JPH1148141A - Dressing device of slicing machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To automatically carry out dressing of an inner peripheral blade without manual operation. SOLUTION: A dressing stone 30 is held free to horizontally and vertically move against an inner peripheral blade. In the case where an overall knife edge of the inner peripheral blade 14 is to be dressed dressing is carried out by horizontally extracting the dressing stone 30 after making it horizontally cut into a knife edge 14A of the inner peripheral blade 14. In the case where an upper surface and a lower surface of the knife edge 14A are to be dressed, dressing is carried out by extracting the dressing stone 30 diagonally downward for dressing the upper surface or diagonally upward for dressing the lower surface after making it horizontally cut into the knife edge 14A of the inner peripheral blade 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dressing apparatus for a slicing machine, and more particularly to a dressing apparatus for a slicing machine that cuts an ingot of a brittle material such as silicon, glass, and ceramic into wafers.

[0002]

2. Description of the Related Art An inner peripheral blade used in a slicing machine is formed by electrodepositing diamond abrasive grains on an inner peripheral portion of a donut-shaped thin plate. This inner peripheral blade is
As the cutting is repeated, sludge (cut powder of the ingot) accumulates on the surface of the cutting edge and the abrasive grains are buried, or the abrasive grains are worn by the cutting, and the cutting ability is reduced. When the workpiece is cut by the inner peripheral blade with reduced cutting ability, the cutting resistance of the workpiece increases, so that the inner peripheral blade is largely displaced along the axial direction, and as a result, the warpage is reduced. Large wafers are cut.

For this reason, it is necessary to periodically dress the cutting edge of the inner peripheral blade. Conventionally, dressing is performed by the following method. The first method is a dressing method called so-called hand dressing. This dressing method is a dressing method in which an operator directly holds a dressing stone by hand, and dresses the cutting edge by pressing the dressing stone against the cutting edge of a rotating inner peripheral blade. In this case, the operator determines the pressing angle and pressing force of the dressing stone against the cutting edge,
Select and adjust the dressing part and dressing amount.

[0004] A second method is a dressing method called so-called table dressing. In this dressing method, a dressing stone is attached to moving means (usually, a cutting feed table for a workpiece) that moves in a horizontal direction with respect to the inner peripheral blade, and the attached dressing stone is directed toward the rotating inner peripheral blade. And the cutting edge is dressed by cutting horizontally with the inner peripheral blade.

[0005]

However, the first method described above has a drawback in that it largely depends on the skill of the operator, so that variations occur, and accurate dressing is not always guaranteed. Further, since the operator must work while approaching the rotating inner peripheral blade, there is also a problem in terms of safety.

On the other hand, the second method has no problem in terms of safety and the like, but the cutting edge can be dressed only once for each dressing stone feed. Each time, the operator must shift the mounting position of the dressing stone downward, which is troublesome. In addition, both methods involve the work of an operator, which requires a long working time, which causes a problem that productivity is reduced.

The present invention has been made in view of such circumstances, and has as its object to provide a dressing apparatus for a slicing machine that can automatically dress the inner peripheral blade without manual intervention.

[0008]

The invention according to claim 1 is a dressing apparatus of a slicing machine for cutting a workpiece into a wafer by a rotating inner peripheral blade, wherein a dressing stone is applied to the inner peripheral blade. A holder that holds the holder at right angles, and a horizontal moving unit that moves the holder in a horizontal direction with respect to the inner peripheral blade,
Vertical moving means for moving the holder in the vertical direction with respect to the inner peripheral blade, and control means for controlling the driving of the horizontal moving means and the vertical moving means, wherein the control means By driving the means, after cutting the cutting edge of the inner peripheral blade horizontally in the dressing stone by a predetermined amount, drive the horizontal moving means,
A step of dressing the entire edge of the inner peripheral blade by horizontally pulling out the dressing stone from the edge, and driving the horizontal moving means to move the edge of the inner peripheral blade into the dressing stone by a predetermined amount; After being cut horizontally, simultaneously driving the horizontal moving means and the vertical drive means, dressing the dressing stone obliquely downward from the cutting edge to dress the upper surface of the cutting edge of the inner peripheral blade, After driving the horizontal moving means to cut the cutting edge of the inner peripheral blade horizontally into the dressing stone by a predetermined amount, the horizontal moving means and the vertical driving means are simultaneously driven to remove the dressing stone. By pulling out diagonally upward from the cutting edge, the lower surface of the cutting edge of the inner peripheral blade is closed. Characterized by at least one step of the process of ashing.

