JPH1158347A - Apparatus and method for punching - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance a forming efficiency of a via hole or productivity of a laminated chip component in the case of forming many via holes at a green sheet for constituting the component. SOLUTION: An upper mallet 3 is dropped to engage two punch parts 3a with respective die parts 2a of a mortar 2 in the state that a green sheet 1 is placed on a mortar 2. Thereafter, the mallet 3 is raised, and the parts 2a are drawn from a punched part 3a. Thus, two via holes 5 are simultaneously formed at the sheet 1. Then, the two holes are formed by one hit (one reciprocating operation of the mallet 3).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a punching apparatus and a punching method suitable for forming a large number of via holes in a green sheet constituting a laminated chip component.

[0002]

2. Description of the Related Art FIG. 6 is a front view showing an example of a conventional punching device.

When manufacturing a multilayer chip component in which a plurality of green sheets are stacked, a large number of via holes (circular holes having a diameter of about 0.1 mm) are formed in each green sheet prior to circuit connection between the green sheets. Carry out punching work.

Conventionally, in this punching operation, FIG.
As shown in the figure, the green sheet 1 is placed on the die 2, and in this state, the upper punch 3 is lowered to move the punch 3a to the die 2.
After the upper punch 3 is lifted up and the punch 3a is removed from the die 2a of the die 2,
The green sheet 1 was punched to form the via hole 5.

[0005]

However, in this case, only one via hole 5 can be formed in one hit (one reciprocating operation of the upper punch 3), and a punching operation corresponding to the required number of via holes 5 is required. Therefore, there is a disadvantage that the formation efficiency of the via hole 5 is low and the productivity of the multilayer chip component is low.

In order to eliminate such inconvenience, a plurality of punch portions 3a are formed in the upper punch 3, and a same number of die portions 2a are formed in the die 2, so that a plurality of via holes 5 can be simultaneously formed by one hit. Although it is conceivable that the punch 3a can be formed, as the number of combinations of the punch 3a and the die 2a increases, not only does the positioning of the punch 3a with respect to the die 2a take more trouble, but also the If any one of the upper punches 3 is damaged, the entire upper punch 3 must be replaced, and there is a disadvantage in that the parts are wasted and the practicality and economy are poor.

SUMMARY OF THE INVENTION In view of the above circumstances, an object of the present invention is to provide a punching apparatus and a punching method capable of improving the efficiency of forming a via hole and, consequently, the productivity of a laminated chip component while maintaining practicality and economy. And

[0008]

That is, the invention of the punching apparatus of the present invention is a punching apparatus in which an upper punch (3) is provided to be able to move up and down with respect to a die (2), and is formed on a holder (3b). The punches (3a) detachably engaged with the plurality of punch engagement holes (3c) are employed as the upper punches, and the plurality of die portions (2a) are respectively mounted on the main body (2b). A punch formed in such a manner as to face each punch portion of the punch is adopted as the mill.

The punch engagement hole (3) of the upper punch (3)
c) and the punch portion (3a) are formed in a tapered shape.

On the other hand, according to the invention of the punching method of the present invention, when performing punching using the above-described punching apparatus, the upper punch (3) is placed with the green sheet (1) placed on the die (2). Is lowered to fit the punch portion (3a) into the die portion (2a) of the die, and then the upper punch is raised to pull out the punch portion from the die portion of the die, thereby obtaining the green sheet. And a plurality of via holes (5) are formed simultaneously.

When performing punching using the punching apparatus, the upper punch (3) is lowered while the green sheet (1) is placed on the die (2), and the punch portion (3a) is lowered. Is fitted into the die portion (2a) of the mortar, the upper punch is raised, and the punch portion is removed from the die portion of the mortar, so that a plurality of first via holes (5A) are formed in the green sheet. ) Is simultaneously formed, and then the green sheet is moved on the die by a distance equal to 1 / n (n is a natural number of 2 or more) of the pitch (P1, P2) of the punch portion of the upper punch. Then, after lowering the upper punch (3) to fit the punch portion (3a) to the die portion (2a) of the die, the upper punch is raised to move the punch portion from the die portion of the die. By pulling out, a plurality of second vias are attached to the green sheet. Configured so as to simultaneously form holes (5B).

