JPH1158222A - Carrier material to hold polished work - Google Patents
Carrier material to hold polished workInfo
- Publication number
- JPH1158222A JPH1158222A JP23056997A JP23056997A JPH1158222A JP H1158222 A JPH1158222 A JP H1158222A JP 23056997 A JP23056997 A JP 23056997A JP 23056997 A JP23056997 A JP 23056997A JP H1158222 A JPH1158222 A JP H1158222A
- Authority
- JP
- Japan
- Prior art keywords
- carrier material
- prepreg
- polished
- metal plate
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】シリコンやゲルマニウム等の
半導体ウエハ、液晶ディスプレイガラス、ハードディス
クなどの製造においては、これらの表面を研磨する工程
がある。本発明は、前記研磨工程で、これら研磨する対
象物（被研磨物）を保持するために使用するキャリア材
に関する。BACKGROUND OF THE INVENTION In the production of semiconductor wafers such as silicon and germanium, liquid crystal display glass, hard disks, etc., there is a step of polishing these surfaces. The present invention relates to a carrier material used for holding the object to be polished (object to be polished) in the polishing step.
【０００２】[0002]
【従来の技術】上記各種被研磨物を研磨工程で保持する
キャリア材として、ＳＫ鋼などの金属板が使用されてい
る。例えば、シリコンウエハのキャリア材は、ＳＫ鋼か
らなる円板の周縁に研磨機のインターナルギア、サンギ
アと噛み合うギアを形成し、シリコンウエハを嵌め込ん
で保持するための円形穴を板面に形成したものである。
近年、シリコンウエハなど被研磨物の大型化と一つのキ
ャリア材に保持する被研磨物の個数の増加に伴い、キャ
リア材の面積が大きくなっている。このようにキャリア
材の面積を大きくしても、単位面積当たりの研磨圧力は
変わらないので総加圧力は大きくする必要がある。ま
た、生産性をより高めるに、研磨機に装着したキャリア
材の回転をより高速にする必要がある。2. Description of the Related Art A metal plate such as SK steel is used as a carrier material for holding the above various objects to be polished in a polishing step. For example, the carrier material of a silicon wafer has a disk formed of an SK steel, and a gear that meshes with an internal gear and a sun gear of a polishing machine is formed on a peripheral edge of the disk, and a circular hole for fitting and holding the silicon wafer is formed on the plate surface. Things.
2. Description of the Related Art In recent years, as the size of an object to be polished such as a silicon wafer increases and the number of objects to be polished held in one carrier material increases, the area of the carrier material increases. Thus, even if the area of the carrier material is increased, the polishing pressure per unit area does not change, so that the total pressing force needs to be increased. Further, in order to further increase the productivity, it is necessary to rotate the carrier material mounted on the polishing machine at a higher speed.
【０００３】[0003]
【発明が解決しようとする課題】キャリア材の大面積化
と回転の高速化は、被研磨物およびキャリア材の表面と
研磨パッド等との摩擦力を増大させ、キャリア材ギア部
にかかる負荷も増加する。これに伴って、当該ギア部の
摩耗・損傷が著しくなり、キャリア材の寿命が短かくな
るという問題がある。また、ＳＫ鋼などの金属キャリア
材は錆びるという別の問題もある。金属キャリア材の錆
は、研磨時の水や砥粒スラリ中の水が原因であり、工程
変更（段替え）で、金属キャリア材を一時保管している
間に錆が発生する。この錆が研磨時の異物となり、シリ
コンウエハなどの被研磨物表面にスクラッチ（微小な
傷）を発生させる。さらに、ＳＫ鋼からなるキャリア材
は、そり・ねじれが比較的大きいため、被研磨物をキャ
リア材へセッティングする際に位置合わせをしづらかっ
たり、研磨時に被研磨物がキャリア材と研磨定盤の隙間
に潜り込んだりしてトラブルを生じるという問題があ
る。The increase in the area of the carrier material and the speed of the rotation increase the frictional force between the surface of the object to be polished and the surface of the carrier material and the polishing pad, and also reduce the load applied to the gear portion of the carrier material. To increase. Along with this, there is a problem that the wear and damage of the gear portion become remarkable, and the life of the carrier material is shortened. Another problem is that metal carrier materials such as SK steel rust. The rust of the metal carrier material is caused by water at the time of polishing or water in the abrasive slurry, and rust occurs during temporary storage of the metal carrier material due to a process change (step change). This rust becomes foreign matter during polishing and causes scratches (microscopic scratches) on the surface of the object to be polished such as a silicon wafer. Further, since the carrier material made of SK steel has a relatively large warp and twist, it is difficult to perform positioning when setting the object to be polished to the carrier material. There is a problem that a trouble is caused by sneaking into a gap.
