JPH1148123A - Polishing device and method for semiconductor substrate, and manufacturing device for semiconductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To miniaturize a device, and conduct a polishing work in a short time. SOLUTION: In a polishing device 10 for a semiconductor substrate containing a rotationally driven circular polishing pad 12, a pressure plate 13 supported in an upper side of the polishing pad 12 to be movable vertically, capable of moving to a feeding part and discharging part for the semiconductor substrate and provided with a holding part, 13a for holding the semiconductor substrate in its back face, and a polishing abrasive supplying part 14 in an upper surface of the polishing pad 12 for supplying an abrasive, the polishing device 10 for the semiconductor substrate is constituted to dispose the dressor part 17 along a peripheral edge of the back face of the pressure plate 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus and a polishing method for polishing a surface of a semiconductor substrate constituting a semiconductor device, and a semiconductor manufacturing apparatus provided with such a polishing apparatus.

[0002]

2. Description of the Related Art Conventionally, when a semiconductor device is manufactured, the surface of a semiconductor substrate is polished using a polishing apparatus in order to improve the flatness of the surface, and further, the surface is cleaned to clean the surface. Like that. Such a polishing apparatus for a semiconductor substrate is usually used by being incorporated in a semiconductor manufacturing apparatus, and is configured, for example, as shown in FIG. In FIG. 5, a polishing apparatus 1 includes a surface plate 2 having a flat circular upper surface, a polishing pad 3 provided on the upper surface of the surface plate 2,
Opposite to the upper surface of the platen 2, the pressure plate includes two pressure plates 4, 5, each of which can be moved up and down, and a polishing grain supply unit 6 that supplies polishing grains near the center of the polishing pad 3. In.

The surface plate 2 is rotatably supported around a vertical rotation shaft 2a, and is driven to rotate as indicated by an arrow A by driving means (not shown). The polishing pad 3 is designed to polish the surface of the semiconductor substrate pressed against the surface as described later.

[0004] Of the two pressure plates 4 and 5, the first pressure plate 4 is for polishing, and the second pressure plate 5 is for dressing.

The first pressure plate 4 has a holding portion 4a for holding a semiconductor substrate 7 to be polished on the lower surface of the circular shape, and a spherical bearing 4b near the center of the upper surface. I have. Here, the holding unit 4
a is configured so that the semiconductor substrate 7 can be held by an appropriate means such as an adsorption means. The spherical bearing 4b is pressed downward by a press shaft 4c fitted from above during polishing. Further, the first pressure plate 4 is moved to a supply portion and a discharge portion of the semiconductor substrate by driving means (not shown).

[0006] The second pressure plate 5
Along the periphery of the circular lower surface, the electrodeposition dresser 5a
And a spherical bearing 5 near the center of the upper surface.
b. Here, the electrodeposition dresser 5a
For example, the polishing pad 3 is formed by electrodepositing diamond particles, and the polishing pad 3 is dressed by contacting the surface of the polishing pad 3 provided on the upper surface of the platen 2. . The spherical bearing 5b
During the polishing, the pressing shaft 4c is fitted from above to be pressed downward.

[0007] The polishing abrasive grain supply section 6 is provided with a pump 6 b from a tank 6 a in which, for example, slurry abrasive grains are stored.
Thus, the polishing abrasive grains 8 are pressure-fed to near the center of the upper surface of the polishing pad 3 via the supply pipe 6c.

A semiconductor substrate polishing apparatus 1 having such a configuration.
According to the first embodiment, the first pressure plate 4 first moves to the supply portion of the semiconductor substrate, and the holding portion 4a holds the semiconductor substrate 7, and then the illustrated position (standby position) on the surface plate 2 again.
Return to Here, the second pressure plate 5 is lowered, the electrodeposited dresser 5a contacts the surface of the polishing pad 3, and the platen 2 is driven to rotate. Thereby, dressing of the polishing pad 3 on the surface plate 2 is performed. Thereafter, the second pressure plate 5 is raised and moved to the illustrated standby position.

