JPH1148342A - Manufacture of micromachine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a micromachine without requiring a lone-time for assembling even the micromachine having three- dimensional structure. SOLUTION: The micromachine is disassembled to micro-miniaturized components 10, 20, 30, 50 of first to N-th layers manufactured by photolithographic technology with respect to its height direction, and the disassembled components are formed on first to N-th boards. The board having the component of the first layer and the board having the component of the second layer are opposed to one another to butt connect the component of the first layer to the component of the second layer. And, the butt connection is repeated until the component of the N-th layer is butted to that of the (N-1)-th layer. For the components of the second and following layers, the component is formed on the board via a first film removable by solvent, and separation from the board after the butting is executed by solvent.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a micromachine having a fine and three-dimensional structure by applying a photolithography technique which is a basic technique of an IC manufacturing process.

[0002]

2. Description of the Related Art As an example of a method for manufacturing a micromachine, there is a method in which a micromachine is divided into a plurality of parts in a height direction thereof, and the formed parts are manually assembled using pins.

FIG. 17 shows an assembling process when a micro heat exchanger including a plurality of fins is manufactured. Four positioning pins 101 are erected on the substrate 100. The plurality of fins 102 are separately formed in advance by a photolithography technique. At that time, each fin 102 corresponds to the four pins 101,
Four through holes 102a for positioning are provided. The assembling is performed by grasping the fin 102 with a jig such as tweezers while observing with a microscope and inserting the pin 10
Stack by passing through one.

[0004]

The method of assembling manually as described above is suitable for manufacturing a micromachine having a complicated structure, but has a problem that it takes a lot of time for assembling.

It is an object of the present invention to provide a method for manufacturing a micromachine having a three-dimensional structure, which does not require a long time for assembly.

Another object of the present invention is to provide a method for manufacturing a micromachine suitable for mass production.

[0007]

SUMMARY OF THE INVENTION According to the present invention, a micromachine is decomposed into first to Nth layer microparts which can be manufactured by photolithography in the height direction, and each of the decomposed microparts is subjected to photolithography. Formed on the first to Nth substrates by a lithography technique, the substrate having the first-layer microparts and the substrate having the second-layer microparts are opposed to each other to form the first-layer microparts. A method of manufacturing a micromachine by butt-joining the microparts of the second layer and repeating this butt-joining until the microparts of the Nth layer are butted against the microparts of the (N-1) th layer; The micro parts of the second and subsequent layers are formed on the substrate via the first film which can be removed by a solvent, so Wherein the separation from the substrate after Align was performed by running the removal step of the first film by the solvent.

[0008] The microparts of the first layer are formed on the first substrate via a second film that can be removed by a solvent different from the solvent, so that the microparts of the first layer are removed from the first layer. After the combination of all the micro parts of the N-th layer, it is preferable to perform the separation from the first substrate with the different solvent.

[0009] At least one hole through which the assembling pin can be inserted in the formation step by the photolithography technique is provided at each of the opposing portions of the microparts of the layer that is abutted against each other. By attaching the micro-part to one of the holes of the micro-part, the two-layer micro-part joined by the assembling pin can be joined.

In particular, the assembling pins are erected on another substrate in advance via a film which can be removed by the solvent, and the another substrate is brought into contact with the micropart having the hole, so that the micro pins are formed. It is preferable that the assembling pins are mounted in the holes of the part, and the assembling pins are separated from the another substrate by the solvent after the mounting.

The joining of the two layers of microparts which are brought into contact with each other may be performed by brazing or anodic bonding.

Further, through holes are provided at opposing portions of the two substrates abutting each other, and at the time of assembling, positioning is performed by inserting clamp pins into these through holes, and the clamp pins are provided. It is preferable to apply a tightening force between the microparts on the two substrates brought into contact with each other via the substrate.