According to the present invention, the entire edge of the inner peripheral blade, the upper surface of the edge, and the lower surface of the edge can be automatically dressed by selection. That is, when dressing the entire cutting edge, the cutting edge of the inner peripheral blade is horizontally cut into the dressing stone by a predetermined amount, and then the dressing stone is pulled out horizontally from the cutting edge. Also, when dressing the upper surface of the cutting edge, after cutting the cutting edge of the inner peripheral blade horizontally into the dressing stone by a predetermined amount,
Pull the dressing stone diagonally downward from the cutting edge.
When dressing the lower surface of the cutting edge, the cutting edge of the inner peripheral blade is cut horizontally by a predetermined amount into the dressing stone, and then the dressing stone is pulled obliquely upward from the cutting edge.

According to a second aspect of the present invention, there is provided a dressing apparatus for a slicing machine which cuts a workpiece into wafers by rotating an inner peripheral blade for rotating a workpiece. A holder that holds the blade so as to be orthogonal to the blade, horizontal moving means that moves the holder in a horizontal direction with respect to the inner peripheral blade, and moves the holder in a direction that is perpendicular to the inner peripheral blade. Vertical moving means, a blade sensor for detecting the displacement of the inner peripheral blade during cutting of the workpiece, and driving the horizontal moving means and the vertical moving means based on displacement information of the inner peripheral blade. Control means for controlling, wherein the control means displaces the inner peripheral blade above a predetermined upper limit value of the displacement. After cutting the wafer, the horizontal moving means is driven to cut the cutting edge of the inner peripheral blade horizontally into the dressing stone by a predetermined amount, and then the horizontal moving means and the vertical driving means are simultaneously driven. When the dressing stone is pulled obliquely upward from the cutting edge, the lower surface of the cutting edge of the inner peripheral blade is dressed, and when the inner peripheral blade is displaced below a preset lower limit of displacement, After cutting the wafer, the horizontal moving means is driven to cut the edge of the inner peripheral blade horizontally into the dressing stone by a predetermined amount, and then the horizontal moving means and the vertical driving means are simultaneously driven. Pulling the dressing stone obliquely downward from the cutting edge, and dressing the upper surface of the cutting edge of the inner peripheral blade. Characterized in that it.

According to the present invention, the control means determines the necessity of dressing of the cutting edge from the amount of displacement of the inner peripheral blade during cutting of the workpiece detected by the blade sensor, and automatically performs the dressing. Do. That is, when the inner peripheral blade is displaced above the preset upper limit of the displacement, after cutting the wafer, the lower edge of the inner peripheral blade is dressed by the above method. Then, when the inner peripheral blade is displaced below the preset lower limit of the displacement, after cutting the wafer, the upper surface of the cutting edge of the inner peripheral blade is dressed by the above method.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a dressing apparatus for a slicing machine according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a perspective view showing an entire configuration of a slicing machine to which a dressing device according to the present invention is applied.

As shown in FIG. 1, an inner peripheral blade 14 for cutting an ingot In is provided with a slicing machine 10.
In the main body 12. This inner peripheral blade 1
As shown in FIG. 2, the chuck 4 is held by the chuck body 16 at a predetermined tension, and is rotated by driving a motor 18 connected to the chuck body 16. As shown in FIG. 1, the upper part of the inner peripheral blade 14 is covered with a cover 12A having a central portion opened. Cover 12
A is detachably attached to the main body 12, and a dressing device 20 is installed on the cover 12A.
The configuration of the dressing device 20 will be described later in further detail.

A cutting feed table 22 is supported on the upper surface of the main body 12 so as to be slidable in the direction AB in the drawing. The cutting feed table 22 is driven by a driving device (not shown) to reciprocate on the main body 12 in the AB direction in the drawing.
On the cutting feed table 22, a column 24 is erected vertically. On the front surface of the column 24, an indexing slider 26 is supported so as to be slidable in the direction CD in the drawing. The indexing slider 26 is screwed to a feed screw (not shown) provided on the front of the column 24, and moves up and down by rotating the feed screw by a motor (not shown).

The ingot In is provided with the index slider 26.
Is mounted via a slice base 28. Then, by driving the index slider 26, the index slider 26 is moved in the CD direction in the figure, and the index amount is adjusted. Further, the ingot In attached to the indexing slider 26 drives the cutting feed table 22 so that A-
The wafer moves in the direction B, and is thereby pressed against the rotating inner peripheral blade 14 to be cut into wafers.

At this time, the displacement of the inner peripheral blade 14 during cutting of the ingot is detected by a non-contact type blade sensor 80 installed above the inner peripheral blade 14. 3 to 5 show the dressing device 20 respectively.
3 is a front view, a side view, and a plan view showing the configuration of FIG. As shown in the figure, the dressing device 20 includes a holder 32 for holding a dressing stone 30 and a holder 32 for holding the dressing stone 30.
And a holder 32 for moving the holder 32 in the horizontal direction with respect to the inner peripheral blade 1.
And a vertical moving mechanism 36 for moving the moving member 4 in the vertical direction with respect to the moving member 4.