It should be noted that reference numerals in parentheses are for convenience showing corresponding elements in the drawings, and therefore, the present invention is not limited to the description on the drawings. The same applies to the column of “Claims”.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a first embodiment of a punching apparatus according to the present invention.
FIG. 2 is a plan view of a die constituting the punching device shown in FIG. 1, FIG. 3 is a process diagram showing a via hole forming method by the punching device shown in FIG.
(A) shows a basic pattern, (b) shows a 1/2 pitch pattern, (c) shows a 1/3 pitch pattern, and FIG. 4 shows a second embodiment of the punching apparatus according to the present invention. FIG. 5 is a process diagram showing a via hole forming method by the punching device shown in FIG. 4,
(A) is a diagram showing a basic pattern, (b) is a diagram showing a ピ ッ チ pitch pattern, and (c) is a diagram showing a ３ pitch pattern.

The punching device according to the present invention comprises a die 2 and an upper punch 3, as shown in FIG. The mortar 2 has a rectangular parallelepiped main body 2b, and two dies 2a are formed on the main body 2b. Further, a conical opening 2c is formed below each die 2a.

On the other hand, the upper punch 3 has a rectangular parallelepiped holder 3b, and two conical tapered punch engagement holes 3c are formed in the holder 3b. Each punch engagement hole 3c
, A punch portion 3a having a conical taper shape corresponding to the shape of the punch engagement hole 3c is detachably engaged with the punch engagement hole 3c, and the punch portion 3a is provided above the holder 3b so that the punch portion 3a does not come off. A lid 3d for holding is openably and closably mounted.

Each of the punch engagement holes 3c and each of the punch portions 3a of the upper punch 3 are finished with high precision according to design dimensions by rotating.

Since the punching apparatus according to the present invention has the above configuration, when forming a via hole in the green sheet 1 using this punching apparatus, the punching operation is performed according to the following procedure.

First, as shown in FIG. 1, the green sheet 1 is placed on the die 2, and the upper punch 3 is lowered. Then, the two punch portions 3a of the upper punch 3 are respectively connected to the die portions 2a of the die 2.
And the green sheet 1 is punched out to form two via holes 5 at the same time. At this time, two punch residues (not shown) are generated, and each punch residue is sucked and collected from each opening 2 c of the die 2.

Thereafter, the upper punch 3 is raised. Then, the two punch portions 3a of the upper punch 3 pass upward from the die portion 2a of the die 2, and return to the original state.

Next, in order to form the next via hole 5 in another portion of the green sheet 1, the green sheet 1 is
Then, the upper punch 3 is moved downward, the upper punch 3 is lowered, and the green sheet 1 is punched by the punch 3a. Then, the upper punch 3 is raised to release the engagement state between each punch 3a and each die 2a. I do. Then, two more via holes 5 are formed in the green sheet 1.

The above operation is repeated to form a predetermined number (for example, 120) of via holes 5 in the green sheet 1. At this time, since two via holes 5 can be formed with one hit, the time required to form a fixed number of via holes 5 is half that of the conventional method in which only one via hole 5 can be formed with one hit. The formation efficiency is greatly improved.

When a predetermined number of via holes 5 are formed in the green sheet 1, the punching operation is completed.

In such a punching operation, two via holes 5A simultaneously formed in one hit are formed.
The interval between the two punch portions 3 as shown in FIG.
a, but if the interval between the via holes 5 is to be made smaller than this, by devising a punching method, the pitch P1 of the punch portion 3a can be reduced to 1/1 of the pitch P1.
n (where n is a natural number of 2 or more)
Can be formed.

For example, the interval between the via holes 5 is
In the case where the pitch P is set to 1/2 of the pitch P1a, two via holes 5A are formed by the above-described procedure as shown in FIG. 3A, and then the green sheet is formed as shown in FIG. 3B. 1
Is moved by １ ／ of the pitch P1 of the punch portion 3a, and two via holes 5B may be formed in the same procedure. When the interval between the via holes 5 is set to 1/3 of the pitch P1 of the punch portion 3a, as shown in FIG. 3A, after two via holes 5A are formed by the above-described procedure, as shown in FIG.
As shown in (c), the green sheet 1 is inserted into the punch 3a.
, And two via holes 5B are formed in the same procedure. Further, the green sheet 1 is moved by １ ／ of the pitch P1 of the punch 3a, and two via holes 5C are formed in the same procedure. May be formed.

