for receiving the rotated die and correcting the attitude of the die is fixedly arranged, and the mounting means takes out and holds the die held by the attitude correction means, and attaches the die to the mounting position of the substrate. Characterized in that the die can be attached to a substrate by moving to a substrate. 17. The semiconductor mounting apparatus according to claim 16, wherein the take-out means and the attachment means are of a multiple type provided with a plurality of die holding portions. 18. A take-out means for taking out the die from the expanded sheet, a posture correcting means for correcting the posture of the taken-out die, a reversing means for reversing the posture of the die by 90 °,
In a semiconductor mounting apparatus having a transporting means for transporting a die, and an attaching means for attaching the die to a substrate, the reversing means includes a die provided with a posture correcting means for receiving the die taken out by the taking out means and simultaneously correcting the position of the die. And a mechanism for transferring the die to a position for transferring the die to a mounting means, while providing a holding portion for the die and rotating the holding portion by 90 ° to reverse the position of the die by 90 °. . 19. The take-out means comprises a plurality of mounting means for providing a plurality of sites for holding the taken-out dies at predetermined intervals on the same circumference so that the sites can be moved in the circumferential direction. The attaching means is a multiple type attaching means which receives the die from the reversing means and holds the die at predetermined intervals on the same circumference so that the part can be moved in the circumferential direction. 19. A mechanism comprising a plurality of said holding portions provided at predetermined intervals on the same circumference so that the holding portions can be moved in the circumferential direction.
A semiconductor mounting device as described in the above. 20. The apparatus according to claim 18, wherein said reversing means comprises a mechanism in which a plurality of said holding portions are provided at predetermined intervals on the same circumference so that said holding portions can be moved in the circumferential direction.
A semiconductor mounting device as described in the above.