JPH1133895A - Carrier material for holding article to be ground - Google Patents
Carrier material for holding article to be groundInfo
- Publication number
- JPH1133895A JPH1133895A JP19233397A JP19233397A JPH1133895A JP H1133895 A JPH1133895 A JP H1133895A JP 19233397 A JP19233397 A JP 19233397A JP 19233397 A JP19233397 A JP 19233397A JP H1133895 A JPH1133895 A JP H1133895A
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- resin layer
- carrier material
- metal plate
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】シリコンやゲルマニウム等の
半導体ウエハ、液晶ディスプレイガラス、ハードディス
クなどの製造においては、これらの表面を研磨する工程
がある。本発明は、研磨工程で、これら研磨する対象物
(被研磨物)を保持するためのキャリア材に関する。BACKGROUND OF THE INVENTION In the production of semiconductor wafers such as silicon and germanium, liquid crystal display glass, hard disks, etc., there is a step of polishing these surfaces. The present invention relates to a carrier material for holding an object to be polished (an object to be polished) in a polishing step.
【0002】[0002]
【従来の技術】上記各種被研磨物を研磨工程で保持する
キャリア材として、SK鋼などの金属板が使用されてい
る。例えば、シリコンウエハのキャリア材は、SK鋼の
円板の周縁に研磨機のインターナルギア、サンギアと噛
み合うギアを形成し、板面にはシリコンウエハを嵌め込
んで保持するための円形穴を形成したものである。近
年、シリコンウエハなど被研磨物の大型化と一つのキャ
リア材に保持する被研磨物の個数の増加に伴い、キャリ
ア材が大面積化している。このようにキャリア材の面積
を大きくしても、単位面積当たりの研磨圧力は変わらな
いので総加圧力は大きくする必要がある。また、生産性
をより高めるには研磨回転数をより高速にする必要があ
る。2. Description of the Related Art A metal plate such as SK steel is used as a carrier material for holding the above various objects to be polished in a polishing step. For example, a carrier material of a silicon wafer has a gear that meshes with an internal gear and a sun gear of a polishing machine formed on a peripheral edge of a disc of SK steel, and a circular hole for fitting and holding the silicon wafer on a plate surface. Things. 2. Description of the Related Art In recent years, as the size of an object to be polished such as a silicon wafer and the number of objects to be polished held in one carrier material have increased, the area of the carrier material has increased. Thus, even if the area of the carrier material is increased, the polishing pressure per unit area does not change, so that the total pressing force needs to be increased. Further, in order to further increase the productivity, it is necessary to increase the polishing rotation speed.
【0003】[0003]
【発明が解決しようとする課題】キャリア材の大面積化
と研磨回転数の高速化は、被研磨物およびキャリア材の
表面と研磨パッド等との摩擦力を増大させ、キャリア材
ギア部にかかる負荷も増加する。これに伴って、当該ギ
ア部の摩耗・損傷が著しくなり、キャリア材の寿命が短
かくなるという問題がある。また、SK鋼などの金属キ
ャリア材は錆びるという別の問題もある。金属キャリア
材の錆は、研磨時の水や砥粒スラリ中の水が原因である
が、工程変更時(段替え時)に金属キャリア材を一時保
管している間に錆が発生する。この錆が研磨時の異物と
なり、シリコンウエハなどの被研磨物表面にスクラッチ
(微小な傷)が発生する。さらに、SK鋼からなるキャ
リア材は、そり・ねじれが比較的大きいため、被研磨物
をキャリア材へセッティングする際に位置合わせをしず
らかったり、研磨時に被研磨物がキャリア材と研磨定盤
の隙間に潜り込んだりしトラブルを生じるという問題が
ある。The increase in the area of the carrier material and the increase in the number of polishing revolutions increase the frictional force between the surface of the object to be polished and the surface of the carrier material and the polishing pad, etc., and impinge on the carrier gear portion. The load also increases. Along with this, there is a problem that the wear and damage of the gear portion become remarkable, and the life of the carrier material is shortened. Another problem is that metal carrier materials such as SK steel rust. Rust of the metal carrier material is caused by water at the time of polishing or water in the abrasive slurry, but rust is generated during temporary storage of the metal carrier material at the time of a process change (during a step change). This rust becomes foreign matter during polishing, and scratches (small scratches) occur on the surface of the object to be polished such as a silicon wafer. In addition, since the carrier material made of SK steel has a relatively large warp and twist, it is difficult to align the workpiece when setting the workpiece to the carrier material, or the workpiece to be polished between the carrier material and the polishing platen during polishing. There is a problem that a trouble may be caused by sneaking into a gap.
