JPH1167875A - Substrate treating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To set time required for the alignment treatment of a substrate to minimum, by adjusting the direction of the substrate at the time of transferring from an interface part to an exposure device at an outer part to that when exposure treatment is started. SOLUTION: A substrate W transported from a rotary coating unit 32 is transported to an interface part 24 via a heat treatment unit 30. The substrate W is placed on the chuck of a direction positioning device 70, a center ring arm is contracted and centering treatment is executed. Then, the substrate W is attracted and held by the chuck and it integrally rotates with the chuck. A sensor detects the position of the orientation flat part of the rotating substrate W, and the rotation mechanism of the chuck is controlled based on the result. When the orientation flat part of the substrate W faces is a prescribed direction, the rotation of the chuck is stopped. The substrates W are arranged to the prescribed direction matched with the direction when exposure treatment is started. Then, the time required for alignment treatment can be suppressed to minimum.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a semiconductor wafer,
Equipped with a plurality of substrate processing units that perform required processing on substrates such as glass substrates for liquid crystal display devices (LCD) or photomasks, and substrates for optical disks, and deliver substrates to and from external exposure equipment. Further, the present invention relates to a substrate processing apparatus for performing a series of substrate processing.

[0002]

2. Description of the Related Art In a substrate processing apparatus for performing a plurality of processes on a substrate such as a semiconductor wafer, for example, as shown in a schematic plan view of FIG. An indexer unit 12 and a substrate transfer arm 16 which take out and carry out the substrates W to be processed one by one and carry out all the processed substrates one by one and store them in the cassette 10 again. A transfer unit 18 provided with a self-propelled substrate transfer robot 14 and a first substrate processing area 20 having a plurality of substrate processing units each disposed to face the transfer unit 18 and performing a predetermined process on a substrate, respectively. And an interface unit 24 for transferring a substrate between the substrate processing area 22 and an external exposure apparatus 28 arranged in parallel with the substrate processing apparatus 26. It is configured. The first substrate processing area 20 includes an adhesion unit that heats the substrate in an atmosphere of HMDS (hexamethyldisilazane) in order to improve the adhesion between the surface of the substrate and the resist, and a hot plate, respectively. Multiple heat treatment units,
Heat treatment units 30 such as a plurality of cooling units each having a cool plate are arranged in a plurality of rows and in a plurality of stages. The second substrate processing area 22 includes, for example, a substrate rotary coating unit 3 having a spin coater.
2. Peripheral exposure unit 3 for exposing the periphery of the substrate
4, and a substrate rotating type developing unit 36 provided with a spin developer.

An example of a procedure for processing a substrate by the substrate processing apparatus 26 and the exposure apparatus 28 shown in FIG. 7 will be briefly described. First, one unprocessed substrate W stored in the cassette 10 from the indexer unit 12 is first described. Each is supplied to the transport unit 18. Then, while the substrate transport robot 14 sequentially moves to, for example, the adhesion unit, the cooling processing unit, the substrate rotary coating unit 32, the heating processing unit, and the cooling processing unit, the substrate transport robot 14 first enters the substrate processing unit. The substrates to be processed are put in and the substrates to be processed are loaded, and the respective substrates are subjected to required processing by the respective substrate processing units. Thereby, a resist film is applied and formed on the surface of the substrate. Next, the substrate having the resist film formed on its surface is transferred from the transport unit 18 to the interface unit 24, and is carried into the external exposure device 28 through the interface unit 24.
Then, the substrate is exposed by the stepper of the exposure device 28, and the substrate after the exposure process is returned from the exposure device 28 to the interface unit 24, and
Is delivered to the transport unit 18 through the

The substrate after the exposure processing returned to the transport unit 18 is transported to the peripheral exposure unit 34 by the substrate transport robot 14 and is subjected to the peripheral exposure processing by the peripheral exposure unit 34. When the peripheral exposure processing is completed, the substrate transport robot 14 moves the peripheral processing unit 34 from the heating processing unit, the cooling processing unit,
6. While sequentially moving to the heating processing unit and the cooling processing unit, in each of the substrate processing units, the substrate that has been put in is taken out and the substrate to be processed is put in, and the substrate is processed by each of the substrate processing units. Is subjected to the required processing. Thus, a resist film having a desired pattern is formed on the surface of the substrate. The substrate on which the resist film having the desired pattern is formed is transferred from the transport unit 18 to the indexer unit 12.
To the cassette 10 on the indexer unit 12.