The horizontal moving mechanism 34 is fixed to an L-shaped support member 40 fixed on a base 38 with bolts (not shown). This horizontal moving mechanism 34 has a section U
It has an outer rail 42 formed in a letter shape, and the outer rail 42 has a guide rail (not shown) integrally formed on both inner side surfaces thereof. The inner rail 44 is slidably supported by the guide rail.

The outer rail 42 has a ball screw 46 disposed inside. One end of the ball screw 46 is rotatably supported by a motor bracket 48 fixed to one end of the outer rail 42.
The other end of the ball screw 46 is rotatably supported by a support plate 50 fixed to the other end of the outer rail 42.

Here, a bolt hole (not shown) is formed in the inner block 44 that slides inside the outer rail 42, and the bolt hole is screwed to the ball screw 46. Therefore, the inner block 44
Is rotated in the X direction in the figure along the outer rail 42 by rotating the ball screw 46. The rotational drive source that applies a rotational force to the ball screw 46 is an X-axis pulse motor 52 fixed to a motor bracket 48. The X-axis pulse motor 52 has its rotation axis connected to the ball screw 46 via a joint 54. Have been.

The vertical moving mechanism 36 is disposed so as to be orthogonal to the horizontal moving mechanism 34 described above, and is fixed to an inner block 44 of the horizontal moving mechanism 34 with a bolt (not shown). The vertical movement mechanism 36 has substantially the same configuration as the horizontal movement mechanism 34 described above. That is, the outer rail 56 having a U-shaped cross section is provided.
An inner block 58 is slidably supported inside the inner block. And, the inner block 58 is connected to the outer rail 5.
6 is screwed into a ball screw 60 disposed inside, and by rotating this ball screw 60 with a Z-axis pulse motor 64 fixed to a motor bracket 62,
It moves in the Z direction in the figure along the outer rail 56.

The holder 32 is fixed to the inner block 56 of the vertical movement mechanism 36 via an arm 66 formed in an L shape. The holder 32 is formed in a bar shape having a U-shaped cross section. When the dressing stone 30 is mounted, the dressing stone 30 is mounted by fitting the dressing stone 30 into the recess 32A. And the dressing stone 3 fitted in the recess 32A.
0 is fixed to the holder 32 by being clamped by a clamp 68 provided in the holder 32. This clamp 6
8 can clamp the dressing stone 30 by tightening the clamp screw 70 screwed to the holder 32.

The dressing stone 30 is formed in a rod shape having a square cross section, and is mounted on the holder 32 so as to be orthogonal to the inner peripheral blade 14. The horizontal movement mechanism 34
By driving the vertical movement mechanism 36, the inner peripheral blade 14 moves in the horizontal direction (the X direction in the drawing) with respect to the inner peripheral blade 14.
Is driven, the blade moves in a direction perpendicular to the inner peripheral blade 14 (the Z direction in the figure).

The dressing device 20 is configured as described above, and as described above, the slicing machine body 12
On the cover 12A. Here, as shown in FIG. 1, a mounting base 72 is provided above the cover 12A, and the dressing device 20 is fixed on the mounting base 72 by bolts (not shown). The mounting base 72 is attached to the slicing machine main body 12 by the hinge 7.
4 and 74 so as to be swingable.
When the lock by 6 is released, the cover 12A can be retracted from the upper portion.

As shown in FIG. 2, the driving of the X-axis pulse motor 52 and the Z-axis pulse motor 64 of the dressing device 20 is controlled by a control device 78. The control device 78 includes a blade sensor. The X-axis pulse motor 52 according to a preset program based on the displacement information of the inner peripheral blade 14 input from the
And the Z-axis pulse motor 64 are controlled.

The operation of the embodiment of the dressing apparatus for a slicing machine according to the present invention configured as described above is as follows. First, a case where the ingot In is cut by the slicing machine 10 will be described. As shown in FIG. 1, first, the ingot In is mounted on the indexing slider 26 via the slice base 28. After the mounting, the motor 18 is driven to rotate the inner peripheral blade 14 at a high speed.

Next, the index slider 26 is driven to lower the ingot In and stop at a position where one wafer is cut. After stopping, the cutting feed table 22 is driven to move the ingot In toward the inner peripheral blade 14. As a result, the ingot In is pressed against the rotating inner peripheral blade 14, and the contact portion of the ingot In is moved to the cutting edge 14A.
And cut into wafers.

The cut wafer is collected by a collecting device (not shown) and stored in a cassette (not shown). On the other hand, the cut ingot In is returned to the original position (cutting start position) by the cutting feed table 22 when the wafer is collected. Then, after returning to the original position, the wafer is lowered by an amount corresponding to one wafer cut by the indexing slider 26, and is again fed toward the inner peripheral blade 14 by the cutting feed table 22.

