JPH1147921A - Soldering method and soldering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To correctly and surely carry out the soldering without generating inconvenience such as defective insulation and degradation in the soldering to a member to be soldered. SOLUTION: A soldering device is provided with a soldering tank 1 in which molten solder B is stored, a work elevating/lowering unit 4 in which the transmission of vibration is shut-off and arranged to the soldering tank 1 and a member A to be soldered is immersed in the solder B by lowering the member A to be soldered from the upper part of the soldering tank 1 and a vibrator 3 which generates the vibration of a relatively low frequency and directly or indirectly applies the vibration only to the solder B stored in the soldering tank 1. Small waves are generated on the liquid level of the solder B when the member A to be soldered is immersed in the solder B.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention belongs to the technical field of soldering a member to be soldered, such as an electric or electronic component, by an immersion method.

[0002]

2. Description of the Related Art Generally, a so-called stationary type immersion method is employed for efficiently soldering a member to be soldered, such as an electric or electronic component. This static type immersion method includes a solder tank that stores molten solder, and a work elevating unit that lowers a member to be soldered from above the solder tank and immerses the member to be soldered in the solder. The device is used.

On the other hand, in the recent soldering of high-performance members to be soldered, such as electric and electronic components, in order to avoid the temperature and chemical influences at the time of soldering, the temperature of the molten solder is kept low. And fluxless, which does not use flux. In addition, in electrical and electronic components and the like that have been miniaturized and refined, a portion to be soldered has been miniaturized.

Accordingly, it has become difficult to solder accurately and reliably to a portion to be soldered of a member to be soldered, such as an electric or electronic component, by a static immersion method.

Conventionally, as a means for accurately and reliably soldering by a static immersion method, for example, it is known to apply ultrasonic waves to molten solder.

In this conventional means, cavitation is generated in the solder by the application of ultrasonic waves, and the shock pulse generated by the cavitation destroys the solder and the oxide film formed on the portion to be soldered of the member to be soldered. The solderability is improved by increasing the wettability of the solder.

[0007]

In the above-mentioned conventional means, since the ultrasonic wave has a high frequency, the solder is atomized and adheres to portions other than the portion to be soldered of the member to be soldered, and There is a problem that insulation failure occurs in the member. Further, there is a problem that the member to be soldered is easily deteriorated because the ultrasonic wave easily propagates to the surroundings.

The present invention has been made in consideration of the above problems, and a soldering method capable of accurately and reliably soldering a member to be soldered without causing insulation failure or deterioration. It is another object of the present invention to provide a soldering apparatus suitable for performing the soldering method.

[0009]

In order to solve the above-mentioned problems, a soldering method according to the present invention employs the following means.

That is, according to the first aspect of the present invention, there is provided a soldering method in which a member to be soldered is lowered from above a solder tank storing molten solder, and the member to be soldered is immersed in the solder for soldering. In addition, when the member to be soldered is immersed in the solder, a vibration having a relatively low frequency is applied to the solder to generate a minute wave on the liquid surface of the solder.

In this means, the wettability of the solder is enhanced by breaking the interfacial tension between the soldering target portion of the member to be soldered and the solder by the undulating force of the wave. The vibration having a relatively low frequency does not atomize the solder and does not transmit it to the member to be soldered.

Further, as described in claim 2, claim 1
In the soldering method, the frequency is set to 600 to 6000 per minute.
It is characterized by a pulse.

According to this means, a wave undulating force effective for soldering the terminal wire wound on the lead of the coil element can be obtained.

Further, in order to solve the above-mentioned problems, a soldering apparatus according to the present invention employs the following means.

That is, as described in claim 3, a solder tank for storing the molten solder, and a member to be soldered which is disposed so as to be interrupted from transmitting vibration to the solder tank, is lowered from above the solder tank. The apparatus includes a work elevating unit for dipping a member to be soldered in solder and a vibrator for generating vibration having a relatively low frequency to directly or indirectly apply vibration to the solder stored in the solder tank.