According to the present invention, a plurality of micro parts of the first layer to the N-th layer are formed on the first to N-th substrates, respectively, so that the same number of micro machines are formed. It can be manufactured at the same time.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. Here, a case of manufacturing a micro machine including a gear and a casing will be described. Referring to FIGS. 1A and 1B, a bottom casing 10 as a first-layer micropart is formed on a first substrate A via a film 9 that can be removed by a solvent. The bottom casing 10 has a gear bearing hole 11 at the center of the bottomed tubular body, and four tubular holes 12 for assembling pin fitting in the tubular portion. The diameter of the hole 12 is such that the assembling pin fits slightly tight. The manufacturing process of such a bottom casing 10 will be described later.

Next, as shown in FIG. 2, another substrate B having four assembling pins 13 erected at a location corresponding to the assembling pin fitting hole 12 is prepared. Although this manufacturing process will be described later, the assembling pins 13 are erected on the substrate B via a film 14 that can be removed with a solvent different from the solvent described in FIG. In FIG. 2, with respect to the first board A of FIG. 1A, the board B is positioned downward so that the assembling pins 13 can be fitted into the holes 12 of the bottom casing 10, and the board B is gradually lowered. Then, the assembling pins 13 are fitted into the holes 13. Next, using a solvent, a film 14 interposed between the substrate B and the assembling pins 13 is formed.
Is removed to separate the assembling pins 13 from the substrate B. Thus, the reason why the solvent for removing the film 9 and the film 14 is different is that only the assembling pins 13 are separated from the substrate B.

A plurality of clamp pins 15 are used for positioning the substrate B. The clamp pin 15
Although shown in a simplified manner, the threads are cut off.
Screw holes into which the clamp pins 15 can be screwed are formed at positions corresponding to each other on the first substrate A and the substrate B,
The substrate B passing through the clamp pins 15 is opposed to the fixed first substrate A, and the positioning is performed by passing the clamp pins 15 protruding from the substrate B through the screw holes of the first substrate A. Further, a predetermined tightening force is applied between the first substrate A and the substrate B by rotating the clamp pin 15,
The assembling pin 13 is fitted into the tight hole 12. Next, the assembly pins 13 are separated from the substrate B by removing the film 14 of the substrate B with a solvent. FIG. 3 shows the bottom casing 10 on the first substrate A thus obtained.

Next, as shown in FIG. 4, a second substrate C in which the middle casing 20 and the gear 30 are integrally formed through a film 16 made of the same material as the film 14 in a manufacturing process described later.
Prepare The middle casing 20 includes the bottom casing 1.
0 has the same inner diameter and outer diameter as the cylindrical portion, and four upper and lower holes 22 for assembling pin fitting are provided. On the other hand, the gear 30 is composed of the gear portion 31 and the bottom casing 1.
And a shaft portion 32 that can be inserted into the center bearing hole 11 of the shaft 0. The middle casing 20 and the gear 30 form the second layer of microparts.

In FIG. 5, the second substrate C is turned downward, the positioning is performed using the clamp pins 15 in the same manner as in FIG. 2, the shaft portion 32 is fitted into the bearing hole 11, and the assembling pins are formed. 13 is fitted into the lower hole 22 of the middle casing 20 to provide a tightening force, and the film 16 is removed by a solvent.

FIG. 6 is a cross-sectional view and a plan view of the intermediate obtained through the process of FIG.

Referring to FIG. 7, as in FIG. 2, assembling pins 41 are formed on a portion corresponding to assembling pin fitting holes 22 formed on the upper side of middle casing 20, and film 17 of the same material as film 14 is formed. Then, another substrate D, which is erected four times, is prepared. Then, the assembling pins 41 are fitted into the holes 22 using the clamp pins 15. Next, the assembling pins 41 are separated from the substrate D by removing the film 17 of the substrate D with a solvent. The bottom casing 10, the middle casing 20, and the gear 3 on the first substrate A thus obtained.
0 is shown in FIG.