As a result, the second wafer is cut, and the same operation is repeated to sequentially cut the wafer. By the way, as described above, the inner peripheral blade 14 of the slicing machine 10 cuts by repeatedly cutting, sludge accumulates on the surface of the cutting edge 14A and the abrasive grains are buried, or the abrasive grains are worn. Ability decreases. For this reason, the inner peripheral blade 14 is
Periodic dressing is required.

Next, a case where the inner peripheral blade 14 is dressed using the dressing device 20 provided in the slicing machine 10 of the present embodiment will be described. First, a case in which the entire cutting edge of the inner peripheral blade 14 is dressed will be described (a case in which so-called table dressing is performed).

First, the operator operates the dressing device 2
The dressing stone 30 is attached to the No. 0 holder 32. The dressing stone 30 is held by the holder 32 in a state orthogonal to the inner peripheral blade 14 by being attached to the holder 32. Next, the control device 78 drives the Z-axis pulse motor 64 of the vertical movement mechanism 36 to lower the dressing stone 30 by a predetermined amount.
As a result, the dressing stone 30 becomes as shown in FIG.
As shown in the figure, the blade is arranged to face the rotating inner peripheral blade 14 at a predetermined interval. Hereinafter, the position of the dressing stone 30 is referred to as a “dressing standby position”.

When the dressing stone 30 is located at the dressing standby position, the X-axis pulse motor 52 of the horizontal moving mechanism 34 is driven, and the dressing stone 30 is horizontally moved by a predetermined amount toward the inner peripheral blade 14 on which the dressing stone 30 rotates. Sent. Thereby, dressing stone 30
Is cut horizontally by a predetermined amount into the rotating inner peripheral blade 14 as shown in FIG. 6B.

The dressing stone 30 is shown in FIG.
As shown in the figure, when the inner peripheral blade 14 is cut by a predetermined amount, the X-axis pulse motor 52 of the horizontal moving mechanism 34 is driven again, and the dressing stone 30 is moved away from the inner peripheral blade 14 this time. Is sent horizontally. Thereby, the dressing stone 30 is pulled out horizontally from the rotating inner peripheral blade 14 as shown in FIG. 6C. Then, the extracted dressing stone 30 moves horizontally as it is and returns to the dressing standby position.

With the above, the dressing of the entire cutting edge of the inner peripheral blade 14 is completed. When the dressing is performed again, the dressing stone 30 is lowered by a predetermined amount by the vertical movement mechanism 36, and is sent horizontally to the rotating inner peripheral blade 14 again, and then returned to the horizontal state, thereby performing dressing. As described above, when dressing the entire cutting edge of the inner peripheral blade 14, the dressing stone 30 is fed horizontally to the inner peripheral blade 14, cut in horizontally, and then pulled out horizontally to perform dressing.

The dressing of the entire cutting edge is a dressing that is effective when the dressing is performed periodically or when the variation in displacement of the inner peripheral blade 14 during cutting of the ingot is unstable. By the way, the cutting edge 1 of the inner peripheral blade 14
The clogging that occurs on the 4A does not occur uniformly on the entire cutting edge, but may cause more clogging on the upper surface or vice versa.

In such a case, the inner peripheral blade 14 during the cutting of the ingot is displaced upward or downward from the horizontal state. In other words, when more clogging occurs on the lower surface of the cutting edge 14A, the sharpness of the lower surface of the cutting edge is reduced, so that the upper surface of the cutting edge 14A is displaced upward. Is displaced downward because the sharpness of the 低下 is reduced. Therefore, when the inner peripheral blade 14 is displaced upward, the lower surface of the cutting edge of the inner peripheral blade 14 is dressed, and when the inner peripheral blade 14 is displaced downward, the upper surface of the cutting edge of the inner peripheral blade 14 is dressed. Then, the inner peripheral blade 14 can be corrected to a horizontal state.

Next, a case where the lower surface of the cutting edge of the inner peripheral blade 14 is dressed will be described. First,
The Z-axis pulse motor 64 of the vertical movement mechanism 36 is driven by the control device 78, and the dressing stone 30 is lowered by a predetermined amount. As a result, as shown in FIG. 7A, the dressing stone 30 is located at the dressing standby position.

Next, the X-axis pulse motor 52 of the horizontal moving mechanism 34 is driven, and the dressing stone 30 is fed horizontally by a predetermined amount toward the rotating inner peripheral blade 14.
As a result, the dressing stone 30 becomes as shown in FIG.
As shown in (1), a predetermined amount is cut horizontally into the rotating inner peripheral blade 14. Dressing stone 30 is shown in FIG.
As shown in (b), when a predetermined amount is cut into the inner peripheral blade 14, the X-axis pulse motor 52 of the horizontal movement mechanism 34 and the Z-axis pulse motor 64 of the vertical movement mechanism 36 are simultaneously driven, The dressing stone 30 is sent obliquely upward. That is, while the dressing stone 30 is fed horizontally by the horizontal moving mechanism 34 and fed vertically upward by the vertical moving mechanism 36, the dressing stone 30 moves diagonally upward.