Next, the first pressure plate 4 descends and presses the semiconductor substrate 7 held by the holding portion 4 a against the surface of the polishing pad 3. Then, while the surface plate 2 is driven to rotate, the polishing abrasive grains 8 are supplied to the vicinity of the center of the upper surface of the polishing pad 3 by the polishing abrasive supply unit 6. As a result, the lower surface of the semiconductor substrate 7 is polished by the relative movement between the rotating platen 2 and the polishing pad 3 and the semiconductor substrate 7 and the presence of the abrasive grains.

Thereafter, the first pressure plate 4 moves up to the standby position, and further moves to the discharge portion of the semiconductor substrate to release the semiconductor substrate 7. Subsequently, the first pressure plate 4 moves to a supply section of the semiconductor substrate to hold a new semiconductor substrate. By repeating the above operation, the semiconductor substrate is sequentially polished.

[0011]

However, in such a polishing apparatus 1, two pressure plates 4 and 5 are provided, and at the time of polishing, the second pressure plate 5 for dressing is in a standby position. ,
At the time of dressing, the first pressure plate 4 for polishing is at the standby position. For this reason, the number of parts increases and these two pressure plates 4
5 occupies a large space. In particular, as the diameter of the semiconductor substrate 7 increases, the overall size of the polishing apparatus 1 increases, and there is a problem that the installation space of the polishing apparatus 1 increases. Further, a drive mechanism and a pressurizing mechanism are required for each of the pressure plates 4 and 5, so that there is a problem that the entire apparatus is complicated and the cost is increased.

The present invention has been made in view of the above points, and has as its object to provide a semiconductor substrate polishing apparatus, a polishing method, and a semiconductor manufacturing apparatus capable of reducing the size of the apparatus and performing the polishing operation in a shorter time. The purpose is.

[0013]

SUMMARY OF THE INVENTION According to the present invention, there is provided a polishing pad which is rotatably driven, and which is supported above and below the polishing pad so as to be vertically movable, and which supplies and discharges a semiconductor substrate. And a pressing means provided with a holding section for holding the semiconductor substrate on the lower surface, and a polishing abrasive grain supply section for supplying polishing abrasive grains to the upper surface of the polishing pad. Is achieved by a polishing apparatus for a semiconductor substrate, wherein a dresser portion is provided along a peripheral edge of a lower surface of the pressing means.

Further, according to the present invention, it is an object of the present invention to contact a lower surface of a semiconductor substrate held by a pressing means against a polishing pad which is driven to rotate, and to supply abrasive grains to the polishing pad. A polishing method for polishing a semiconductor substrate, wherein the lower surface of the semiconductor substrate is polished, wherein the polishing pad is dressed by a dresser portion movably disposed on the periphery of the lower surface of the pressing means. This is achieved by the semiconductor substrate polishing method described above.

Further, according to the present invention, a semiconductor device is manufactured by polishing a surface of a semiconductor substrate by a polishing section and performing various processes on the semiconductor substrate. A manufacturing apparatus, wherein the polishing unit is rotatably driven, and a polishing pad, supported vertically movably above the polishing pad, and movable to a supply unit and a discharge unit of a semiconductor substrate, and a lower surface thereof. Pressing means provided with a holding portion for holding the semiconductor substrate, and a polishing abrasive grain supply section for supplying abrasive grains to the upper surface of the polishing pad, including along the periphery of the lower surface of the pressing means This is achieved by a semiconductor manufacturing apparatus provided with a dresser unit.

According to the above construction, the semiconductor substrate is held by the holding portion of the pressing means and pressed against the rotationally driven polishing pad, and the polishing abrasive grains are supplied by the polishing abrasive grain supply section near the center of the upper surface of the polishing pad. , The lower surface of the semiconductor substrate is polished. Furthermore, by pressing the dresser portion provided along the lower peripheral edge of the same pressing means against the rotatingly driven polishing pad,
The dressing of the polishing pad is performed.