【０００４】本発明が解決しようとする第一の課題は、
半導体ウエハなどの被研磨物保持のための金属キャリア
材に関し、研磨パッド等との摩擦力を低下させることに
よりギア部の摩耗を少なくしキャリア材の寿命を延ばす
ことである。また、錆の発生も抑えることである。本発
明が解決しようとする第二の課題は、上記第一の課題に
加えて、キャリア材の材質としてステンレス鋼を選択す
ることにより、キャリア材のそり・ねじれを抑制するこ
とである。The first problem to be solved by the present invention is that
With respect to a metal carrier material for holding an object to be polished such as a semiconductor wafer, the frictional force with a polishing pad or the like is reduced to reduce wear of a gear portion and extend the life of the carrier material. It is also to suppress the generation of rust. A second problem to be solved by the present invention is to suppress warpage and twist of the carrier material by selecting stainless steel as the material of the carrier material in addition to the first problem.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
に、本発明に係る研磨用キャリア材は、金属板の少なく
とも片側表面に、熱硬化性樹脂を含浸したシート状基材
の層を一体化したことを特徴とする。このように表面に
熱硬化性樹脂層を形成したキャリア材とすることによ
り、キャリア材と研磨パッド等との間の摩擦力が小さく
なり、キャリア材ギア部にかかる負荷が低減される。こ
の結果、ギア部の摩耗が少なくなり、キャリア材の寿命
を延ばすことができる。熱硬化性樹脂はシート状基材に
含浸されているのでしっかりと保持される。In order to solve the above-mentioned problems, a polishing carrier material according to the present invention comprises a sheet-like substrate impregnated with a thermosetting resin integrally formed on at least one surface of a metal plate. It is characterized by having By using the carrier material having the thermosetting resin layer formed on the surface in this way, the frictional force between the carrier material and the polishing pad or the like is reduced, and the load applied to the carrier material gear portion is reduced. As a result, wear of the gear portion is reduced, and the life of the carrier material can be extended. Since the thermosetting resin is impregnated in the sheet-like substrate, it is held firmly.
【０００６】金属の摩擦係数は金属の硬度とせん断強さ
によって決められるのに対し、熱硬化性樹脂など高分子
材料の摩擦係数は、荷重の増大とともに僅かではあるが
低下する。さらに、熱硬化性樹脂層の表面は、粗面にな
ると摩擦係数が低下する。このことは、研磨時に砥粒で
熱硬化性樹脂層の表面に微小な凹凸が形成されることに
より、摩擦力は上昇せず、むしろ低下することを意味す
る。また、摩擦力の速度依存性は、一般に金属より高分
子の方が大きいと言われている。熱硬化性樹脂層の動摩
擦係数は速度が増大すると低下する傾向にあり、研磨機
の回転速度上昇に伴う摩擦力増大を回避する有効な構成
となる。[0006] While the coefficient of friction of a metal is determined by the hardness and shear strength of the metal, the coefficient of friction of a polymeric material such as a thermosetting resin decreases slightly with increasing load. Furthermore, when the surface of the thermosetting resin layer becomes rough, the friction coefficient decreases. This means that the frictional force does not increase but rather decreases due to the formation of minute irregularities on the surface of the thermosetting resin layer by the abrasive grains during polishing. In addition, it is generally said that a polymer has a higher speed dependency of frictional force than a metal. The coefficient of kinetic friction of the thermosetting resin layer tends to decrease as the speed increases, which is an effective configuration for avoiding an increase in frictional force accompanying an increase in the rotation speed of the polishing machine.
【０００７】また、キャリア材表面に熱硬化性樹脂層を
形成したため、特に段替え時の保管の間に発生していた
錆が著しく減少するか皆無となる。錆によるスクラッチ
不良の低減を図れ、被研磨物の歩留りが向上する。In addition, since the thermosetting resin layer is formed on the surface of the carrier material, rust generated during storage especially at the time of step change is remarkably reduced or eliminated. Scratch defects due to rust can be reduced, and the yield of the object to be polished is improved.