[0005]

The exposure apparatus 2
The stepper 8 is provided with an alignment mechanism for aligning each substrate in a predetermined direction. The substrate carried into the exposure apparatus 28 from the substrate processing apparatus 26 through the interface unit 24 is aligned with the alignment mechanism. After that, the chip pattern is sequentially printed on the entire surface of the resist film on the substrate surface by the stepper. As described above, since the substrate carried into the exposure device 28 is always subjected to the alignment processing, conventionally,
The direction of a substrate that has been subjected to predetermined processing by the substrate rotating type coating unit 32 of the substrate processing apparatus 26 and carried into the exposure apparatus 28 has varied. For this reason,
The exposure processing time including the alignment processing time of the substrate in the exposure device 28 is long. And, in general,
Since the exposure processing time in the exposure device 28 is longer than the processing time in the substrate rotary processing unit 32 and the like of the substrate processing device 26, if the exposure processing time in the exposure device 28 is long, the substrate processing device 26 In addition, the throughput of the entire system of the exposure apparatus 28 is reduced.

The present invention has been made in view of the above circumstances, and can minimize the time required for alignment processing of a substrate by an external exposure apparatus, and can eliminate the time in some cases. An object of the present invention is to provide a substrate processing apparatus capable of improving the throughput in the entire system including an exposure apparatus.

[0007]

The invention according to claim 1 is
A plurality of substrate processing units including a substrate rotating processing unit for performing processing on the substrate by supplying a processing liquid to the substrate surface by rotating the substrate about a vertical axis while holding the substrate in a horizontal position, and
A substrate processing unit including a transport unit configured to sequentially transport a substrate to each of the plurality of substrate processing units; and a substrate including an interface unit that transfers the substrate between the substrate processing unit and an external exposure apparatus. In the processing apparatus, the substrate processing unit or the interface unit, the substrate when passing from the interface unit to the external exposure apparatus, the substrate orientation such that it matches the orientation of the substrate at the start of exposure processing in the exposure apparatus It is characterized in that direction determining means for adjusting the direction is provided.

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, the substrate rotating type processing unit includes:
It has a spin chuck for holding the substrate and a spin motor for rotating the spin chuck about a vertical axis, and a substrate rotary type coating unit for applying a photosensitive resin liquid to the surface of the substrate to form a photosensitive resin film on the substrate surface. Further, the substrate rotating type coating unit is provided with a direction determining means, and the direction determining means stops rotation of the substrate in a state where a specific position of the substrate is always in a fixed direction.

According to a third aspect of the present invention, in the substrate processing apparatus of the second aspect, as the direction determining means, direction detecting means for detecting a direction of a specific position of the substrate held by the spin chuck, and this direction. A control means is provided for controlling the spin motor to stop driving when a specific position of the substrate is oriented in a certain direction based on a detection signal from the detection means.

According to a fourth aspect of the present invention, in the substrate processing apparatus according to the first aspect, as one of the substrate processing units of the substrate processing unit, there is provided a peripheral exposure unit that performs an exposure process on a peripheral portion of the substrate. The exposure unit is provided with a direction determining means, and the direction determining means stops rotation of the substrate in a state where a specific position of the substrate always faces a fixed direction.