【0004】本発明が解決しようとする第一の課題は、
半導体ウエハなどの被研磨物保持のための金属キャリア
材に関し、研磨パッド等との摩擦力を低下させることに
よりギア部の摩耗を少なくしキャリア材の寿命を延ばす
ことである。また、錆の発生も抑えることである。本発
明が解決しようとする第二の課題は、上記第一の課題に
加えて、キャリア材の材質としてステンレス鋼を選択す
ることにより、そり・ねじれを抑制することである。The first problem to be solved by the present invention is that
With respect to a metal carrier material for holding an object to be polished such as a semiconductor wafer, the frictional force with a polishing pad or the like is reduced to reduce wear of a gear portion and extend the life of the carrier material. It is also to suppress the generation of rust. A second problem to be solved by the present invention is to suppress warpage and twist by selecting stainless steel as the material of the carrier material, in addition to the first problem.
【0005】[0005]
【課題を解決するための手段】上記課題を解決するため
に、本発明に係る被研磨物保持のためのキャリア材は、
金属板の少なくとも片側の表面に熱硬化性樹脂層を形成
したことを特徴とする。表面に熱硬化性樹脂層を形成し
たことにより、キャリア材と研磨パッド等との間の摩擦
力が小さくなり、キャリア材ギア部にかかる負荷が低減
される。この結果、ギア部の摩耗が少なくなり、キャリ
ア材の寿命を延ばすことができる。In order to solve the above problems, a carrier material for holding an object to be polished according to the present invention comprises:
A thermosetting resin layer is formed on at least one surface of the metal plate. By forming the thermosetting resin layer on the surface, the frictional force between the carrier material and the polishing pad or the like is reduced, and the load on the gear portion of the carrier material is reduced. As a result, wear of the gear portion is reduced, and the life of the carrier material can be extended.
【0006】金属の摩擦係数は金属の硬度とせん断強さ
によって決められるが、熱硬化性樹脂など高分子材料の
摩擦係数は、荷重の増大とともに僅かではあるが低下す
る。さらに、熱硬化性樹脂層の表面は、粗面になると摩
擦係数が低下する。このことは、研磨時に砥粒で熱硬化
性樹脂層の表面に微小な凹凸が形成されることにより、
摩擦力は上昇せず、むしろ低下することを意味する。ま
た、摩擦力の速度依存性は、一般に金属より高分子の方
が大きいと言われている。熱硬化性樹脂層の動摩擦係数
は速度が増大すると低下する傾向にあり、研磨機の回転
速度上昇に伴う摩擦力増大を回避する有効な構成とな
る。[0006] The coefficient of friction of a metal is determined by the hardness and shear strength of the metal, but the coefficient of friction of a polymer material such as a thermosetting resin decreases slightly with an increase in load. Furthermore, when the surface of the thermosetting resin layer becomes rough, the friction coefficient decreases. This is due to the formation of fine irregularities on the surface of the thermosetting resin layer with abrasive grains during polishing,
It means that the friction force does not increase, but rather decreases. In addition, it is generally said that a polymer has a higher speed dependency of frictional force than a metal. The coefficient of kinetic friction of the thermosetting resin layer tends to decrease as the speed increases, which is an effective configuration for avoiding an increase in frictional force accompanying an increase in the rotation speed of the polishing machine.
【0007】また、キャリア材表面に熱硬化性樹脂層を
形成したため、特に段替え時の保管の間に発生していた
錆が著しく減少するか皆無となる。錆によるスクラッチ
不良の防止を図れ、被研磨物の歩留りが向上する。本発
明に係る金属キャリア材は、熱硬化性樹脂層にガラス織
布やガラス成分を含まない。研磨時にガラス繊維がキャ
リア材から脱落し研磨系内に入ると、シリコンウエハな
ど被研磨物にスクラッチが発生する心配があるからであ
る。In addition, since the thermosetting resin layer is formed on the surface of the carrier material, rust generated during storage especially at the time of step change is remarkably reduced or eliminated. Scratch defects due to rust can be prevented, and the yield of the object to be polished is improved. The metal carrier material according to the present invention does not include a glass woven fabric or a glass component in the thermosetting resin layer. This is because, when the glass fibers fall off from the carrier material and enter the polishing system during polishing, there is a concern that scratches may be generated on the object to be polished such as a silicon wafer.