【０００８】キャリア材として選択する金属材料は、Ｓ
Ｋ鋼をはじめ被研磨物の保持に使用できるものであれば
特に限定するものではない。そり・ねじれの抑制と経済
面も考慮して総合的に判断すると、ステンレス鋼の選択
が最も好ましい。熱硬化性樹脂を含浸して保持するシー
ト状基材は、ガラス繊維、アラミド繊維、ポリエステル
繊維などの織布或いは不織布を適宜選択することができ
る。しかし、ガラス繊維基材を使用すると、研磨時にキ
ャリア材から脱落したガラス繊維が研磨系内に入り、こ
れが原因となって、シリコンウエハなど被研磨物にスク
ラッチ不良が発生する心配がある。アラミド繊維やポリ
エステル繊維は、研磨系内に入ってもスクラッチ不良の
原因にはならないので、これらの繊維からなるシート状
基材は好ましいものである。さらに、アラミド繊維から
なるシート状基材は、耐摩耗性を付与する観点から、よ
り好ましい材料である。The metal material selected as the carrier material is S
There is no particular limitation as long as it can be used to hold the object to be polished, including K steel. The selection of stainless steel is the most preferable when comprehensively judged in consideration of the suppression of warpage and twist and the economic aspect. The woven or nonwoven fabric of glass fiber, aramid fiber, polyester fiber, or the like can be appropriately selected as the sheet-like substrate to be impregnated with and held by the thermosetting resin. However, when a glass fiber base material is used, glass fibers that have fallen off from the carrier material during polishing enter the polishing system, which may cause a scratch defect on a polishing object such as a silicon wafer. Since aramid fibers and polyester fibers do not cause scratching failure even if they enter the polishing system, a sheet-like substrate made of these fibers is preferable. Further, a sheet-like substrate made of aramid fiber is a more preferable material from the viewpoint of imparting abrasion resistance.
【０００９】[0009]
【発明の実施の形態】熱硬化性樹脂を含浸したシート状
基材の層を金属板の表面に一体化する操作は、シート状
基材に熱硬化性樹脂を含浸乾燥したプリプレグを金属板
に重ね、加熱加圧成形により実施する。金属板とプリプ
レグの接着強度を高めるために、金属板表面に予めプラ
イマ処理やカップリング剤処理を施すとよい。また、サ
ンドブラスト処理など物理的な粗化処理を金属板表面に
行ない、表面積を増大させることも接着強度を高めるの
に有効である。これら金属板とプリプレグの接着強度を
上げるための処理は、熱硬化性樹脂と金属板の種類、工
程の制約、要求される性能面および経済面を考慮して適
宜選択する。前記の接着強度を高める各種処理は、接着
性に問題を生じなければ省略してもよい。BEST MODE FOR CARRYING OUT THE INVENTION The operation of integrating a sheet-like base material layer impregnated with a thermosetting resin on the surface of a metal plate is performed by forming a prepreg obtained by impregnating the sheet-like base material with a thermosetting resin and drying. It is performed by stacking and heating and pressing. In order to increase the adhesive strength between the metal plate and the prepreg, the surface of the metal plate may be subjected to a primer treatment or a coupling agent treatment in advance. It is also effective to increase the surface area by performing a physical roughening treatment such as sandblasting on the surface of the metal plate to increase the adhesive strength. The treatment for increasing the bonding strength between the metal plate and the prepreg is appropriately selected in consideration of the type of the thermosetting resin and the metal plate, the restriction of the process, the required performance and economy. The above-mentioned various treatments for increasing the adhesive strength may be omitted if there is no problem in the adhesiveness.
【００１０】熱硬化性樹脂は、フェノール樹脂、エポキ
シ樹脂、ポリイミド等を適宜選択する。好ましくは、エ
ポキシ樹脂を選択する。エポキシ樹脂は、ガラス織布基
材エポキシ樹脂積層板からなるキャリア材として、シリ
コンウエハのポリッシング等で実績がある。エポキシ樹
脂にゴム成分などの可撓化成分を加えて変性し、樹脂の
脆さを低減するのも好ましい構成である。フェノール樹
脂、ポリイミド等比較的耐熱性の高い樹脂（ベンゼン核
など接着に直接関与しない分子骨格を高密度で有してい
る樹脂）の選択は、樹脂自体は硬いが金属板との接着性
は比較的低いために、金属板とシート状基材の界面剥離
や熱硬化性樹脂自体の破壊を考慮に入れなければならな
い。As the thermosetting resin, a phenol resin, an epoxy resin, a polyimide or the like is appropriately selected. Preferably, an epoxy resin is selected. Epoxy resin has a proven track record in polishing silicon wafers and the like as a carrier material composed of a glass woven fabric base epoxy resin laminate. It is also preferable to modify the epoxy resin by adding a flexible component such as a rubber component to reduce the brittleness of the resin. Selection of relatively heat-resistant resins such as phenolic resins and polyimides (resins with a high molecular skeleton, such as benzene nuclei, that do not directly participate in adhesion) are compared with the adhesion of the metal plate to the hard resin itself. Because of this, the peeling of the interface between the metal plate and the sheet-like substrate and the destruction of the thermosetting resin itself must be taken into account.