According to a fifth aspect of the present invention, in the substrate processing apparatus of the first aspect, a substrate holding / rotating means for holding the substrate in a horizontal posture and rotating the substrate about a vertical axis, and holding the substrate by the substrate holding / rotating means Direction determining means for detecting the direction of the specified position of the substrate, and control means for controlling the rotation stop position of the substrate holding / rotating means based on a detection signal from the direction detecting means. The direction determining means is provided in the interface section.

In the substrate processing apparatus according to the first aspect of the present invention,
When the substrate is adjusted in a fixed direction by the direction determining means provided in the substrate processing section or the interface section, and when the substrate is transferred from the interface section to an external exposure apparatus, the orientation of the substrate is adjusted by the exposure apparatus. They are aligned in a certain direction so as to match the direction of the substrate at the start of the exposure processing. For this reason, when performing the alignment processing of the substrate in the exposure apparatus, since the orientation of the substrate at the start of the processing is constant, the adjustment of the orientation of the substrate does not take much time, and the alignment of the substrate in the exposure apparatus is not performed. The time required for the alignment process is minimized, and in some cases is unnecessary.
In general, the exposure processing time including the alignment processing of the substrate in the exposure apparatus is longer than the processing time in the substrate rotary processing unit of the substrate processing apparatus. When the length is reduced, the throughput of the entire system of the substrate processing apparatus and the external exposure apparatus is improved.

In the substrate processing apparatus according to the second aspect of the present invention,
In a substrate rotation type coating unit, a process is performed in which a photosensitive resin liquid is supplied to a substrate surface while a substrate held by a spin chuck is rotated about a vertical axis by a spin motor to form a photosensitive resin film on the substrate surface. When the substrate is located, a position of a specific position, for example, a linear cutout (orientation flat: orientation flat) or a concave cutout (notch) formed in a peripheral portion of the substrate always faces in a fixed direction. Rotation stops in Therefore, when the substrate is transported from the substrate rotary coating unit to the interface unit via the heat treatment unit and the like, and is transferred from the interface unit to an external exposure apparatus, the substrate is aligned in a certain direction.

In the substrate processing apparatus according to the third aspect of the present invention,
A specific position on the rotating substrate held by the spin chuck,
For example, the position of the orientation flat or the notch is detected by the direction detection means, and the drive of the spin motor is controlled by the control means based on the detection signal. Stops and the substrate stops rotating.

According to a fourth aspect of the present invention, in the substrate processing apparatus,
For example, after a photosensitive resin film is formed on the surface of the substrate by the substrate rotation type coating unit and then the substrate is heat-treated, the substrate is carried into the peripheral exposure unit before the substrate is transported to the interface unit. Then, in the peripheral exposure unit, using the substrate rotation control function of the substrate itself, the substrate is rotated around a vertical axis, and a specific position, for example, the position of the orientation flat portion or the notch always faces in a fixed direction. The rotation is stopped in the state. Therefore, when the substrate is transported from the peripheral exposure unit to the interface unit and is transferred from the interface unit to an external exposure apparatus, the substrate is aligned in a fixed direction.

In the substrate processing apparatus of the invention according to claim 5,
The board conveyed to the interface section is held in a horizontal position by the board holding / rotating means and rotated about a vertical axis in the interface section, and the specific position of the rotating board, for example, the position of the orientation flat section or the notch is detected. The rotation stop position of the substrate holding / rotating means is controlled by the control means based on the detection signal, and the substrate stops rotating with its orientation flat or notch oriented in a fixed direction. Therefore, when the substrate is transferred from the interface unit to the external exposure apparatus, the substrate is aligned in a certain direction.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described with reference to FIGS.

FIG. 1 is a schematic plan view of an entire apparatus in which an exposure apparatus is connected to a substrate processing apparatus according to the present invention. The basic configuration of the substrate processing apparatus 26 and the exposure apparatus 28 is as shown in FIG.
Is exactly the same as the device shown in FIG.