【0008】キャリア材として選択する金属材料は、S
K鋼をはじめ被研磨物の保持に使用できるものであれば
特に限定するものではない。そり・ねじれの抑制と経済
面も考慮して総合的に判断すると、ステンレス鋼の選択
が最も好ましい。The metal material selected as the carrier material is S
There is no particular limitation as long as it can be used to hold the object to be polished, including K steel. The selection of stainless steel is the most preferable when comprehensively judged in consideration of the suppression of warpage and twist and the economic aspect.
【0009】[0009]
【発明の実施の形態】キャリア材表面への熱硬化性樹脂
層の形成は接着により実施し、接着強度を高めるため
に、金属板表面に予めプライマ処理やカップリング剤処
理を施すとよい。また、サンドブラスト処理など物理的
な粗化処理を金属板表面に行ない、表面積を増大させる
ことも接着強度を高めるのに有効である。これら金属板
と熱硬化性樹脂層の接着強度を上げるための処理は、熱
硬化性樹脂と金属板の種類、工程の制約、要求される性
能面および経済面を考慮して適宜選択する。前記の接着
強度を高める各種処理は、接着性に問題を生じなければ
省略してもよい。BEST MODE FOR CARRYING OUT THE INVENTION The formation of a thermosetting resin layer on the surface of a carrier material is carried out by adhesion, and the surface of a metal plate may be subjected to a primer treatment or a coupling agent treatment in advance in order to increase the adhesion strength. It is also effective to increase the surface area by performing a physical roughening treatment such as sandblasting on the surface of the metal plate to increase the adhesive strength. The treatment for increasing the adhesive strength between the metal plate and the thermosetting resin layer is appropriately selected in consideration of the type of the thermosetting resin and the metal plate, the restriction of the process, the required performance and the economic aspect. The above-mentioned various treatments for increasing the adhesive strength may be omitted if there is no problem in the adhesiveness.
【0010】金属板の表面に形成する熱硬化性樹脂層の
樹脂は、フェノール樹脂、エポキシ樹脂、ポリイミド等
を適宜選択する。好ましくは、エポキシ樹脂を選択す
る。エポキシ樹脂は、ガラス織布基材エポキシ樹脂積層
板からなるキャリア材として、シリコンウエハのポリッ
シング等で実績がある。エポキシ樹脂にゴム成分などの
可撓化成分を加えて変性し、樹脂の脆さを低減するのも
好ましい構成である。フェノール樹脂、ポリイミド等比
較的耐熱性の高い樹脂(ベンゼン核など接着に直接関与
しない分子骨格を高密度で有している樹脂)の選択は、
樹脂自体は硬いが金属板との接着性は比較的低いため
に、金属板と熱硬化性樹脂層の界面剥離や熱硬化性樹脂
自体の破壊を考慮に入れなければならない。As the resin of the thermosetting resin layer formed on the surface of the metal plate, a phenol resin, an epoxy resin, a polyimide or the like is appropriately selected. Preferably, an epoxy resin is selected. Epoxy resin has a proven track record in polishing silicon wafers and the like as a carrier material composed of a glass woven fabric base epoxy resin laminate. It is also preferable to modify the epoxy resin by adding a flexible component such as a rubber component to reduce the brittleness of the resin. Selection of relatively heat-resistant resins such as phenolic resins and polyimides (resins having a high molecular skeleton such as benzene nuclei that do not directly participate in adhesion)
Since the resin itself is hard, but has relatively low adhesiveness to the metal plate, it is necessary to take into account the delamination of the interface between the metal plate and the thermosetting resin layer and the destruction of the thermosetting resin itself.
【0011】金属板表面に熱硬化性樹脂層を接着する方
法は、具体的には、積層転写、塗布、電着の3種類が上
げられる。形成する熱硬化性樹脂層の厚さは、好ましく
は、10〜200μmである。比較的厚い熱硬化性樹脂
層を金属板表面に工業的に形成するには、積層転写の方
法が好ましい。積層転写の方法は、まず、離形性基材
(ポリプロピレンフィルムなどの樹脂フィルムやアルミ
ニウム箔などの金属箔等)に、エポキシ樹脂など熱硬化
性樹脂を塗布・乾燥し手触乾燥状態(Bステージという
半硬化の状態)にする。次いで、所定寸法の金属板に離
形性基材の樹脂塗布面を対向させて重ね、これを積層プ
レスに仕込み加熱加圧成形する。成形後に離形性基材を
剥離除去し、表面に熱硬化性樹脂層を形成した金属板と
する。The method of bonding the thermosetting resin layer to the surface of the metal plate includes, specifically, three kinds of methods: lamination transfer, coating, and electrodeposition. The thickness of the thermosetting resin layer to be formed is preferably 10 to 200 μm. In order to industrially form a relatively thick thermosetting resin layer on the surface of a metal plate, a stack transfer method is preferable. The method of lamination transfer is as follows. First, a thermosetting resin such as an epoxy resin is applied to a release substrate (a resin film such as a polypropylene film or a metal foil such as an aluminum foil) and dried, and then a touch-dry state (B stage Semi-cured state). Next, the resin-coated surface of the releasable base material is overlaid on a metal plate having a predetermined size, and the resultant is charged into a laminating press and heated and pressed. After molding, the releasable base material is peeled off to obtain a metal plate having a thermosetting resin layer formed on the surface.