The tip of the punch 3a of the upper punch 3 is so thin as to have a diameter of about 0.1 mm, and may be broken and damaged during punching work.
d, and after removing the damaged punch portion 3a,
What is necessary is just to mount the new punch part 3a and close the lid 3d.
At this time, the punch engagement hole 3c of the upper punch 3 and the punch portion 3a are
As described above, since it is precisely processed into a conical taper shape, the positioning with respect to the die portion 2a is completed only by dropping a new punch portion 3a into the punch engagement hole 3c,
There is no hassle in positioning. Further, only the damaged punch portion 3a of the two punch portions 3a of the upper punch 3 needs to be replaced, and the undamaged punch portion 3a can be used as it is, so that waste of parts can be reduced. Becomes

In the above-described embodiment, the punching device including the die 2 having the two die portions 2a and the upper punch 3 having the two punch portions 3a has been described. If the number of die portions 2a to be formed (equal to the number of punch portions 3a provided on the upper punch 3) is further increased, the formation efficiency of the via hole 5 can be further improved.

For example, as shown in FIG. 4, when the number of die portions 2a and punch portions 3a is four, four via holes 5 are formed in one hit.
The time required to form is reduced to 1/4 of the conventional method.

In this case, the interval between the four via holes 5A simultaneously formed in one hit coincides with the pitches P1 and P2 of the four punch portions 3a as shown in FIG. In order to make the interval 5 smaller than this, the punching method is devised to form the via holes 5 at intervals equal to 1 / n (n is a natural number of 2 or more) of the pitches P1 and P2 of the punch portion 3a. be able to.

For example, the interval between the via holes 5 is
In the case of setting the pitch a to 1/2 of the pitches P1 and P2, the following may be performed. First, as shown in FIG. 5A, after four via holes 5A are formed by the above-described procedure, FIG.
As shown in (b), the green sheet 1 is moved to the left in FIG. 5 by １ ／ of the pitch P1 of the punch portion 3a, and four via holes 5B are formed in the same procedure. Next, the green sheet 1 is moved rightward in FIG.
1/2 of FIG. 5 and 1 of the pitch P2 of the punch portion 3a facing upward.
/ 2, and four via holes 5C are formed in the same procedure. Further, the green sheet 1 is moved to the left in FIG. 5 by half the pitch P1 of the punch portion 3a, and four via holes 5D are formed in the same procedure. Form.

Further, the interval between the via holes 5 is adjusted by the punch 3a.
In the case where the pitches are set to 1/3 of the pitches P1 and P2, the following may be performed. First, as shown in FIG. 5A, after four via holes 5A are formed by the above-described procedure, FIG.
As shown in (c), the green sheet 1 is moved to the left in FIG. 5 by 1/3 of the pitch P1 of the punch 3a to form four via holes 5B. Next, the green sheet 1 is moved leftward in FIG. 5 by 1/3 of the pitch P1 of the punch portion 3a to form four via holes 5C, and then the green sheet 1 is moved rightward in FIG.
、 Of FIG. 5, and the pitch P2 of the punch portion 3a in FIG.
By moving by / 3, four via holes 5D are formed.
Next, the green sheet 1 is moved to the left in FIG. 5 by 1/3 of the pitch P1 of the punch portion 3a, and the four via holes 5 are formed.
After forming E, the green sheet 1 is moved leftward in FIG. 5 by 1/3 of the pitch P1 of the punch portion 3a to form four via holes 5F. Further, the green sheet 1 is turned rightward in FIG. 5 to 2/3 of the pitch P1 of the punch portion 3a,
After moving upward one-third of the pitch P2 of the punch 3a to form four via holes 5G, the green sheet 1 is moved leftward in FIG. 5 to one-third of the pitch P1 of the punch 3a.
To form four via holes 5H. Finally, the green sheet 1 is moved to the left in FIG.
To form

In the above embodiment, the upper punch 3
The case where the punch engagement hole 3c and the punch portion 3a are of a conical taper shape has been described.
The shape of the punch portion 3a is not limited to the conical taper shape, but may adopt another taper shape (for example, a triangular pyramid taper or a quadrangular pyramid taper).

[0033]

As described above, according to the invention of the punching device of the present invention, in the punching device in which the upper punch 3 is provided so as to be able to move up and down with respect to the die 2, a plurality of punches are formed on the holder 3b. The upper punch 3 is formed by detachably engaging a punch portion 3a with a punch engaging hole 3c, and a plurality of die portions 2a are respectively opposed to the punch portions 3a of the upper punch 3 on the main body 2b. Since the die formed as described above is adopted as the die 2, a plurality of via holes 5 can be formed in one hit, so that the formation efficiency of the via holes 5 and the productivity of the laminated chip component can be improved. In addition, when one of the plurality of punch portions 3a is damaged, only the damaged punch portion 3a needs to be replaced, so that it is economical in that parts can be wasted.