The substrate processing apparatus 26 includes at least one of the substrate processing units or the interface 24 with an alignment mechanism for adjusting the direction of the substrate. First, a first embodiment will be described with reference to FIG.

FIG. 2 is a schematic front view showing a schematic configuration of the spin coater 38 provided in the substrate rotating type coating unit 32. The spin coater 38 has a spin chuck 40 for holding the substrate W in a horizontal position. The spin chuck 40 is rotatably supported around a vertical axis by a rotation shaft 42 and is connected to the rotation shaft 42. It is rotated around a vertical axis by a spin motor (pulse motor) 44. A cup 4 having an upper surface opened so as to surround the substrate W held by the spin chuck 40.
A photoresist liquid 6 scattered from above the substrate W to the surroundings is collected in the cup 46 and collected. A disk 48 with a slit for detecting an angular position is fixed to the lower end of the rotation support shaft 42 of the spin coater 38, and the disk 48 with the slit rotates integrally with the spin chuck 40. A photo-interrupter 50 for detecting a slit (not shown) formed in the disk with slits 48 and detecting an angular position of the spin chuck 40 is provided at a peripheral portion of the disk with slits 48. .
The photo interrupter 50 is electrically connected to a controller 52 that controls driving of the spin motor 44.

When a resist film is formed on the surface of the substrate W by the spin coater 38 having the structure shown in FIG. 2, first, the substrate W is placed on the spin chuck 40 with its orientation flat (or notch) oriented in a fixed direction. It is placed and held on top. Next, the spin chuck 44 is rotated by the spin motor 44, and a photoresist solution is supplied by a coating solution supply unit (not shown) to the surface of the substrate W held on the spin chuck 40 and rotating, and the spin coating of the resist solution is performed. Processing is performed. Then, when the coating process is completed and the rotation of the substrate W is to be stopped, the photo interrupter 50 detects the slit of the disc 48 with a slit to detect the angular position of the spin chuck 40, and the photo interrupter 50 The drive of the spin motor 44 is controlled by the controller 52 on the basis of the detection signal, and the spin motor 44 stops when the orientation flat portion of the substrate W held by the spin chuck 40 faces a certain direction. The orientation of the orientation flat portion of the substrate W when the spin motor 44 is stopped is set in advance in the control unit of the spin coater 38 as data that can be changed according to the type of the stepper of the external exposure device 28 or the like. As described above, when the spin coating process by the spin coater 38 is completed, the orientation flat portion of the substrate W is aligned in a fixed direction, so that the substrate W is unloaded from the substrate rotary coating unit 32, and the substrate W is transferred to the heat treatment unit 30. When the substrate W is transferred to the interface unit 24 via the interface unit 24 and transferred to the external exposure apparatus 28 from the interface unit 24, the substrates W are aligned in a certain direction.

In the embodiment shown in FIG. 2, the angular position of the spin chuck 40 is detected by the disk with slit 48 fixed to the rotating shaft 42 and the photo interrupter 50, and is held on the spin chuck 40. The position of the orientation flat portion of the substrate W is detected indirectly.
The mechanism may be such that the orientation flat is directly detected and the substrate W is stopped in a state where the orientation flat is oriented in a certain direction. In this case, when the substrate W to be processed is placed and held on the spin chuck 40,
Even if the orientation of the orientation flat portion of the substrate W varies, the orientation of the orientation flat portion of the substrate W can be made uniform at the end of the coating process.

Next, a second embodiment will be described with reference to FIGS. FIG. 3 is a perspective view illustrating a schematic configuration of the peripheral exposure device 54 provided in the peripheral exposure unit 34. In FIG. 3, the illustration of the movement mechanism of the lens barrel of the light irradiation control mechanism is omitted.