Referring to FIG. 9, a third substrate E on which an upper casing 50 as a third-layer micropart is formed through a film 18 made of the same material as the film 14 by a manufacturing process described later. I do. The upper casing 50 is a cylindrical body having a bottom, and an assembling pin 4 is provided below the cylindrical portion.
It has four holes 51 for one fitting. With the third substrate E facing downward, positioning is performed using the clamp pins 15 in the same manner as in FIG. 5, the assembling pins 41 are fitted into the holes 51 of the cylindrical portion of the upper casing 50, and a tightening force is applied. The film 18 is removed with a solvent.

In this manner, as shown in FIG. 10, the bottom casing 10, the middle casing 20, and the upper casing 50 are integrally combined by the plurality of assembling pins 13 and 41, respectively, and the shaft 32 Is fitted in the bearing hole 11 of the bottom casing 10 to obtain a micromachine comprising a gear in which the gear 30 is accommodated and the casing.

As is apparent from the above description, the present invention is characterized in that two or more substrates are opposed to each other, positioned in units of substrates, and assembled in a micromachine manufacturing process. The prior art is not suitable for mass production because it is a method in which micro parts are individually formed on a substrate and then removed and individually assembled manually. On the other hand, in the present invention, mass production is made possible by incorporating assembling by positioning in units of substrates into a process.

Next, the steps of manufacturing the microparts in each of the above steps will be described. First, a step of forming the bottom casing 10 on the substrate A described in FIG. 1 will be described with reference to FIG. In the bottom casing 10, a bottom plate portion 10-1 of a bottomed tubular portion is formed first, and a tubular portion 10-2 is formed thereon. Bottom plate part 10-1
Has a hole 11 for a bearing at the center, and has a cylindrical portion 10-2.
Are four assembling pins 1 at 90 degree intervals.
It has three holes 12. Note that gold, titanium, beryllium, or the like is used as a material for all the substrates in this embodiment. For example, a polysilicon film is used as the film 9, and KOH is used as a solvent for the film 9.
An SiO ₂ film is used as 7 and 18, and HF is used as the solvent.
Is used.

In FIG. 11A, a film 9 is formed on a substrate A.
Is formed. In FIG. 11B, a resist material R1 is applied on the film 9. And the bottom plate portion 10 of the bottomed cylindrical portion
Exposure is performed through a mask M1 having a transmission pattern corresponding to -1. Further, the resist material in the exposed area is removed, and as shown in FIG. 11C, a bottom plate portion 10-1 is formed in the removed area by a method such as electroforming. Thereafter, when the resist material R1 is removed, a bottom plate portion 10-1 as shown in FIG. 11D can be formed.

Next, in FIG. 11E, a resist material R2 is applied on the film 9 and the bottom plate portion 10-1 and is exposed through a mask M2 having a transmission pattern corresponding to the cylindrical portion of the bottomed cylindrical portion. I do. Further, the resist material in the exposed area is removed, and as shown in FIG. 11 (f), a cylinder having a hole 12 by a method such as electroforming on the removed area, that is, on the periphery of the bottom plate portion 10-1. Form the portion 10-2. After that, when the resist material R2 is removed, as shown in FIG. 11G, the bottom casing 10 in which the cylindrical portion 10-2 is integrated on the bottom plate portion 10-1 can be formed. In FIG. 11E, for convenience, a mask having only a light-shielding portion for forming the hole 12 and the cylindrical portion 10-2 are shown.
And a mask having a transparent portion for use as a mask M2.

FIG. 12 shows a manufacturing process of the substrate B on which the four assembling pins 13 shown in FIG. 2 are erected. In FIG. 12A, a film 14 is formed on a substrate B. Next, in FIG. 12B, four assembling pins 13 are erected on the film 14 by bonding or the like. In this case, the material of the assembling pin 13 is preferably a metal. Of course, the assembling pins 13 can also be formed by electroforming in the same manner as described with reference to FIG.

With reference to FIG. 13, a description will be given of a manufacturing process of the substrate C in which the middle casing 20 and the gear 30 described in FIG. 4 are integrally formed. In FIG. 13A, the substrate C
A film 16 is formed thereon. In FIG. 13B, in the same manner as described with reference to FIGS. 11B, 11C, and 11D, one part of the middle casing 20 up to the height corresponding to the depth of the lower hole 22 is shown. Gear section 3 up to the same height as section 20-1
One part 31-1 is formed.