【００１１】プリプレグの製造、プリプレグの金属板表
面への接着は、具体的には、次のように実施する。ロー
ル状に巻かれた長尺のシート状基材を連続的に繰り出
し、熱硬化性樹脂ワニスを含浸乾燥し、樹脂の硬化をＢ
ステージ（半硬化状態）まで進めたプリプレグとする。
次に、所定寸法の金属鈑の片面又は両面にプリプレグを
重ね、これを離形材料で覆って、積層プレスに仕込み、
常法により加熱加圧成形する。成形後に離形材料を剥離
除去する。キャリア材に保持した被研磨物の両面を同時
に研磨する場合は、キャリア材の両面にプリプレグを一
体化する。被研磨物の片面だけを研磨する場合は、キャ
リア材の片面にだけプリプレグを一体化してもよい。The production of the prepreg and the adhesion of the prepreg to the surface of the metal plate are specifically carried out as follows. A long sheet-shaped base material wound in a roll is continuously fed out, and a thermosetting resin varnish is impregnated and dried.
The prepreg is advanced to the stage (semi-cured state).
Next, a prepreg is placed on one side or both sides of a metal plate having a predetermined size, covered with a release material, and charged in a lamination press.
It is heated and pressed by a conventional method. After molding, the release material is peeled off. When simultaneously polishing both surfaces of the object to be polished held by the carrier material, prepregs are integrated on both surfaces of the carrier material. When polishing only one surface of the object to be polished, the prepreg may be integrated only on one surface of the carrier material.
【００１２】[0012]
【実施例】次の４種類の金属板を用意した。これらの金
属板は、いずれも表面をメタノールで脱脂処理した後使
用に供した。 金属板(Ａ)：厚さ０．６mmのＳＫ＃５鋼 金属板(Ｂ)：金属板(Ａ)両表面を４０μｍアルミナ粒子
でサンドブラスト処理 金属板(Ｃ)：厚さ０．６mmのステンレス鋼 金属板(Ｄ)：金属板(Ｃ)両表面を４０μｍアルミナ粒子
でサンドブラスト処理 また、ビスフェノールＡ型エポキシ樹脂に硬化剤ジシア
ンジアミドと硬化促進剤２−エチル−４メチルイミダゾ
ールを配合して、シート状基材に含浸するのためのエポ
キシ樹脂ワニス(Ａ)を調製した。そして、ワニス(Ａ)を
シート基材に含浸乾燥し、次の３種類のプリプレグを用
意した。 プリプレグ(Ａ)：単位重量１０７ｇ／m2のガラス繊維織
布に加熱加圧成形後の厚さが０．１mmになるように含浸 プリプレグ(Ｂ)：単位重量７０ｇ／m2のアラミド繊維不
織布に加熱加圧成形後の厚さが０．１mmになるように含
浸 プリプレグ(Ｃ)：単位重量７０ｇ／m2のポリエステル繊
維不織布に加熱加圧成形後の厚さが０．１mmになるよう
に含浸 さらに、ワニス(Ａ)にダイマー酸変性エポキシ樹脂（可
撓化成分）を、ビスフェノールＡ型エポキシ樹脂／ダイ
マー酸変性エポキシ樹脂＝８０／２０の樹脂固形重量比
で配合しワニス(Ｂ)調製した。そして、ワニス(Ｂ)を単
位重量１０７ｇ／m2のガラス繊維織布に加熱加圧成形後
の厚さが０．１mmになるように含浸乾燥し、プリプレグ
(Ｄ)を用意した。EXAMPLES The following four types of metal plates were prepared. Each of these metal plates was used after degreasing the surface with methanol. Metal plate (A): SK # 5 steel having a thickness of 0.6 mm Metal plate (B): Sand blasting of both surfaces of the metal plate (A) with 40 μm alumina particles Metal plate (C): Stainless steel having a thickness of 0.6 mm Metal plate (D): Both surfaces of the metal plate (C) are sandblasted with 40 μm alumina particles. A bisphenol A type epoxy resin is mixed with a curing agent dicyandiamide and a curing accelerator 2-ethyl-4-methylimidazole to form a sheet-like base. An epoxy resin varnish (A) for impregnating the material was prepared. Then, the varnish (A) was impregnated into the sheet base and dried to prepare the following three types of prepregs. Prepreg (A): Impregnated into a glass fiber woven fabric with a unit weight of 107 g / m 2 so that the thickness after heating and pressing is 0.1 mm. Prepreg (B): Aramid fiber nonwoven fabric with a unit weight of 70 g / m 2 Pre-preg (C): Impregnated in a polyester fiber non-woven fabric with a unit weight of 70 g / m 2 to a thickness of 0.1 mm after heating and pressing. Further, a varnish (B) was prepared by blending a varnish (A) with a dimer acid-modified epoxy resin (flexible component) at a resin solid weight ratio of bisphenol A type epoxy resin / dimer acid-modified epoxy resin = 80/20. Then, the varnish (B) was impregnated and dried on a glass fiber woven fabric having a unit weight of 107 g / m 2 so as to have a thickness of 0.1 mm after heating and pressing, and then prepreg was dried.