The peripheral exposure device 54 includes a substrate rotation control mechanism for holding the substrate W in a horizontal position and rotating the substrate W about a vertical axis inside the frame 56, and for irradiating light to a peripheral portion of the substrate W. And a light irradiation control mechanism. The substrate rotation control mechanism includes a spin chuck 58 that sucks and holds the substrate W in a horizontal posture, and a spin motor 60 that rotates the spin chuck 58 about a vertical axis.
An edge sensor 62 for detecting the peripheral position of the substrate W is provided near the spin chuck 58.
The light irradiation control mechanism includes a light source device (not shown) and an optical fiber 6.
A lens barrel 66 optically connected by 4;
Although not shown, the lens barrel 66 is moved in the X-axis direction and the Y-axis direction.
A moving mechanism for reciprocating each in the axial direction is provided.

When performing the peripheral exposure processing of the substrate by the peripheral exposure apparatus 54 having the configuration shown in FIG. 3, first, the substrate W carried into the peripheral exposure unit 34 is placed on the spin chuck 58 and held by suction. Is done. FIG. 4 is a plan view showing a state where the substrate W is held by the spin chuck 58. Next, by rotating the substrate W by the spin motor 60 and detecting the peripheral position of the substrate W by the edge sensor 62, the amount of eccentricity of the substrate W and the position of the orientation flat portion OF are confirmed, and data relating to the peripheral region to be exposed is obtained. Ask for. Then, after setting the substrate W at a predetermined rotation position, the substrate W is rotated, and at the same time, light for exposure such as ultraviolet rays is irradiated from the lens barrel 66 to expose the resist film on the peripheral portion of the substrate W. Peripheral exposure processing is performed.

The configuration of the peripheral exposure apparatus 54 and the peripheral exposure processing operation as described above are not particularly different from those of the conventional apparatus. However, in the second embodiment, the function of the substrate rotation control mechanism of the peripheral exposure apparatus 54 is utilized. To adjust the direction of the substrate W. For this purpose, as shown in a block diagram in FIG. 5, a direction correction control unit 68 that receives a detection signal from the edge sensor 62 and sends a control signal to the spin motor 60 is provided. The direction correction control unit 68 is incorporated in, for example, the control unit of the peripheral exposure device 54.

The operation of determining the direction of the substrate by the peripheral exposure device 54 will be described.
The substrate carried out from the substrate 2 (the direction of the substrate is not adjusted in the substrate rotating type coating unit 32, and the direction of the substrate is varied) is subjected to the heat treatment and the cooling treatment in the heat treatment unit 30 and then to the interface unit 24. Before being transported, it is transported from the heat treatment unit 30 to the peripheral exposure unit 34. The substrate W carried into the peripheral exposure unit 34 is placed on the spin chuck 58 and held by suction. Next, the substrate W is rotated by the spin motor 60, the position of the orientation flat OF is detected by the edge sensor 62, and the position data is sent from the edge sensor 62 to the direction correction control unit 68. Then, the direction correction control unit 68 calculates a rotation correction amount of the substrate W required to make the direction of the orientation flat OF coincide with a predetermined direction from the position data of the orientation flat OF, and performs control based on the calculation result. The signal is sent from the direction correction control unit 68 to the spin motor 60.
Send to Thus, the spin motor 60 stops when the orientation flat portion of the substrate W held by the spin chuck 58 faces a certain direction. Since the orientation flat portion OF of the substrate W is aligned in a fixed direction in this way, the substrate W is unloaded from the peripheral exposure unit 34, and the substrate W is transported to the interface portion 24, and the external exposure device is When the substrate W is transferred to the substrate 28, the substrate W is aligned in a certain direction.

Next, a third embodiment will be described with reference to FIGS.

In the third embodiment, as shown in FIG. 1, the interface unit 24 is provided with a direction determining device 70 for performing an alignment process on the substrate W. As shown in a plan view in FIG. 6, the direction determining device 70 includes a chuck 72 for sucking and holding the substrate W, five centering arms 74 arranged radially around the chuck 72 and capable of contracting and extending, and a chuck. A sensor 76 is provided above a peripheral portion of the substrate W held by the sensor 72. The chuck 72 is configured to be rotated around a vertical axis by a rotation mechanism (not shown).