Next, in FIG. 13 (c), the remaining portion 31-2 of the gear portion 31 is formed on the portion 31-1 of the gear portion 31 by the same method. The second portion 20-2 is also formed on the portion 20-1 to the same height.

Further, in FIG. 13D, the remaining portion 20-3 of the middle casing 20 is formed on the second portion 20-2 of the middle casing 20, and the shaft portion of the gear 30 reaches the same height. A part 32-1 of 32 is formed.

In FIG. 13E, the remaining portion 32-2 is formed on the portion 32-1 of the shaft portion 32.

Referring to FIG. 14, substrate E described with reference to FIG.
Next, a process of forming the upper casing 50 will be described. The upper casing 50 does not need to form the bearing hole 11 in the bottom casing 10 except that
It can be formed in exactly the same way as the bottom casing 10. That is, first, the bottom plate portion 5 of the bottomed cylindrical portion
0-1 is formed, and a cylindrical portion 50-2 is formed thereon. The cylindrical portion 50-2 has four holes 51 for the assembling pins 41 at an angular interval of 90 degrees.

In FIG. 14A, a film 1 is formed on a substrate E.
8 is formed, and in FIG.
-1 is formed. Subsequently, a cylindrical portion 50-2 having the hole 12 is formed on the peripheral edge of the bottom plate portion 50-1.

FIG. 15 shows another example of the micropart forming step shown in FIG. In this example, there is a step S between the upper end of the middle casing 20 and the upper end of the gear 30. In order to form such a gear 30, in the process described with reference to FIG. 13, the stepped microparts are assembled by interposing a film 14 'thicker than the film 14 between the gear portion 31 and the substrate C. be able to.

FIG. 16 schematically shows an example in which a plurality of the aforementioned micromachines are manufactured simultaneously. For example, in the steps of FIGS. 1 to 6, a plurality of microparts described above are respectively provided on the substrate A and the substrate C (in FIG. 16,
Obviously, by forming one each in the regions P and P '(16 in total), it is possible to simultaneously manufacture the same number of micromachines as the plurality.

In the above description, assemble pins are used to join two microparts by abutting each other. However, other joining methods, for example, well-known soldering and anodic joining can also be used. For example, when performing anodic bonding in the steps of FIGS. 1 to 6, the formation of holes for assembling pins is omitted, and the steps of FIGS. 2 and 3 are omitted. As in the state, the anodic bonding can be performed by positioning the substrate C.

[0037]

According to the present invention, two or more substrates are opposed to each other in the micro-machine manufacturing process, are positioned in units of substrates, and are assembled.
The mass production becomes possible by incorporating the assembly by positioning in the unit of the substrate into the process. Moreover, even a micromachine having a three-dimensional structure does not require a long time for assembly.

[Brief description of the drawings]

FIG. 1 is a view for explaining a step of preparing a bottom casing in a method for manufacturing a micromachine according to the present invention, wherein FIG. 1 (a) is a longitudinal sectional view and FIG. 1 (b) is a plan view.

FIG. 2 is a longitudinal sectional view for explaining a process of assembling an assembling pin to a bottom casing shown in FIG. 1;

FIG. 3 is a longitudinal sectional view showing a state where an assembling pin is assembled to a bottom casing by the process of FIG. 2;

FIG. 4 is a longitudinal sectional view for explaining a step of preparing a middle casing and a gear in the method for manufacturing a micromachine according to the present invention.

FIG. 5 is a longitudinal sectional view for explaining a process of assembling the middle casing and the gear shown in FIG. 4 to the bottom casing shown in FIG. 3;

6 is a view showing a state in which the middle casing and the gear are assembled to the bottom casing by the process of FIG. 2; FIG. 6 (a) is a longitudinal sectional view, and FIG. 6 (b) is a plan view.