【0012】積層転写の方法で、200μmを越える厚
さの熱硬化性樹脂層を形成する場合には、離型性基材に
塗布した熱硬化性樹脂の乾燥状態を、薄い熱硬化性樹脂
層を形成する場合と同じように調整すると、成形時の樹
脂流れの絶対量が多いため板厚が不均一になりやすい。
従って、離型性基材に塗布した熱硬化性樹脂の乾燥状態
は、形成する熱硬化性樹脂層の厚さに応じて適宜調整す
る。金属板表面に形成した熱硬化性樹脂層は、研磨時に
次第に薄くなっていく。最初からあまりに薄いと、早期
に金属表面が露出して摩擦力が上昇する。一方、熱硬化
性樹脂層を厚く形成しようとすると、離型性基材に塗布
した熱硬化性樹脂の乾燥状態を調整しても、成形時の樹
脂の流動不足により熱硬化性樹脂層がかすれたり、反対
に、周辺部の樹脂の流動が著しく周辺部の厚さが薄くな
ったりする。熱硬化性樹脂の乾燥度(硬化度)の調整範
囲が非常に狭まり制御が難しくなる。このような理由か
ら、熱硬化性樹脂層の厚さは、10〜200μmとする
のが好ましい。表面に熱硬化性樹脂層を形成して摩擦力
を小さくしたといえども、キャリア材ギア部は自然摩耗
し、やがては寿命に至る。200μm厚の樹脂層が研磨
で次第に薄くなって金属板表面が露出するより、キャリ
ア材のギア部の自然摩耗の方が早いので、実用上の熱硬
化性樹脂層の厚さは200μmあれば十分である。When a thermosetting resin layer having a thickness of more than 200 μm is formed by the method of lamination transfer, the drying state of the thermosetting resin applied to the release substrate is changed to a thin thermosetting resin layer. When the adjustment is made in the same manner as in the case of forming the sheet, the thickness of the sheet tends to be non-uniform because the absolute amount of the resin flow during molding is large.
Therefore, the drying state of the thermosetting resin applied to the release substrate is appropriately adjusted according to the thickness of the thermosetting resin layer to be formed. The thermosetting resin layer formed on the surface of the metal plate gradually becomes thinner during polishing. If it is too thin from the beginning, the metal surface is exposed early and the frictional force increases. On the other hand, when trying to form a thick thermosetting resin layer, even if the drying state of the thermosetting resin applied to the release substrate is adjusted, the thermosetting resin layer is blurred due to insufficient flow of the resin during molding. On the contrary, the flow of the resin in the peripheral portion is remarkable, and the thickness of the peripheral portion is reduced. The adjustment range of the degree of drying (curing degree) of the thermosetting resin is extremely narrow, and control becomes difficult. For these reasons, the thickness of the thermosetting resin layer is preferably from 10 to 200 μm. Even though a thermosetting resin layer is formed on the surface to reduce the frictional force, the gear portion of the carrier material naturally wears, and eventually reaches the end of its life. Since the natural wear of the gear portion of the carrier material is faster than the 200 μm thick resin layer is gradually thinned by polishing and the metal plate surface is exposed, a practical thermosetting resin layer thickness of 200 μm is sufficient. It is.