The operation of the substrate alignment process performed by the direction determining device 70 will be described. The substrate carried out of the substrate rotary type coating unit 32 (the substrate direction is not adjusted in the substrate rotary type coating unit 32 but the substrate direction is adjusted. (Variable) is transferred to the interface unit 24 via the heat treatment unit 30. Interface unit 24
The substrate W carried into the inside is placed on the chuck 72 of the direction determining device 70 by a robot (not shown), and the centering arm 74 contracts to perform centering processing. Subsequently, the substrate W is suction-held by the chuck 72 and rotates integrally with the chuck 72. Then, the position of the orientation flat portion OF of the rotating substrate W is detected by the sensor 76, and the rotation mechanism of the chuck 72 is controlled by a controller (not shown) based on the detection result of the sensor 76. Orientation flat part O
When F is oriented in a certain direction, the rotation of the chuck 72 stops. Since the orientation flat portion OF of the substrate W is aligned in a fixed direction in this way, the substrate W transferred from the interface section 24 to the external exposure device 28 is aligned in a fixed direction.

In each of the above embodiments,
A mechanism for performing substrate alignment processing is provided in the substrate rotation type coating unit 32, the peripheral exposure unit 34, or the interface unit 24, but other units,
For example, the spin developer of the substrate rotating type developing unit 36 is provided with an alignment function, and the substrate rotating type developing unit 3 is transferred before the substrate is transported to the interface unit 24.
6, the substrate may be transferred to the interface unit 24 after the substrate is aligned using the spin developer of the substrate rotary developing unit 36.

[0032]

In the substrate processing apparatus according to the first aspect of the present invention, when the substrate is transferred from the interface unit to an external exposure apparatus, the orientation of the substrate at the start of the exposure processing in the exposure apparatus is changed. Since the alignment is performed in a fixed direction so as to match the orientation, the time required for the alignment processing of the substrate in the exposure apparatus can be minimized, and in some cases, it is unnecessary. For this reason, the exposure processing time including the alignment processing time of the substrate in the exposure apparatus is shortened, so that the throughput of the entire system of the substrate processing apparatus and the external exposure apparatus can be improved.

In the substrate processing apparatus according to the second aspect of the present invention,
When the photosensitive resin liquid is spin-coated on the surface of the substrate in the substrate spin-coating unit, the substrate stops rotating with its specific position always facing a certain direction.
Therefore, when the substrate is transported from the substrate rotation type coating unit to the interface unit via the heat treatment unit and the like, and the substrate is transferred from the interface unit to an external exposure apparatus, the substrate is aligned in a certain direction. The time required for alignment processing of the substrate in the apparatus is minimized, and in some cases it is not necessary.

In the substrate processing apparatus according to the third aspect of the present invention,
In the substrate rotation type coating unit, the spin motor stops when the specific position of the substrate faces a certain direction, and the substrate stops rotating, whereby the substrates are aligned in a certain direction.

In the substrate processing apparatus according to the fourth aspect of the present invention,
In the peripheral exposure unit, the rotation of the substrate is stopped with its specific position always facing a fixed direction by utilizing the substrate rotation control function possessed by itself. Therefore, when the substrate is conveyed from the peripheral exposure unit to the interface unit and is transferred from the interface unit to an external exposure apparatus, the substrate is aligned in a fixed direction. Is minimized and in some cases unnecessary.

In the substrate processing apparatus according to the fifth aspect of the present invention,
In the interface unit, the rotation of the substrate is stopped by the direction determining means in a state where the specific position of the substrate is oriented in a certain direction. Therefore, when the substrate is transferred from the interface unit to the external exposure apparatus, the substrate is aligned in a fixed direction, so that the time required for the alignment processing of the substrate in the exposure apparatus is minimized, and in some cases, Becomes unnecessary.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of an entire apparatus in which an exposure apparatus is connected to a substrate processing apparatus according to the present invention.