Thus, the dressing stone 30
Is drawn obliquely upward from the rotating inner peripheral blade 14 as shown in FIG. 7 (c). When the dressing stone 30 is pulled obliquely upward from the inner peripheral blade 14, the inner peripheral blade 14 is dressed on the lower surface of the cutting edge 14A by the dressing stone 30 that is pulled obliquely upward.

When the dressing stone 30 is pulled out from the inner peripheral blade 14, only horizontal feeding is given by the horizontal moving mechanism 34, and the dressing stone 30 is returned to the dressing standby position. Thus, the dressing of the lower surface of the cutting edge of the inner peripheral blade 14 is completed. Further, when dressing is performed again, the dressing stone 30 is lowered by a predetermined amount by the vertical movement mechanism 36, and is sent horizontally toward the rotating inner peripheral blade 14;
After cutting horizontally, dressing is performed by pulling it obliquely upward.

Thus, the cutting edge 1 of the inner peripheral blade 14 is
In the case of dressing the lower surface of 4A, the dressing stone 30 is fed horizontally toward the rotating inner peripheral blade 14, is cut horizontally, and is pulled out obliquely upward. On the other hand, a case where the upper surface of the cutting edge of the inner peripheral blade 14 is dressed is as follows.

First, the Z-axis pulse motor 64 of the vertical movement mechanism 36 is driven by the control device 78, and the dressing stone 30 is lowered by a predetermined amount. As a result, FIG.
As shown in (1), the dressing stone 30 is located at the dressing standby position. Next, the X-axis pulse motor 52 of the horizontal moving mechanism 34 is driven, and the dressing stone 3
0 is fed horizontally by a predetermined amount toward the rotating inner peripheral blade 14. Thereby, the dressing stone 30 becomes
As shown in FIG. 8B, the rotating inner peripheral blade 14
Is cut horizontally by a predetermined amount.

The dressing stone 30 is shown in FIG.
As shown in FIG. 7, when the inner peripheral blade 14 is cut by a predetermined amount, the X-axis pulse motor 52 of the horizontal moving mechanism 34 is next moved.
And the Z-axis pulse motor 64 of the vertical movement mechanism 36 is simultaneously driven, and the dressing stone 30 is sent obliquely downward. That is, while the dressing stone 30 is fed horizontally by the horizontal moving mechanism 34 and fed vertically downward by the vertical moving mechanism 36, the dressing stone 30 moves diagonally downward.

Thus, the dressing stone 30
Is pulled obliquely downward from the rotating inner peripheral blade 14 as shown in FIG. 8C. Then, as the dressing stone 30 is pulled obliquely downward from the inner peripheral blade 14, the inner peripheral blade 14 is dressed on the upper surface of the cutting edge 14A by the dressing stone 30 that is pulled obliquely downward.

When the dressing stone 30 is pulled out from the cutting edge 14A of the inner peripheral blade 14, only horizontal feeding is given by the horizontal moving mechanism 34, and the dressing stone 30 is returned to the dressing standby position. Thus, the dressing of the upper surface of the cutting edge of the inner peripheral blade 14 is completed. Further, when dressing is performed again, the dressing stone 30 is lowered by a predetermined amount by the vertical movement mechanism 36, and is sent horizontally toward the rotating inner peripheral blade 14;
After cutting horizontally, dressing is performed by pulling it diagonally downward.

Thus, the cutting edge 1 of the inner peripheral blade 14 is
In the case of dressing the upper surface of 4A, the dressing stone 30 is fed horizontally toward the rotating inner peripheral blade 14, is cut horizontally, and then is pulled obliquely downward. Thus, in the dressing device 20 of the present embodiment, three types of dressing, that is,
The entire cutting edge, upper cutting edge and lower cutting edge can be automatically dressed. By appropriately and selectively performing these three types of dressing, the condition of the inner peripheral blade 14 can always be kept optimal.

That is, the displacement of the inner peripheral blade 14 during the cutting of the ingot is always detected by the blade sensor 80. Therefore, when the control device 78 determines that the detected value of the displacement exceeds a predetermined value, Peripheral blade 14
Is dressed on the upper surface or the lower surface. Specifically, an upper limit and a lower limit of the displacement are set in advance in the control device 78, and the inner peripheral blade 14 during cutting of the ingot is set.
When the displacement exceeds the upper limit, the lower surface of the cutting edge 14A is dressed, and when the displacement exceeds the lower limit, the upper surface of the cutting edge 14A is dressed.