Further, since the punch engagement hole 3c and the punch portion 3a of the upper punch 3 are formed in a tapered shape, in addition to the above-described effects, even if the combination of the punch portion 3a and the die portion 2a is large, In addition, the labor required for positioning the punch portion 3a with respect to the die portion 2a can be omitted, and the practicability is excellent.

On the other hand, according to the invention of the punching method of the present invention, when performing the punching using the above-described punching apparatus, the green sheet 1 is placed on the die 2 while
After lowering the upper punch 3 to fit the punch 3a into the die 2a of the die 2, the upper punch 3 is raised and the punch 3a is pulled out of the die 2a of the die 2. Since the plurality of via holes 5 are simultaneously formed in the green sheet 1, the plurality of via holes 5 are formed in one hit.
And the productivity of laminated chip components is improved.

When performing punching using the above-mentioned punching device, the upper punch 3 is lowered while the green sheet 1 is placed on the die 2, and the punch 3a is moved to the die 2a of the die 2. Then, the upper punch 3 is raised and the punch portion 3a is removed from the die portion 2a of the die 2, whereby a plurality of first via holes 5A are simultaneously formed in the green sheet 1, Next, the green sheet 1 is moved on the die 2 by a distance equal to 1 / n (n is a natural number of 2 or more) of the pitches P1, P2 of the punch portions 3a of the upper punch 3, and in this state, the upper punch 3, the punch 3a is fitted to the die 2a of the die 2,
By raising the upper punch 3 and pulling out the punch 3a from the die 2a of the die 2, the green sheet 1 is removed.
Is formed so that a plurality of second via holes 5B are simultaneously formed.
Is formed and the interval between the via holes 5 is subdivided, so that the efficiency of forming the via holes 5 and the productivity of the laminated chip component are further improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a first embodiment of a punching device according to the present invention.

FIG. 2 is a plan view of a mill constituting the punching device shown in FIG.

3A to 3C are process diagrams showing a via hole forming method using the punching apparatus shown in FIG. 1, wherein FIG. 3A shows a basic pattern, FIG. 3B shows a 1/2 pitch pattern, and FIG.
FIG. 3 is a diagram showing a ピ ッ チ pitch pattern.

FIG. 4 is a plan view of a mill that constitutes a second embodiment of the punching device according to the present invention.

5A to 5C are process diagrams showing a via hole forming method using the punching apparatus shown in FIG. 4, wherein FIG. 5A shows a basic pattern, FIG. 5B shows a 1/2 pitch pattern, and FIG.
FIG. 3 is a diagram showing a ピ ッ チ pitch pattern.

FIG. 6 is a front view showing an example of a conventional punching device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Green sheet 2 ... Die 2a ... Die part 2b ... Main body 3 ... Upper punch 3a ... Punch part 3b ... Holder 3c ... Punch engagement hole 5 ... Via holes P1, P2 ... Punch part Pitch

Claims (4)

[Claims] A punching device provided with an upper punch (3) capable of ascending and descending with respect to a die (2), wherein a plurality of punch engaging holes (3c) formed in a holder (3b) have punch portions (3c). 3a) is detachably engaged as the upper punch, and a main body (2b) in which a plurality of die portions (2a) are formed so as to face each punch portion of the upper punch, respectively. A punching device characterized by being used as a mortar. 2. The punching device according to claim 1, wherein the punch engagement hole (3c) and the punch portion (3a) of the upper punch (3) are formed in a tapered shape. 3. When performing punching using the punching apparatus according to claim 1 or 2, the green sheet (1) is placed on a mortar (2).
After lowering the upper punch (3) to fit the punch portion (3a) to the die portion (2a) of the die, raising the upper punch and removing the punch portion from the die portion of the die. By
A punching method wherein a plurality of via holes (5) are simultaneously formed in the green sheet. 4. When performing punching using the punching device according to claim 1 or 2, the green sheet (1) is placed on a mortar (2).
After lowering the upper punch (3) to fit the punch portion (3a) to the die portion (2a) of the die, raising the upper punch and removing the punch portion from the die portion of the die. By
A plurality of first via holes (5
A) is simultaneously formed, and then the green sheet is moved on the die by a distance equal to 1 / n (n is a natural number of 2 or more) of the pitch (P1, P2) of the punch portion of the upper punch. In this state, the upper punch (3) is lowered, and the punch (3)
a) is fitted to the die part (2a) of the die, and then the upper punch is raised to remove the punch part from the die part of the die, thereby forming a plurality of second via holes in the green sheet. A punching method configured to simultaneously form (5B).