FIG. 2 shows the first embodiment of the present invention, and is a schematic front view showing a schematic configuration of a spin coater provided in a substrate rotation type coating unit.

FIG. 3 is a perspective view illustrating a second embodiment of the present invention and schematically illustrating a configuration of a peripheral exposure device provided in a peripheral exposure unit.

FIG. 4 is a plan view showing a state where a substrate is held by a spin chuck of the peripheral exposure apparatus.

FIG. 5 is a block diagram of a substrate rotation control mechanism of the peripheral exposure apparatus.

FIG. 6 shows a third embodiment of the present invention, and is a plan view of a direction determining device provided in an interface unit.

FIG. 7 is a schematic plan view of an entire apparatus in which an exposure apparatus is connected to a conventional substrate processing apparatus.

[Explanation of symbols]

 12 Indexer unit 18 Transport unit 20, 22 Substrate processing area 24 Interface unit 26 Substrate processing unit 28 Exposure device 30 Heat treatment unit 32 Substrate rotary coating unit 34 Peripheral exposure unit 36 Substrate rotary developing unit 38 Spin coater 40, 58 Spin chuck 42 Rotation Support shafts 44, 60 Spin motor 48 Disk with slit 50 Photo interrupter 52 Controller 54 Peripheral exposure device 62 Edge sensor 66 Lens barrel 68 Direction correction control unit 70 Direction determination device 72 Chuck 76 Sensor W substrate OF Orientation flat portion

Continued on the front page (51) Int.Cl. ⁶ identification code FI H01L 21/30 564C 569D

Claims (5)

[Claims] 1. A plurality of substrate processing units including a substrate rotating type processing unit for holding a substrate in a horizontal posture, rotating the substrate about a vertical axis, supplying a processing liquid to the substrate surface, and performing processing on the substrate. A substrate processing unit including a transport unit configured to sequentially transport a substrate to each of a plurality of substrate processing units; and an interface unit configured to transfer a substrate between the substrate processing unit and an external exposure apparatus. In the apparatus, the substrate processing unit or the interface unit may be configured such that the substrate orientation at the time of transfer from the interface unit to an external exposure apparatus is adjusted to match the orientation of the substrate at the start of exposure processing in the exposure apparatus. A substrate processing apparatus provided with direction determining means for adjusting the direction of the substrate. 2. A substrate rotation type processing unit, comprising: a spin chuck for holding a substrate; and a spin motor for rotating the spin chuck about a vertical axis. A substrate rotation type coating unit for forming a resin film, wherein a direction determining means is provided in the substrate rotation type coating unit, and the rotation of the substrate is stopped in a state where a specific position of the substrate always faces a fixed direction. The substrate processing apparatus according to claim 1. 3. A direction detecting means for detecting a direction of a specific position of a substrate held by a spin chuck, and a specific position of the substrate being fixed based on a detection signal from the direction detecting means. 3. The substrate processing apparatus according to claim 2, further comprising control means for controlling the spin motor to stop driving when the spin motor is turned. 4. One of the substrate processing units of the substrate processing unit is a peripheral exposure unit that performs exposure processing on a peripheral portion of the substrate, and a direction determining unit is provided in the peripheral exposure unit, so that a specific position of the substrate is always maintained. 2. The substrate processing apparatus according to claim 1, wherein the substrate is stopped in a state where the substrate faces a certain direction. 5. A direction determining means for holding a substrate in a horizontal position and rotating the substrate about a vertical axis, and detecting a direction of a specific position of the substrate held by the substrate holding and rotating means. And a control means for controlling a rotation stop position of said substrate holding / rotating means on the basis of a detection signal from said direction detecting means, wherein said direction determining means is provided in said interface unit. 2. The substrate processing apparatus according to 1.