Thus, the condition of the inner peripheral blade 14 can be always kept in a good condition during the cutting of the ingot In, and high-precision cutting with less warpage or the like becomes possible. Further, the controller 78 counts the number of cut wafers, and performs dressing (table dressing) of the entire cutting edge of the inner peripheral blade 14 each time a predetermined number of wafers are cut. The condition can be kept in a better state.

As described above, according to the dressing apparatus 20 of the present embodiment, the condition of the inner peripheral blade 14 can always be kept optimal by appropriately selecting and performing three types of dressing. Further, the execution of these three types of dressing is performed by automatic control by the control device 78, so that the labor of the operator is greatly reduced.
In addition, as a result, the dressing time can be significantly reduced, so that the production efficiency is improved.

Further, by performing dressing under automatic control by the control device 78, individual differences among operators can be eliminated and constant quality can be maintained at all times. Further, the inner peripheral blade 14 is rotated by an operator.
It is not necessary to work in the vicinity of, which contributes to improvement of safety. Next, as in the above example, the dressing device 20
A specific operation method of the slicing machine 10 for cutting the ingot In while always keeping the condition of the inner peripheral blade 14 in a favorable state using the following will be described with reference to the flowchart shown in FIG.

As described above, the outline of the operation method of the slicing machine 10 is as follows. The lower limit (-L) and the upper limit (+ L) of the displacement are set in the control device 78 in advance, and the inner peripheral blade during cutting of the ingot is set. When the displacement H of 14 exceeds the upper limit (+ L), the lower surface of the cutting edge 14A is dressed, and when the displacement H exceeds the lower limit (-L), the upper surface of the cutting edge 14A is dressed. In addition to this, every time a predetermined number (D) of wafers are cut, dressing (table dressing) of the entire cutting edge of the inner peripheral blade 14 is performed.

As shown in FIG. 9, first, the operator
The lower limit of the displacement of the inner peripheral blade 14 (−
L), the upper limit (+ L), the number of regular dresses (D), and the total number of cuts (T) are input (S1). Here, as the lower limit (-L) and the upper limit (+ L) of the displacement, the lower limit and the upper limit of the allowable range of the displacement when the inner peripheral blade 14 is displaced upward or downward are input.

For the number of regular dresses (D), the number of cut wafers for executing table dressing is input. For example, if table dressing is to be performed every time 30 wafers are cut, 3
Enter 0. As the total number of cuts (T), the total number of wafers cut from one ingot In is input. Since the total number of cuts (T) can be calculated if the length of the ingot In and the thickness of the wafer to be cut are known, the operator calculates and inputs this.

When the above input is completed, the operation of the slicing machine 10 is started (S2). First, the control device 78 sets the initial values of the number S of cut wafers and the number i of regular dress determinations, that is, sets S = 0 and i = 0 (S3). Here, the number S of cut wafers and the number i of regular dress judgments indicate the number of wafers cut by the inner peripheral blade 14, and the numerical value is incremented by one each time one wafer is cut (S4). ). While the number S of cut wafers is added throughout until the end of the operation, the number i of regular dress judgments is cleared when the table dressing is executed, and is counted again from 1.

As described above, the control device 78 sets the initial values of the number S of cut wafers and the number i of regular dress judgments (S
3) When the first wafer is counted (S4), a drive signal is output to each device (the motor 18 for rotating the inner peripheral blade, the indexing slider 26, the cutting feed table 22, etc.). Starts the cutting of the ingot In (S
5). Since the method of cutting the ingot In has already been described above, the description is omitted here.

The controller 78 activates the blade sensor 80 simultaneously with the start of cutting the ingot In to detect the displacement (H) of the inner peripheral blade 14. Then, the displacement information detected by the blade sensor 80 is stored in a built-in memory (S6). After detecting the blade displacement (H), the control device 78 determines whether or not the inner peripheral blade 14 has finished cutting one wafer (S7).
If the cutting is not completed, the displacement (H) of the inner peripheral blade 14 is detected again, and the displacement information is stored in the built-in memory. Hereinafter, the same detection is repeated until one wafer is cut. That is, the control device 78 constantly detects the displacement (H) of the inner peripheral blade 14 until the cutting of one wafer is completed, and stores the displacement information in a built-in memory.

The determination as to whether or not the cutting of one wafer has been completed (S7) is made based on, for example, whether or not the wafer has been recovered by a recovery device (not shown). When determining that the cutting of the first wafer has been completed, the control device 78 determines whether the displacement (H) of the inner peripheral blade 14 detected during the cutting of the ingot is within the set allowable range. Is determined (S9). That is, the minimum value of the displacement (H) does not exceed the set lower limit value (-L) of the displacement, and the maximum value of the displacement (H) exceeds the set upper limit value (+ L) of the displacement. Determine if there is any.