The dresser portion is supported on the lower surface of the semiconductor substrate held by the holding portion of the pressing means so as to be vertically movable between a working position protruding downward and a standby position retracted upward. In the case, when the dresser portion is in the working position protruding downward, the dresser portion comes into contact with the surface of the polishing pad, and while the dressing of the polishing pad is performed, and when the dresser portion is in the standby position, the semiconductor The lower surface of the substrate contacts the surface of the polishing pad,
Polishing of the semiconductor substrate is performed. Therefore, the polishing of the semiconductor substrate and the dressing of the polishing pad are selectively performed alternately by the vertical movement of the dresser portion.

In the case where the position of the dresser is adjusted so that polishing of the lower surface of the semiconductor substrate and dressing of the polishing pad are performed simultaneously with respect to the lower surface of the semiconductor substrate held by the holding portion of the pressing means. By appropriately adjusting the vertical position of the dresser, polishing of the semiconductor substrate and dressing of the polishing pad are performed simultaneously.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to FIGS. still,
Since the embodiments described below are preferred specific examples of the present invention, various technically preferred limitations are added.
The scope of the present invention is not limited to these embodiments unless otherwise specified in the following description.

FIGS. 1 and 2 show the configuration of an embodiment of a semiconductor substrate polishing apparatus to which the present invention is applied. FIG.
In the above, the polishing apparatus 10 is a polishing apparatus incorporated in a semiconductor manufacturing apparatus, and comprises a surface plate 11 having a flat circular upper surface, and a polishing pad 12 provided on the upper surface of the surface plate 11.
A pressure plate 13 serving as a pressing means that is vertically movably disposed facing the upper surface of the surface plate 11, and a polishing abrasive grain supply unit 14 that supplies polishing abrasive grains near the center of the polishing pad 12. Contains.

The surface plate 11 is rotatably supported around a vertical rotation shaft 11a and is driven to rotate as indicated by an arrow A by a driving means M such as a motor. The polishing pad 12 is designed to polish the surface of a semiconductor substrate pressed against the surface as described later.

The pressing means is configured as a flat pressure plate in this embodiment. However, as will be described later, any other structure may be used as long as the structure serves as a member that holds the semiconductor substrate on the lower surface and has a dresser portion on its periphery and a member that applies a pressing force downward. The pressure plate 13 as the pressing means has substantially the same configuration as the first pressure plate 4 in the conventional polishing apparatus 1 shown in FIG. 5, and as shown in detail in FIG. Holding portion 13a for holding semiconductor substrate 15 to be polished
And a spherical bearing 1 near the center of the upper surface.
3b.

Here, the holding portion 13a is connected to the semiconductor substrate 15 by, for example, suction means as vacuum suction means.
Is configured to be able to be held by suction. The spherical bearing 13b is pressed downward by a press shaft 13c fitted from above during polishing. Further, the pressure plate 13 is moved by a driving means (not shown) to a supply portion and a discharge portion of the semiconductor substrate as described with reference to FIG.

The polishing abrasive grain supply section 14 is provided with a polishing abrasive grain 1 from a tank 14a in which, for example, slurry abrasive grains are stored by a pump 14b via a supply pipe 14c.
6 so as to be fed near the center of the upper surface of the polishing pad 12,
It is configured.

Here, as shown in detail in FIG. 2, the pressure plate 13 further has an annular dresser portion 17 along the periphery of the lower surface thereof. Here, the dresser 17 is configured as an electrodeposited dresser portion by electrodepositing, for example, diamond grains 17a on the lower surface thereof, and is configured to be in contact with the surface of the polishing pad 12 provided on the upper surface of the surface plate 11. By contacting, the polishing pad 12 is dressed.