(D) was prepared.
【００１３】実施例１ 金属板(Ａ)の両表面にプリプレグ(Ａ)を１枚ずつ配置
し、これを離型フィルムで覆って鏡面板で挟み、常法に
よりプレス熱盤間で加熱加圧成形して厚さ０．８mmのキ
ャリア材を得た。Example 1 A prepreg (A) was placed on both surfaces of a metal plate (A) one by one, covered with a release film, sandwiched between mirror plates, and heated and pressed between press hot plates by a conventional method. It was molded to obtain a 0.8 mm thick carrier material.
【００１４】実施例２ 金属板(Ａ)の代わりに金属板(Ｂ)を使用し、そのほかは
実施例１と同様にして、厚さ０．８mmのキャリア材を得
た。Example 2 A metal material (B) was used in place of the metal plate (A), and the other conditions were the same as in Example 1 to obtain a carrier material having a thickness of 0.8 mm.
【００１５】実施例３ 金属板(Ａ)の代わりに金属板(Ｃ)を使用し、そのほかは
実施例１と同様にして、厚さ０．８mmのキャリア材を得
た。Example 3 A metal material (C) was used in place of the metal plate (A), and the other conditions were the same as in Example 1 to obtain a carrier material having a thickness of 0.8 mm.
【００１６】実施例４ 金属板(Ａ)の代わりに金属板(Ｄ)を使用し、そのほかは
実施例１と同様にして、厚さ０．８mmのキャリア材を得
た。Example 4 A metal material (D) was used in place of the metal plate (A), and the other conditions were the same as in Example 1 to obtain a carrier material having a thickness of 0.8 mm.
【００１７】実施例５ 金属板(Ｄ)の両表面にプリプレグ(Ｂ)を１枚ずつ配置
し、以下実施例１と同様にして、厚さ０．８mmのキャリ
ア材を得た。Example 5 A prepreg (B) was arranged on both surfaces of a metal plate (D) one by one, and a carrier material having a thickness of 0.8 mm was obtained in the same manner as in Example 1.
【００１８】実施例６ 金属板(Ｄ)の両表面にプリプレグ(Ｃ)を１枚ずつ配置
し、以下実施例１と同様にして、厚さ０．８mmのキャリ
ア材を得た。Example 6 A prepreg (C) was placed on both surfaces of a metal plate (D) one by one, and a carrier material having a thickness of 0.8 mm was obtained in the same manner as in Example 1.
【００１９】実施例７ 金属板(Ｄ)の両表面にプリプレグ(Ｄ)を１枚ずつ配置
し、以下実施例１と同様にして、厚さ０．８mmのキャリ
ア材を得た。Example 7 A prepreg (D) was placed on both surfaces of a metal plate (D) one by one, and a carrier material having a thickness of 0.8 mm was obtained in the same manner as in Example 1 below.
【００２０】従来例１ 金属板(Ａ)の厚さを０．８mmとし、金属板(Ａ)だけでキ
ャリア材を構成した。Conventional Example 1 The thickness of the metal plate (A) was set to 0.8 mm, and the carrier material was constituted only by the metal plate (A).