FIG. 7 is a longitudinal sectional view for explaining a step of assembling the assembling pins to the middle casing shown in FIG. 6;

FIG. 8 is a longitudinal sectional view showing a state where the assembling pins are assembled to the middle casing by the process of FIG. 7;

9 is a longitudinal sectional view for explaining a step of assembling the upper casing to the middle casing shown in FIG.

FIG. 10 is a longitudinal sectional view showing a state where the upper casing is assembled to the middle casing by the process of FIG. 9;

FIG. 11 is a longitudinal sectional view for explaining a manufacturing process of the bottom casing shown in FIG. 1;

FIG. 12 is a longitudinal sectional view for explaining an assembling pin installation process shown in FIG. 2;

FIG. 13 is a longitudinal sectional view for explaining a manufacturing process of the middle casing shown in FIG. 4;

FIG. 14 is a longitudinal sectional view for explaining a manufacturing process of the upper casing shown in FIG. 9;

FIG. 15 is a longitudinal sectional view for explaining an assembling process in a case where there is a step between the upper end of the middle casing and the upper end of the gear shown in FIG. 6;

FIG. 16 is a view schematically showing a method for simultaneously manufacturing a plurality of micromachines.

FIG. 17 is a perspective view for explaining a conventional method for manufacturing a micromachine.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Bottom casing 11 Bearing hole 12, 22, 51 Hole for assembling pin 13, 41 Assembling pin 14, 16, 17, 18 Membrane 15 Clamp pin 20 Middle casing 30 Gear 31 Gear part 32 Shaft part 50 Upper casing

Claims (7)

[Claims] 1. A first layer to an N-th layer capable of manufacturing a micromachine in a height direction by a photolithography technique.
The microparts of the first layer are formed on the first to Nth substrates by a photolithography technique, and the microparts of the second layer and the microparts of the second layer are formed. The first layer of microparts and the second layer of microparts are butt-joined to each other with the substrates having the microstructures facing each other. It is a method of manufacturing a micro machine by repeating until it is abutted against a part, wherein the micro parts of the second layer and thereafter are formed on a substrate via a first film that can be removed by a solvent,
A method for manufacturing a micromachine, wherein the separation from the substrate after the butting is performed by executing a step of removing the first film with the solvent. 2. The method for manufacturing a micro machine according to claim 1, wherein the micro parts of the first layer are:
By forming on the first substrate via a second film removable by a solvent different from the solvent,
A method for manufacturing a micromachine, comprising: separating the first substrate from the first substrate with the different solvent after combining all the microparts of the layer from the Nth layer. 3. The method for manufacturing a micromachine according to claim 2, wherein at least one hole through which the assembling pin can be inserted in the forming step by the photolithography technique is provided at each of the opposing portions of the microparts of the layers that abut each other. The micro machine according to claim 1, wherein the assembling pins are attached to one of the holes of the microparts that are abutted with each other, thereby joining the two parts of the microparts abutted by the assembling pins. Production method. 4. The method for manufacturing a micromachine according to claim 3, wherein the assembling pins are erected on another substrate in advance via a film removable by the solvent.
By attaching the another substrate to the micropart having the hole, mounting of the assembling pin to the hole in the micropart is performed, and after the mounting, the assembling pin is separated from the another substrate by the solvent. A method for manufacturing a micromachine. 5. The method for manufacturing a micromachine according to claim 2, wherein the microparts of the two layers abutting each other are joined by brazing or anodic bonding. 6. The method for manufacturing a micromachine according to claim 4, wherein through holes are provided at mutually opposing portions of the two substrates abutting each other, and a clamp pin is formed in these through holes at the time of abutting. And a clamping force is applied between the microparts on the two substrates brought into contact with each other through the clamp pins. 7. The method for manufacturing a micromachine according to claim 1, wherein a plurality of the micro parts of the first to Nth layers are formed on the first to Nth substrates, respectively. A method of manufacturing a micromachine, wherein a number of micromachines equal to the plurality can be simultaneously manufactured.