The dresser section 17 is driven by a driving means 18 in the vertical direction with respect to the pressure plate 13. This driving means 18
Are formed, for example, by a combination of a pulse motor and a precision feed screw, and are provided at equal angular intervals with respect to the annular dresser portion 17 so that the dresser portion 17 moves up and down with good balance in the circumferential direction. It is supposed to be. The driving unit 18 causes the dresser unit 17 to move between a working position protruding downward as shown in FIGS. 1 and 2 and a standby position retracted upward as shown in FIG. ing. Here, the working position is, for example, 5 mm from the lower surface of the semiconductor substrate 15 held by the holding portion 13a of the pressure plate 13.
It is selected at a position about below.

The polishing apparatus 10 according to the present embodiment is configured as described above. When polishing a semiconductor substrate, the polishing is performed as follows. That is, first, the pressure plate 13 moves to the semiconductor substrate supply unit 19 shown in FIG. 3, and the holding unit 13 a holds the semiconductor substrate 15 in the supply unit 19, and then the standby position on the surface plate 11. Return to Here, the pressure plate 13 is lowered, and the dresser portion 17 is lowered by the driving means 18 to the working position. As a result, the dresser unit 17 comes into contact with the upper surface of the polishing pad 12, and the platen 11 is driven to rotate. Thus, dressing of the polishing pad 12 on the surface plate 11 is performed. Thereafter, the dresser unit 17 is raised and moved to the standby position, and the pressure plate 13 is further lowered to press the semiconductor substrate 15 held by the holding unit 13 a against the surface of the polishing pad 12. Then, while the surface plate 11 is driven to rotate, the polishing abrasive grains 16 are supplied to the vicinity of the center of the upper surface of the polishing pad 12 by the polishing abrasive supply unit 14. As a result, the lower surface of the semiconductor substrate 15 is polished by the relative movement between the rotating platen 11 and the polishing pad 12 and the semiconductor substrate 15 and the presence of the abrasive grains.

Thereafter, the pressure plate 13 moves up to the standby position, moves to the semiconductor substrate discharge section 20 shown in FIG. 3, and releases the polished semiconductor substrate 15. Subsequently, the pressure plate 13 is provided with a semiconductor substrate supply unit 19 for holding a new semiconductor substrate 15.
Go to By repeating the above operation, the semiconductor substrate is sequentially polished.
The polished semiconductor substrate moved to the semiconductor substrate discharge unit 20 is further cleaned, for example, as shown in FIG. 3, and finished into a semiconductor device through a normal semiconductor device manufacturing process. ing.

Here, in the polishing apparatus 10, since the pressure plate 13 includes the holding portion 13a and the dresser portion 17, one pressure plate is used for polishing and for dressing.
Therefore, the entire polishing apparatus 10 is configured to be small, and the cost of parts and assembly is reduced, and the space can be saved. In addition, at the time of polishing, the dresser portion 17 simply moves upward with respect to the pressure plate 13 to perform polishing, so that the time required for switching from dressing to polishing is reduced.

In the above-described embodiment, the polishing of the semiconductor substrate 15 and the dressing of the polishing pad 12 are selectively performed alternately by the vertical movement of the dresser portion 17 with respect to the pressure plate 13. By appropriately adjusting the lower surface position of the semiconductor substrate 15 held by the holding portion 13a of the pressure plate 13 and the protrusion amount of the dresser portion 17 with respect to this lower surface position, the pressure plate 13 is pressed against the polishing pad 12 by The polishing of the lower surface of the semiconductor substrate 15 and the dressing of the upper surface of the polishing pad 12 may be performed simultaneously. In this case, the time required for polishing the semiconductor substrate 15 is further reduced.

In the above-described embodiment, the driving means 18 for vertically moving the dresser section 17 is constituted by a combination of a pulse motor and a precision feed screw, for example. Obviously, other driving means may be used.

Further, in the above-described embodiment, the holding portion 13a of the pressure plate 13 is adapted to hold the semiconductor substrate 15 by suction. However, the present invention is not limited to this, and other holding means, such as a backing pad system, may be used. A holding means such as a vacuum suction method or an adhesion method is used.