【００２１】従来例２ 金属板(Ｃ)の厚さを０．８mmとし、金属板(Ｃ)だけでキ
ャリア材を構成した。Conventional Example 2 The thickness of the metal plate (C) was set to 0.8 mm, and the carrier material was constituted only by the metal plate (C).
【００２２】以上の実施例、従来例におけるキャリア材
を使用して、シリコンウエハの研磨を行ない、キャリア
材ギア部の摩耗の程度、シリコンウエハのスクラッチ不
良等キャリア材の性能評価を実施した。その結果を表１
に示す。表中、耐摩耗性の評価は、ギア部の摩耗につい
て従来例の評価を１００とした指数（指数が大きいほど
摩耗が少ない）で示した。The silicon wafer was polished by using the carrier material of the above embodiment and the conventional example, and the performance of the carrier material such as the degree of wear of the carrier material gear portion and the scratch defect of the silicon wafer was evaluated. Table 1 shows the results.
Shown in In the table, the abrasion resistance was evaluated by an index (100, the larger the index, the smaller the abrasion) with respect to the evaluation of the conventional example.
【００２３】[0023]
【表１】 [Table 1]
【００２４】[0024]
【発明の効果】表１から明らかなように、本発明に係る
キャリア材は、キャリア材表面と研磨パッド等との摩擦
力が低下することにより、キャリア材ギア部の摩耗を抑
制することができ、キャリア材の使用寿命が延びる。ま
た、保管中に錆を発生しないか錆びにくいので、錆によ
る被研磨物のスクラッチ不良を低減できる。シート状基
材としてアラミド繊維基材を採用すると、摩耗抑制とス
クラッチ不良抑制の効果は一層大きくなる。熱硬化性樹
脂層として可撓化成分を含有したエポキシ樹脂を選択す
ると、上記摩耗の抑制に一層有利である。キャリア材の
金属材料としてステンレス鋼を選択すると、キャリア材
のそり・ねじれを小さくできるので、研磨時のクラッシ
ュなどのトラブルを回避し、被研磨物の品質安定化と製
品歩留り向上に寄与する。As is clear from Table 1, the carrier material according to the present invention can suppress the wear of the carrier material gear portion by reducing the frictional force between the carrier material surface and the polishing pad or the like. The service life of the carrier material is extended. Further, since rust does not occur during storage or is unlikely to rust, scratch defects of the object to be polished due to rust can be reduced. When an aramid fiber base material is adopted as the sheet-like base material, the effects of suppressing abrasion and suppressing scratch defects are further enhanced. When an epoxy resin containing a flexible component is selected as the thermosetting resin layer, it is more advantageous to suppress the abrasion. When stainless steel is selected as the metal material of the carrier material, the warpage and twist of the carrier material can be reduced, so that troubles such as crashes during polishing are avoided, and the quality of the object to be polished is stabilized and the product yield is improved.
Claims (4)
樹脂を含浸したシート状基材の層を一体化してなること
を特徴とする被研磨物保持のためのキャリア材。1. A carrier material for holding an object to be polished, wherein a layer of a sheet-like substrate impregnated with a thermosetting resin is integrated with at least one surface of a metal plate.
する請求項１記載の被研磨物保持のためのキャリア材。2. The carrier material for holding an object to be polished according to claim 1, wherein the metal plate is made of stainless steel.
とを特徴とする請求項１又は２記載の被研磨物保持のた
めのキャリア材。3. The carrier material for holding an object to be polished according to claim 1, wherein the sheet-like substrate is an aramid fiber substrate.
キシ樹脂であることを特徴とする請求項１〜３のいずれ
かに記載の被研磨物保持のためのキャリア材。4. The carrier material according to claim 1, wherein the thermosetting resin is an epoxy resin containing a flexible component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23056997A JPH1158222A (en) | 1997-08-27 | 1997-08-27 | Carrier material to hold polished work |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23056997A JPH1158222A (en) | 1997-08-27 | 1997-08-27 | Carrier material to hold polished work |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1158222A true JPH1158222A (en) | 1999-03-02 |
Family
ID=16909815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23056997A Pending JPH1158222A (en) | 1997-08-27 | 1997-08-27 | Carrier material to hold polished work |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1158222A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010030012A (en) * | 2008-07-31 | 2010-02-12 | Tocalo Co Ltd | Carrier for holding polishing material |
-
1997
- 1997-08-27 JP JP23056997A patent/JPH1158222A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010030012A (en) * | 2008-07-31 | 2010-02-12 | Tocalo Co Ltd | Carrier for holding polishing material |
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