If the upper limit or the lower limit is exceeded, it can be determined that the upper or lower surface of the cutting edge 14A of the inner peripheral blade 14 is clogged. Alternatively, lower surface dressing is performed. First, the control device 78 calculates the detected displacement (H).
Exceeds the upper limit (+ L) or the lower limit (-L) (S9). That is, the minimum value H _MIN and the maximum value H _MAX of the detected displacement are respectively selected, and L <
If H _MAX , it is determined that the value exceeds the upper limit (+ L). If H _MIN <−L, it is determined that the value exceeds the lower limit.

If the detected displacement (H) exceeds the upper limit (+ L), it can be determined that the lower surface of the cutting edge 14A of the inner peripheral blade 14 is clogged. , The control device 78 includes the dressing device 20.
To perform dressing of the lower surface of the cutting edge of the inner peripheral blade 14 (S10). On the other hand, if the detected displacement (H) is below the lower limit (-L), it can be determined that the upper surface of the cutting edge 14A of the inner peripheral blade 14 is clogged. , Control device 78
Drives the dressing device 20 to drive the inner peripheral blade 1
The dressing of the upper surface of the cutting edge of No. 4 is executed (S11).

As described above, when the detected displacement (H) exceeds the allowable range, the upper surface dressing or the lower surface dressing is immediately executed to keep the blade condition of the inner peripheral blade 14 in a favorable state at all times. Can be kept. The number of times of dressing when the upper or lower surface dressing is executed is set to an optimum number by the control device 78 according to the degree of displacement. For example, the number of executions corresponding to the displacement amount is input to the control device 78 in advance, and based on this, the upper or lower dressing is executed.

If the displacement (H) of the inner peripheral blade 14 during the cutting of the ingot exceeds the allowable range, the upper or lower dressing is executed as described above. Next, it is determined whether or not all the wafers have been cut (S12). That is,
It is determined whether the number S of cut wafers has reached the total number of cuts (T).

Here, if the number S of cut wafers has reached the total number of cuts (T) (if S = T), it can be determined that all wafers have been cut from the ingot In. Then, the operation of the slicing machine 10 is terminated (S13). On the other hand, the number S of cut wafers is
If the total number of cuts (T) has not been reached (if S ≠ T), it can be determined that there is a wafer to be cut next, so the operation is continued without stopping. Then, it is determined whether or not the regular dressing should be performed.
That is, it is determined whether the regular dress determination number i has reached the regular dress number (D) (S14).

Here, if the number i of regular dress judgments reaches the number of regular dresses (D) (if i = D), it can be determined that the number of wafers to be subjected to regular dressing has been cut. In this case, the control device 78
Drives the dressing device 20 to execute dressing of the entire cutting edge of the inner peripheral blade 14, that is, table dressing (S15).

On the other hand, if the regular dress determination number i does not reach the regular dress number (D) (if i ≠ D), the next wafer is cut as it is. That is, the process returns to S4. In the case where the table dressing is also executed, after the end, the number i of the regular dress determination is cleared (S16), and then the cutting of the next wafer is executed.

The above steps are repeated until all the wafers are cut from the ingot In. When all the wafers have been cut, the operation of the slicing machine 10 is terminated. As described above, in the above-described operation method of the slicing machine 10, the entire edge of the inner peripheral blade 14 is dressed periodically every time a predetermined number of wafers are cut. In addition, if the displacement of the inner peripheral blade 14 during the cutting of the ingot exceeds the upper limit or the lower limit of the preset displacement, the upper or lower surface of the cutting edge 14A of the inner peripheral blade 14 is immediately dressed. .

As a result, the ingot In can be cut while always maintaining the condition of the inner peripheral blade 14 in a good condition. As a result, the cutting accuracy of the wafer is improved. Further, since the execution of dressing is all automatic judgment by a machine, individual differences between operators can be eliminated, and the dressing time can be shortened.

Further, since the operation of the operator does not intervene during the cutting of the ingot, the labor of the operator is reduced, and the safety is improved because the operator does not approach the rotating inner peripheral blade 14. In the above operation example,
The table dressing is set to be executed every time a predetermined number of wafers are cut. However, when clogging becomes severe, the displacement of the inner peripheral blade 14 becomes unstable (displaces so as to vibrate up and down). Therefore, even if such a waveform occurs, by immediately executing table dressing, the blade condition can be further favorably maintained.

As described above, by appropriately selecting and performing cutting of the ingot using the dressing apparatus 20 of the present embodiment, the condition of the inner peripheral blade 14 can always be kept optimal.

[0068]

As described above, according to the present invention,
It is possible to automatically perform three types of dressing on the upper surface, the lower surface, and the whole of the cutting edge of the inner peripheral blade. Thereby, the labor of the operator can be greatly reduced.
As a result, the dressing time can be significantly reduced, and the production efficiency is improved.

Further, by performing dressing on the machine by automatic control, individual differences between operators are eliminated, and it is possible to always maintain a constant quality. Furthermore, since the operator does not need to work near the rotating inner peripheral blade, safety can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the overall configuration of a slicing machine to which a dressing device according to the present invention is applied.