In this means, the vibration generated by the vibrator is applied to the solder, but the transmission of the vibration from the solder tank to the member to be soldered and the work lifting / lowering unit is prevented.

Further, as described in claim 4, claim 3
Is characterized in that a vibrator is connected to a slag scraper that scrapes and moves on a liquid surface of solder stored in a solder tank.

In this means, a slag scraper constantly in contact with the solder is used as a probe for applying vibration.

[0019]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a soldering method and apparatus according to the present invention.

FIG. 1 to FIG. 3 show an embodiment (1) of a soldering method and apparatus according to the present invention.

First, the configuration of an embodiment of a soldering apparatus according to the present invention will be described.

In this embodiment, a member A to be soldered composed of a coil element is soldered, and comprises a solder bath 1, a slag scraper 2, a vibrator 3, and a work lifting unit 4.

The solder tank 1 stores the molten solder B in a stationary state, and has an opening above the liquid level of the solder B as a soldering work space. The solder stored in the solder tank 1 is maintained at a constant temperature by a heating adjustment mechanism (not shown), and is maintained at a constant liquid level by a liquid level adjustment mechanism (not shown).

The slag scraper 2 scrapes and moves the liquid surface of the solder B stored in the solder tank 1 to scrape and remove an oxide film and impurities formed on the liquid surface of the solder B. , Scraping plate 2 supported by reciprocating scraping arm 21
2 is always in contact with the liquid surface of the solder B.

The vibrator 3 generates vibration of 600 to 6000 pulses per minute, which has a lower frequency than that of the ultrasonic wave. The main body 31 is disposed on the side of the slag scraper 2 where the scraping ends. The vibrator 32 is connected to the scraping arm 21 of the slag scraper 2 via a structure that allows reciprocation. That is, the slag scraper 2 is used as a probe for applying the vibrator 3. The vibrator 3 can freely select a vibrator that reciprocates by vibrating the vibrator 32 by switching the attraction of the magnet, a vibrator 32 that vibrates the vibrator 32 intermittently with a rotor, or the like.

The work lifting / lowering unit 4 includes a member A to be soldered.
And a holder for lifting and lowering the holder. The vibration transmission to the vibrator 3 and the solder tank 1 is cut off. The work elevating unit 4 raises and lowers the member A to be soldered in the soldering work space opened above the liquid level of the solder B stored in the solder tank 1, and the soldering target portion of the member A to be soldered. (Lead A
a, only the terminal wire Ab) can be immersed in the solder B.

Next, an embodiment of the soldering method according to the present invention will be described based on the operation and operation of the embodiment of the soldering apparatus according to the present invention.

The part to be soldered of the member A to be soldered is solder B
Before immersion, the slag scraper 2 scrapes and removes an oxide film and impurities formed on the liquid surface of the solder B. Then, the slag scraper 2 from which the scraping and removing operation has been completed is in a standby state on the side of the scraping ending position indicated by the solid line in FIG. 1, and the vibration is transmitted by the activated vibrator 3. This vibration is caused by the scraping arm 2 of the vibrator 3.
1, applied to the solder B via the scraping plate 22.

Thereafter, the work elevating unit 4 descends to the solder B on which the wave W is formed on the liquid surface by the application of the vibration, so that the portion to be soldered of the member A to be soldered is immersed.

In this immersion, as shown in FIGS. 2 and 3,
When the portions to be soldered (leads Aa, terminal wires Ab) of the member A to be soldered enter the solder B, the tension forming the interface C of the solder B, which should be originally formed in a funnel shape, is changed by the undulating force F of the wave W. Since the parts are broken, the parts to be soldered (leads Aa, terminal wires Ab) are surely immersed in the solder B. Then, since the wave W formed on the liquid surface of the solder B is minute, the liquid surface greatly fluctuates and the soldered member A
The soldering target portion (lead Aa, terminal wire Ab) is not immersed in the solder B more or less than necessary. As a result, the portion to be soldered of the member A to be soldered (lead A
a) The terminal wire Ab) is accurately and reliably soldered.