【0013】尚、被研磨物保持のためのキャリア材に
は、板厚精度・平坦性が厳しく要求されるが、塗布によ
る熱硬化性樹脂層の形成は、樹脂層の表面平坦性を確保
する上でいささか不利である。また、電着による熱硬化
性樹脂層の形成は、本発明において好ましいとしている
10〜200μmの比較的厚い熱硬化性樹脂層の形成に
は不向きである。キャリア材に保持した被研磨物の両面
を同時に研磨する場合は、キャリア材の両面に熱硬化性
樹脂層を形成する。被研磨物の片面だけを研磨する場合
は、キャリア材の片面にだけ熱硬化性樹脂層を形成して
もよい。A carrier material for holding an object to be polished is required to have strict plate thickness accuracy and flatness. However, forming a thermosetting resin layer by coating ensures the surface flatness of the resin layer. Somewhat disadvantageous above. Further, formation of a thermosetting resin layer by electrodeposition is not suitable for forming a relatively thick thermosetting resin layer having a thickness of 10 to 200 μm which is preferable in the present invention. When simultaneously polishing both surfaces of the object to be polished held by the carrier material, a thermosetting resin layer is formed on both surfaces of the carrier material. When polishing only one surface of the object to be polished, a thermosetting resin layer may be formed only on one surface of the carrier material.
【0014】[0014]
【実施例】次の4種類の金属板を用意した。 金属板(A):厚さ0.6mmのSK#5鋼 金属板(B):金属板(A)両表面を40μmアルミナ粒子
でサンドブラスト処理 金属板(C):厚さ0.6mmのステンレス鋼 金属板(D):金属板(C)両表面を40μmアルミナ粒子
でサンドブラスト処理 ビスフェノールA型エポキシ樹脂に硬化剤ジシアンジア
ミドと硬化促進剤2−エチル−4メチルイミダゾールを
配合して、金属板表面に形成する熱硬化性樹脂層のため
のエポキシ樹脂ワニスを調製した。厚さ50μmのポリ
プロピレンフィルムの片側に前記エポキシ樹脂ワニスを
塗布・乾燥し、種々の厚さのエポキシ樹脂層付ポリプロ
ピレンフィルムを用意した。 ポリプロピレンフィルム(A):エポキシ樹脂層硬化後の
厚さ100μm ポリプロピレンフィルム(B):エポキシ樹脂層硬化後の
厚さ5μm ポリプロピレンフィルム(C):エポキシ樹脂層硬化後の
厚さ10μm ポリプロピレンフィルム(D):エポキシ樹脂層硬化後の
厚さ200μm ポリプロピレンフィルム(E):エポキシ樹脂層硬化後の
厚さ250μm また、フェノール樹脂ワニスを調製し、厚さ50μmの
ポリプロピレンフィルムの片側に前記エポキシ樹脂ワニ
スを塗布・乾燥しフェノール樹脂層付ポリプロピレンフ
ィルムを用意した。 ポリプロピレンフィルム(F):フェノール樹脂層硬化後
の厚さ100μm 上記のエポキシ樹脂ワニスにダイマー酸変性エポキシ樹
脂を、ビスフェノールA型エポキシ樹脂/ダイマー酸変
性エポキシ樹脂=80/20の樹脂固形重量比で配合し
低弾性エポキシ樹脂ワニスを調製した。このワニスを、
厚さ50μmのポリプロピレンフィルムの片側に塗布・
乾燥し低弾性エポキシ樹脂層付ポリプロピレンフィルム
を用意した。 ポリプロピレンフィルム(G):低弾性エポキシ樹脂層硬
化後の厚さ100μm 実施例1 金属板(A)の表面をメタノールで脱脂し、その両表面に
ポリプロピレンフィルム(A)のエポキシ樹脂層側を対向
させて配置し、これを鏡面板に挟みプレス熱盤間で加熱
加圧成形して、金属板(A)の両面に厚さ100μmのエ
ポキシ樹脂層を一体に形成した。このようにして、両表
面がエポキシ樹脂層で被覆された厚さ0.8mmのキャリ
ア材を得た。EXAMPLES The following four types of metal plates were prepared. Metal plate (A): SK # 5 steel having a thickness of 0.6 mm Metal plate (B): Sand blasting of both surfaces of the metal plate (A) with 40 μm alumina particles Metal plate (C): Stainless steel having a thickness of 0.6 mm Metal plate (D): Both surfaces of metal plate (C) are sandblasted with 40 μm alumina particles Bisphenol A type epoxy resin is mixed with curing agent dicyandiamide and curing accelerator 2-ethyl-4-methylimidazole to form on metal plate surface An epoxy resin varnish for a thermosetting resin layer was prepared. The epoxy resin varnish was applied to one side of a 50 μm-thick polypropylene film and dried to prepare polypropylene films with various thicknesses of epoxy resin layers. Polypropylene film (A): 100 μm thickness after curing epoxy resin layer Polypropylene film (B): 5 μm thickness after curing epoxy resin layer Polypropylene film (C): 10 μm thickness after curing epoxy resin layer (D) : 200 μm thick epoxy resin layer after curing Polypropylene film (E): 250 μm thick epoxy resin layer after curing A phenol resin varnish was prepared, and the epoxy resin varnish was applied to one side of a 50 μm thick polypropylene film. After drying, a polypropylene film with a phenolic resin layer was prepared. Polypropylene film (F): 100 μm in thickness after curing of phenol resin layer Dimer acid-modified epoxy resin is mixed with the above epoxy resin varnish at a resin solid weight ratio of bisphenol A type epoxy resin / dimer acid modified epoxy resin = 80/20. Then, a low elasticity epoxy resin varnish was prepared. This varnish,