[0033]

As described above, according to the present invention, there is provided a semiconductor substrate polishing apparatus, a polishing method and a semiconductor manufacturing apparatus which can reduce the size of the apparatus and perform the polishing operation in a shorter time. Can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view showing a polishing state of an embodiment of a semiconductor substrate polishing apparatus according to the present invention.

FIG. 2 is a sectional view showing a configuration of a pressure plate in the semiconductor substrate polishing apparatus of FIG. 1;

FIG. 3 is a block diagram showing the overall configuration of the semiconductor substrate polishing apparatus of FIG. 1;

FIG. 4 is a schematic sectional view showing a state of polishing the semiconductor substrate of FIG. 1 by the polishing apparatus.

FIG. 5 is a schematic sectional view showing a state of polishing by an example of a conventional semiconductor substrate polishing apparatus.

[Explanation of symbols]

10 Polishing device for semiconductor substrate, 11 Platen, 1
2 ... polishing pad, 13 ... pressure plate, 13a ... holding unit, 14 ... polishing abrasive grain supply unit,
15: semiconductor substrate, 16: abrasive grains, 17 ...
A dresser section, 18 driving means, 19 a semiconductor substrate supply section, 20 a semiconductor substrate discharge section;

Claims (7)

[Claims] A polishing pad that is driven to rotate; a polishing pad that is vertically movably supported above the polishing pad, and is movable to a supply unit and a discharge unit of a semiconductor substrate;
Pressing means provided with a holding portion for holding the semiconductor substrate on the lower surface, and a polishing abrasive grain supply unit for supplying abrasive grains to the upper surface of the polishing pad, a semiconductor substrate polishing apparatus, An apparatus for polishing a semiconductor substrate, wherein a dresser portion is provided along a peripheral edge of a lower surface of the pressing means. 2. The dresser unit is supported on a lower surface of a semiconductor substrate held by a holding unit of a pressing means so as to be vertically movable between a working position protruding downward and a standby position retracted upward. The apparatus for polishing a semiconductor substrate according to claim 1, wherein: 3. The position of the dresser portion is adjusted with respect to the lower surface of the semiconductor substrate held by the holding portion of the pressing means so that polishing of the lower surface of the semiconductor substrate and dressing of the polishing pad are simultaneously performed. The apparatus for polishing a semiconductor substrate according to claim 1, wherein: 4. The lower surface of the semiconductor substrate is polished by bringing the lower surface of the semiconductor substrate held by the pressing means into contact with the polishing pad that is driven to rotate, and supplying abrasive grains to the polishing pad. A method of polishing a semiconductor substrate as described above, wherein the dressing of the polishing pad is performed by a dresser portion movably arranged on a peripheral edge of a lower surface of the pressing means. Substrate polishing method. 5. The method for polishing a semiconductor substrate according to claim 4, wherein the dressing of the polishing pad by the dresser portion is performed alternately with the polishing of the semiconductor substrate by the vertical movement of the dresser portion. 6. The method of polishing a semiconductor substrate according to claim 4, wherein dressing of the polishing pad by the dresser is performed simultaneously with polishing of the semiconductor substrate by adjusting the vertical position of the dresser. 7. A semiconductor manufacturing apparatus, wherein a surface of a semiconductor substrate is polished by a polishing unit and a predetermined process is performed on the semiconductor substrate to manufacture a semiconductor device. Is a polishing pad that is rotationally driven, and is supported movably up and down above the polishing pad, and is movable to a supply unit and a discharge unit of the semiconductor substrate, and is also configured to hold the semiconductor substrate on the lower surface. Pressing means having a portion,
A polishing abrasive grain supply unit for supplying abrasive grains to an upper surface of a polishing pad; and a dresser unit is provided along a peripheral edge of a lower surface of the pressing unit.