The wave W formed on the liquid surface of the solder B
Is small, but is not applied at a high frequency like conventional ultrasonic waves, so that the solder B is atomized and the portion of the member A to be soldered other than the portions to be soldered (lead Aa, terminal wire Ab) Does not cause insulation failure in the member A to be soldered, and does not cause deterioration of the member A to be soldered due to propagation of vibration. In particular, since the work lifting / lowering unit 4 is arranged so that the transmission of vibration to the vibrator 3 and the solder bath 1 is cut off, the deterioration of the member A to be soldered due to vibration is reliably prevented.

As shown in FIG. 2, the effective immersion length of the soldering target portion (lead Aa, terminal wire Ab) of the member A to be soldered from the interface C of the solder B, which should be originally formed in a funnel shape. Since the effective immersion length b according to the present invention is much longer than a, the lead Aa, which is a portion to be soldered of the member A to be soldered, can be reliably soldered even if the lead Aa is short.

The magnitude of the wave W formed by the above-described vibration at a frequency of 600 to 6000 pulses per minute is particularly effective when the lead Aa of the member A to be soldered is within several mm. It is valid.

FIG. 4 shows an embodiment (2) of a soldering method and apparatus according to the present invention.

In this embodiment, the application probe 5 is attached to the vibrator 32 of the vibrator 3, and the application probe 5 applies vibration to the solder B.

According to this embodiment, the same operation and effect as those of the above-described embodiment (1) are exerted except for the vibration applying path, and in addition, the timing of applying the vibration is controlled by the slag scraper 2 or the like. Can be freely controlled without being restricted by the above operation.

FIG. 5 shows an embodiment (3) of a soldering method and apparatus according to the present invention.

In this embodiment, the vibrator 32 of the vibrator 3 is connected to the solder tank 1.

According to this embodiment, the same operations and effects as those of the above-described embodiment (1) are obtained except for the vibration application path, and the installation and connection structure of the vibrator 3 are simplified. Can be

[0040]

As described above, the soldering method and apparatus according to the present invention improve the wettability of the solder by breaking the interfacial tension between the soldering target portion of the member to be soldered and the solder by the undulating force of the wave. Since the vibration having a relatively low frequency does not atomize the solder or transmit to the soldered member side, accurate and reliable without causing insulation failure and deterioration of the soldered member. Has the effect that it can be soldered.

[Brief description of the drawings]

FIG. 1 is a side view showing an embodiment (1) of a soldering method and apparatus according to the present invention.

FIG. 2 is an enlarged view of a main part in an operation state of FIG. 1;

FIG. 3 is an operation principle diagram of FIG. 2;

FIG. 4 is a side view showing an embodiment (2) of a soldering method and apparatus according to the present invention.

FIG. 5 is a side view showing an embodiment (3) of a soldering method and apparatus according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solder tank 2 Slag scraper 3 Vibrator 4 Work raising / lowering unit A Member to be soldered (coil element) B Solder W wave

Claims (4)

[Claims] 1. A soldering method in which a member to be soldered is lowered from above a solder tank storing molten solder, and the member to be soldered is immersed in solder and soldered. A method of applying a vibration having a relatively low frequency to the solder to generate a minute wave on the liquid surface of the solder. 2. The soldering method according to claim 1, wherein the frequency is 600 to 6000 pulses per minute. 3. A solder tank for storing molten solder, and a member to be soldered is arranged so as to be interrupted from transmitting vibration to the solder tank, and the member to be soldered is lowered from above the solder tank to immerse the member to be soldered in the solder. A soldering apparatus comprising: a work elevating unit; and a vibrator that generates vibration having a relatively low frequency and directly or indirectly applies vibration only to solder stored in a solder tank. 4. The soldering apparatus according to claim 3, wherein a vibrator is connected to a slag scraper that scrapes and moves on a liquid surface of the solder stored in the solder tank.