Coated on one side of a 50 μm thick polypropylene film
It dried and prepared the polypropylene film with a low elasticity epoxy resin layer. Polypropylene film (G): 100 μm thickness after curing of low elasticity epoxy resin layer Example 1 The surface of metal plate (A) is degreased with methanol, and the epoxy resin layer side of polypropylene film (A) is opposed to both surfaces. The metal plate (A) was integrally formed with an epoxy resin layer having a thickness of 100 μm on both sides of the metal plate (A). Thus, a 0.8 mm thick carrier material having both surfaces covered with the epoxy resin layer was obtained.
【0015】実施例2 金属板(A)の代わりに金属板(B)を使用し、そのほかは
実施例1と同様にして、厚さ0.8mmのキャリア材を得
た。Example 2 A metal material (B) was used in place of the metal plate (A), and the other conditions were the same as in Example 1 to obtain a carrier material having a thickness of 0.8 mm.
【0016】実施例3 金属板(A)の代わりに金属板(C)を使用し、そのほかは
実施例1と同様にして、厚さ0.8mmのキャリア材を得
た。Example 3 A metal material (C) was used in place of the metal plate (A), and the other conditions were the same as in Example 1 to obtain a carrier material having a thickness of 0.8 mm.
【0017】実施例4 金属板(A)の代わりに金属板(D)を使用し、そのほかは
実施例1と同様にして、厚さ0.8mmのキャリア材を得
た。Example 4 A metal material (D) was used in place of the metal plate (A), and the other conditions were the same as in Example 1 to obtain a carrier material having a thickness of 0.8 mm.
【0018】実施例5 金属板(D)の厚さを0.6mmから0.4mmに変更した。
表面をメタノールで脱脂し、その両表面にポリプロピレ
ンフィルム(D)のエポキシ樹脂層側を対向させて配置
し、これを鏡面板に挟みプレス熱盤間で加熱加圧成形し
て、金属板(D)の両面に厚さ200μmのエポキシ樹脂
層を一体に形成した。このようにして、両表面がエポキ
シ樹脂層で被覆された厚さ0.8mmのキャリア材を得
た。Example 5 The thickness of the metal plate (D) was changed from 0.6 mm to 0.4 mm.
The surface is degreased with methanol, and the epoxy resin layer side of the polypropylene film (D) is disposed on both surfaces of the metal plate (D) with the epoxy resin layer facing each other. 2), an epoxy resin layer having a thickness of 200 μm was integrally formed on both surfaces. Thus, a 0.8 mm thick carrier material having both surfaces covered with the epoxy resin layer was obtained.
【0019】実施例6 金属板(D)の厚さを0.6mmから0.8mmに変更した。
表面をメタノールで脱脂し、その両表面にポリプロピレ
ンフィルム(C)のエポキシ樹脂層側を対向させて配置
し、これを鏡面板に挟みプレス熱盤間で加熱加圧成形し
て、金属板(D)の両面に厚さ10μmのエポキシ樹脂層
を一体に形成した。このようにして、両表面がエポキシ
樹脂層で被覆された実質的に厚さ0.8mmのキャリア材
を得た。Example 6 The thickness of the metal plate (D) was changed from 0.6 mm to 0.8 mm.
The surface was degreased with methanol, and the epoxy resin layer side of the polypropylene film (C) was placed on both surfaces of the metal plate (D). ), An epoxy resin layer having a thickness of 10 μm was integrally formed on both surfaces. In this way, a carrier material having a thickness of substantially 0.8 mm and having both surfaces covered with the epoxy resin layer was obtained.