FIG. 2 is a sectional view of a main part of the slicing machine.

FIG. 3 is a front view of the dressing device.

FIG. 4 is a side view of a dressing device.

FIG. 5 is a plan view of a dressing device.

FIG. 6 is an explanatory view for explaining the operation of the dressing device (in the case of table dressing).

FIG. 7 is an explanatory view for explaining the operation of the dressing device (in the case of bottom dressing).

FIG. 8 is an explanatory view for explaining the operation of the dressing device (in the case of top dressing).

FIG. 9 is a flowchart illustrating an operation method of a slicing machine using the dressing device according to the present embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Slicing machine 14 ... Inner peripheral blade 14A ... Blade edge 20 ... Dressing device 22 ... Cutting feed table 26 ... Indexing slider 30 ... Dressing stone 32 ... Holder 34 ... Horizontal movement mechanism 36 ... Vertical movement mechanism 78 ... Control device 80 ... Blade sensor In… Ingot

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Shuichi Tsukada 9-7-1, Shimorenjaku, Mitaka-shi, Tokyo Tokyo Seimitsu Co., Ltd. (72) Inventor Shuji Takahashi 2735-21 Higashihara, Kuroi Daiji, Joetsu City, Niigata Prefecture Within TS Data Co., Ltd.

Claims (3)

[Claims] 1. A dressing apparatus for a slicing machine for cutting a workpiece into wafers by rotating an inner peripheral blade, wherein the holder holds a dressing stone so as to be orthogonal to the inner peripheral blade. Horizontal moving means for moving the holder in the horizontal direction with respect to the inner peripheral blade, vertical moving means for moving the holder in the vertical direction with respect to the inner peripheral blade, driving of the horizontal moving means and the vertical moving means The control means drives the horizontal movement means to cut the edge of the inner peripheral blade horizontally in the dressing stone by a predetermined amount, and then the horizontal movement means To pull the dressing stone horizontally from the cutting edge, thereby draining the entire cutting edge of the inner peripheral blade. After the step of performing the driving, the horizontal moving means is driven to cut the edge of the inner peripheral blade horizontally into the dressing stone by a predetermined amount, and then the horizontal moving means and the vertical driving means are simultaneously driven. Dressing the upper surface of the cutting edge of the inner peripheral blade by pulling the dressing stone obliquely downward from the cutting edge; and driving the horizontal moving means to place the cutting edge of the inner peripheral blade on the dressing stone. A step of dressing the lower surface of the inner peripheral blade by cutting the fixed horizontal cutting means and simultaneously driving the horizontal moving means and the vertical driving means to pull out the dressing stone obliquely upward from the cutting edge; Dressing of a slicing machine, which performs at least one of the steps Location. 2. A dressing apparatus of a slicing machine for cutting a workpiece into wafers by rotating an inner peripheral blade, wherein the holder holds a dressing stone so as to be orthogonal to the inner peripheral blade. Horizontal moving means for moving the holder in the horizontal direction with respect to the inner peripheral blade; vertical moving means for moving the holder in a direction perpendicular to the inner peripheral blade; and the inner peripheral blade during cutting of the workpiece A blade sensor that detects a displacement amount of the blade, and a control unit that controls driving of the horizontal movement unit and the vertical movement unit based on displacement information of the inner peripheral blade,
When the inner peripheral blade is displaced above an upper limit value of a preset displacement, after cutting the wafer, the control means drives the horizontal moving means to move the inner to the dressing stone. The cutting edge of the peripheral blade is horizontally cut by a predetermined amount, and then, the horizontal moving unit and the vertical driving unit are simultaneously driven to pull out the dressing stone obliquely upward from the blade edge, thereby removing the inner peripheral blade blade. Dressing the lower surface of the cutting edge, when the inner peripheral blade is displaced below a preset lower limit of the displacement, after cutting the wafer, the horizontal moving means is driven, and the inner peripheral blade is moved to the dressing stone. The cutting edge of the blade blade is cut horizontally by a predetermined amount, and thereafter, the horizontal moving means and the vertical driving means are simultaneously driven. Pull the dressing stone obliquely downward from the cutting edge, the dressing apparatus of slicing machine, characterized in that dressing the edge upper surface of the inner peripheral edge blade. 3. The control means counts the number of wafers cut by the inner peripheral blade, and drives the horizontal moving means each time a predetermined number of wafers are cut, so that the inner peripheral blade is attached to the dressing stone. The cutting edge is horizontally cut by a predetermined amount, and thereafter, the horizontal moving means is driven,
The dressing device for a slicing machine according to claim 1, wherein the dressing stone is pulled out horizontally from the cutting edge to dress the entire cutting edge of the inner peripheral blade.