【0020】実施例7 ポリプロピレンフィルム(C)の代わりにポリプロピレン
フィルム(B)を使用し、そのほかは実施例6と同様にし
て、実質的に厚さ0.8mmのキャリア材を得た。Example 7 A carrier material having a thickness of substantially 0.8 mm was obtained in the same manner as in Example 6 except that the polypropylene film (B) was used in place of the polypropylene film (C).
【0021】実施例8 金属板(D)の厚さを0.6mmから0.3mmに変更した。
表面をメタノールで脱脂し、その両表面にポリプロピレ
ンフィルム(E)のエポキシ樹脂層側を対向させて配置
し、これを鏡面板に挟みプレス熱盤間で加熱加圧成形し
て、金属板(D)の両面に厚さ250μmのエポキシ樹脂
層を一体に形成した。このようにして、両表面がエポキ
シ樹脂層で被覆された厚さ0.8mmのキャリア材を得
た。Example 8 The thickness of the metal plate (D) was changed from 0.6 mm to 0.3 mm.
The surface is degreased with methanol, and the epoxy resin layer side of the polypropylene film (E) is disposed on both surfaces of the metal plate (D). ), An epoxy resin layer having a thickness of 250 μm was integrally formed on both surfaces. Thus, a 0.8 mm thick carrier material having both surfaces covered with the epoxy resin layer was obtained.
【0022】実施例9 金属板(D)の表面をメタノールで脱脂し、その両表面に
ポリプロピレンフィルム(F)のフェノール樹脂層側を対
向させて配置し、これを鏡面板に挟みプレス熱盤間で加
熱加圧成形して、金属板(D)の両面に厚さ100μmの
フェノール樹脂層を一体に形成した。このようにして、
両表面がフェノール樹脂層で被覆された厚さ0.8mmの
キャリア材を得た。Example 9 The surface of a metal plate (D) was degreased with methanol, and the phenolic resin layer side of a polypropylene film (F) was placed on both surfaces of the metal plate (D) so as to face each other. To form a phenol resin layer having a thickness of 100 μm on both sides of the metal plate (D). In this way,
A 0.8 mm thick carrier material having both surfaces coated with a phenol resin layer was obtained.
【0023】実施例10 金属板(D)の表面をメタノールで脱脂し、その両表面に
ポリプロピレンフィルム(G)の低弾性エポキシ樹脂層側
を対向させて配置し、これを鏡面板に挟みプレス熱盤間
で加熱加圧成形して、金属板(D)の両面に厚さ100μ
mの低弾性エポキシ樹脂層を一体に形成した。このよう
にして、両表面が低弾性エポキシ樹脂層で被覆された厚
さ0.8mmのキャリア材を得た。Example 10 The surface of a metal plate (D) was degreased with methanol, and the low elasticity epoxy resin layer side of a polypropylene film (G) was placed on both surfaces of the metal plate (D) so as to face each other. Heat-press molding between boards, 100μ thickness on both sides of metal plate (D)
m low elasticity epoxy resin layer was integrally formed. Thus, a 0.8 mm thick carrier material having both surfaces covered with the low elasticity epoxy resin layer was obtained.
【0024】従来例 金属板(A)の厚さを0.8mmとし、金属板(A)だけでキ
ャリア材を構成した。Conventional Example The thickness of the metal plate (A) was 0.8 mm, and the carrier material was constituted only by the metal plate (A).
【0025】以上の実施例、従来例におけるキャリア材
を使用して、シリコンウエハの研磨を行ない、キャリア
材ギア部の摩耗の程度、シリコンウエハのスクラッチ不
良等キャリア材の性能評価を実施した。その結果を表1
に示す。評価の方法、基準等は以下のとおりである。 外観 目視による評価 ○:異常なし △:一部かすれ 板厚精度 最大値と最小値の差 接着強度 鉛筆硬度試験 摩耗性 ギア部および被研磨物の保持穴の摩耗について
従来例の評価を100とした指数(指数が大きいほど摩
耗が小さい) 経済性 ○:コスト安価 △:コスト高価The silicon wafer was polished by using the carrier material of the above embodiment and the conventional example, and the performance of the carrier material such as the degree of wear of the carrier material gear portion and the scratch defect of the silicon wafer was evaluated. Table 1 shows the results.
Shown in The evaluation method and criteria are as follows. Appearance Visual evaluation ○: No abnormality △: Partial blurring Thickness accuracy Difference between maximum and minimum values Adhesive strength Pencil hardness test Abrasion Abrasion of the gear and the holding hole of the object to be polished was evaluated as 100 in the conventional example. Index (The larger the index, the smaller the wear) Economics ○: Low cost △: High cost
【0026】[0026]
【表1】 [Table 1]
【0027】[0027]
【発明の効果】表1から明かなように、本発明に係る金
属キャリア材は、キャリア材表面と研磨パッドとの摩擦
力が低下することにより、キャリア材ギア部や被研磨物
を嵌め込む穴端面の摩耗を抑制することができ、キャリ
ア材の使用寿命が延びる。また、保管中に錆びを発生し
ないか錆びにくいので、錆による被研磨物のスクラッチ
不良を低減できる。キャリア材の金属材料としてステン
レス鋼を選択すると、キャリア材のそり・ねじれを小さ
くできるので、研磨時のクラッシュなどのトラブルを回
避し、被研磨物の品質安定化と製品歩留り向上に寄与す
る。熱硬化性樹脂層としてエポキシ樹脂を選択すると、
上記摩耗の抑制に一層有利であり、樹脂層の厚さを10
〜200μmの間で設定すると摩耗抑制効果が大きい。
低弾性のエポキシ樹脂を選択すれば、さらに摩耗抑制の
効果が顕著になるAs is clear from Table 1, the metal carrier material according to the present invention has a hole in which the gear portion of the carrier material and the object to be polished are fitted because the frictional force between the surface of the carrier material and the polishing pad is reduced. Wear of the end face can be suppressed, and the service life of the carrier material is extended. In addition, since rust does not occur during storage or is unlikely to rust, scratch defects of the object to be polished due to rust can be reduced. When stainless steel is selected as the metal material of the carrier material, the warpage and twist of the carrier material can be reduced, so that troubles such as crashes during polishing are avoided, and the quality of the object to be polished is stabilized and the product yield is improved. When epoxy resin is selected as the thermosetting resin layer,
It is more advantageous for suppressing the above-mentioned abrasion.
If it is set between 200 and 200 μm, the wear suppressing effect is large.
If a low-elasticity epoxy resin is selected, the effect of suppressing abrasion becomes more pronounced.
Claims (4)
樹脂層を形成したことを特徴とする被研磨物保持のため
のキャリア材。1. A carrier material for holding an object to be polished, wherein a thermosetting resin layer is formed on at least one surface of a metal plate.
する請求項1記載の被研磨物保持のためのキャリア材。2. The carrier material for holding an object to be polished according to claim 1, wherein the metal plate is made of stainless steel.
のエポキシ樹脂層であることを特徴とする請求項1又は
2記載の被研磨物保持のためのキャリア材。3. The thermosetting resin layer has a thickness of 10 to 200 μm.
3. The carrier material for holding an object to be polished according to claim 1, wherein the carrier material is an epoxy resin layer.
とを特徴とする請求項3記載の被研磨物保持のためのキ
ャリア材。4. The carrier material for holding an object to be polished according to claim 3, wherein the epoxy resin layer contains a flexible component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19233397A JPH1133895A (en) | 1997-07-17 | 1997-07-17 | Carrier material for holding article to be ground |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19233397A JPH1133895A (en) | 1997-07-17 | 1997-07-17 | Carrier material for holding article to be ground |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH1133895A true JPH1133895A (en) | 1999-02-09 |
Family
ID=16289548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19233397A Pending JPH1133895A (en) | 1997-07-17 | 1997-07-17 | Carrier material for holding article to be ground |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH1133895A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009099980A (en) * | 2007-10-17 | 2009-05-07 | Siltronic Ag | Carrier, method for coating carrier and machining method for simultaneously removing materials of both surfaces of semiconductor wafer |
JP2010510083A (en) * | 2006-11-21 | 2010-04-02 | スリーエム イノベイティブ プロパティズ カンパニー | Lapping carrier and lapping method |
-
1997
- 1997-07-17 JP JP19233397A patent/JPH1133895A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010510083A (en) * | 2006-11-21 | 2010-04-02 | スリーエム イノベイティブ プロパティズ カンパニー | Lapping carrier and lapping method |
US8795033B2 (en) | 2006-11-21 | 2014-08-05 | 3M Innovative Properties Company | Lapping carrier and method |
KR101494912B1 (en) * | 2006-11-21 | 2015-02-23 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Lapping Carrier and Method |
JP2009099980A (en) * | 2007-10-17 | 2009-05-07 | Siltronic Ag | Carrier, method for coating carrier and machining method for simultaneously removing materials of both surfaces of semiconductor wafer |
US9539695B2 (en) | 2007-10-17 | 2017-01-10 | Siltronic Ag | Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers |
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